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A method of manufacturing a semiconductor substrate (7) includes the processes of: forming an insulation film (2) on a surface of a semiconductor substrate main body (1); forming an ion shield member (3) having a predetermined shape on the insulation film; implanting an ion into the semiconductor su

A method of manufacturing a semiconductor substrate (7) includes the processes of: forming an insulation film (2) on a surface of a semiconductor substrate main body (1); forming an ion shield member (3) having a predetermined shape on the insulation film; implanting an ion into the semiconductor substrate main body from a side on which the insulation film is formed, to thereby form an ion implantation layer (1a, 1b); removing the ion shield member; laminating the insulation film and a support substrate (5) onto each other; and separating the semiconductor substrate main body from the support substrate at a portion of the ion implantation layer.

대표청구항 ▼

1. A method of manufacturing a semiconductor substrate comprising the processes of:forming an insulation film on at least a surface of a semiconductor substrate main body; forming an ion shield member having a predetermined shape on said insulation film; subsequent to forming the insulation film, im

1. A method of manufacturing a semiconductor substrate comprising the processes of:forming an insulation film on at least a surface of a semiconductor substrate main body; forming an ion shield member having a predetermined shape on said insulation film; subsequent to forming the insulation film, implanting ions into said semiconductor substrate main body from a side on which said insulation film is formed, to thereby form an ion implantation layer; removing said ion shield member; cleaning or smoothing the surface of said insulation film; laminating said insulation film and a support substrate onto each other; and separating a portion of said semiconductor substrate main body from said support substrate along said ion implantation layer, wherein a shape of an outer edge of said ion shield member is tapered, and thereby said ion implantation layer is partly inclined in response to said tapered shape of the outer edge of said ion shield member, so as to prevent separation defect in remaining portion of the semiconductor substrate main body on said support substrate. 2. A method of manufacturing a semiconductor substrate according to claim 1, wherein the process of separating said portion of said semiconductor substrate main body along said ion implantation layer comprises the process of separating said portion of said semiconductor substrate main body at a peak position of an ion concentration in said ion implantation layer.3. A method of manufacturing a semiconductor substrate according to claim 1, wherein the process of forming said ion shield member comprises the processes of: forming an ion shield film made of a resist or an oxide film on said insulation film; and patterning said ion shield film to a predetermined shape to thereby form said ion shield member.4. A method of manufacturing a semiconductor substrate according to claim 1, wherein a thermally conductive film is buried in the support substrate used in the laminating process.5. A method of manufacturing a semiconductor substrate for an electro-optical apparatus, comprising the processes of:forming an insulation film on a surface of a semiconductor substrate main body; forming an ion shield member having a predetermined shape on said insulation film; subsequent to forming the insulation film, implanting ions into said semiconductor substrate main body from a side on which said insulation film is formed, to thereby form an ion implantation layer; removing said ion shield member; cleaning or smoothing the surface of said insulation film; laminating said insulation film and a support substrate onto each other; and separating a portion of said semiconductor substrate main body from said support substrate along said ion implantation layer in a condition that a thickness of a first remaining portion of the semiconductor substrate main body that is designed to form a drive circuit of the electro-optical apparatus is thick and a thickness of a second remaining portion of the semiconductor substrate main body that is designed to form an image display region of the electro-optical apparatus is thinner, wherein a shape of an outer edge of said ion shield member is tapered, and thereby said ion implantation layer is partly inclined in response to said tapered shape of the outer edge of said ion shield member, so as to prevent separation defect in the first and second remaining portions of said semiconductor substrate main body on said support substrate.