초록 ▼

The present invention relates to chemical compositions and methods of use for cleaning CMP equipment, including the interiors of delivery conduits caring CMP slurry to the necessary sites. The chemical compositions of the present invention are also useful for post-CMP cleaning of the wafer itself. T

The present invention relates to chemical compositions and methods of use for cleaning CMP equipment, including the interiors of delivery conduits caring CMP slurry to the necessary sites. The chemical compositions of the present invention are also useful for post-CMP cleaning of the wafer itself. Three classes of cleaning compositions are described, all of which are aqueous solutions. One class operates in a preferable pH range from about 11 to about 12 and preferably contains one or more non-ionic surfactants, one or more simple amines, a surfactant or sticking agent, such as one or more soluble dialcohol organic compounds, and one or more quaternary amines. A second class of cleaning composition operates in a preferable pH range of approximately 8.5 and contains one or more of citric acid, lactic acid, and oxalic acid. A third class of compositions is acidic, having a preferable pH range from about 1.5 to about 3, preferably containing at least one oxidizing acid, at least one chelating agent, at least one sticking agent and at least one anionic surfactant. HF and KOH are substantially absent from the preferred compositions of the present invention. Some compositions of the present invention are shown to be advantageously used for cleaning the slurry distribution system of CMP apparatus.

대표청구항 ▼

1. A composition for removing chemical-mechanical planarization residue, consisting essentially of comprising:an aqueous solution comprising: at least one non-ionic surfactant; at least one simple amine; at least one sticking agent selected from a group consisting of a dialcohol organic compound, pr

1. A composition for removing chemical-mechanical planarization residue, consisting essentially of comprising:an aqueous solution comprising: at least one non-ionic surfactant; at least one simple amine; at least one sticking agent selected from a group consisting of a dialcohol organic compound, propylene glycol, polyethylene oxide, polypropylene oxide, and any mixture thereof; and at least one quaternary amine; the composition substantially free of a compound capable of releasing potassium ions. 2. A composition as in claim 1 wherein HF and KOH are substantially absent.3. A composition as in claim 1 wherein said at least one non-ionic surfactant is selected from a group consisting of a monohydroxyl compound, a dihydroxyl compound, and any mixture thereof.4. A composition as in claim 3 wherein said at least one non-ionic surfactant is 3,5-dimethyl 1-hexyn-3-ol.5. A composition as in claim 1 wherein said at least one simple amine has from 1 to about 8 carbon atoms.6. A composition as in claim 5 wherein said at least one simple amine has from 1 to 6 carbon atoms.7. A composition as in claim 5 wherein said at least one simple amine has hydroxyl functionality.8. A composition as in claim 7 wherein said at least one simple amine is monoethanolamine.9. A composition as in claim 1 wherein said at least one sticking agent is ethylene glycol.10. A composition as in claim 1 wherein said at least one quaternary amine is tetramethylammonium hydroxide.11. A composition as in claim 1 having a pH is from about 10 to about 12.5.12. A composition as in claim 1 having a pH is from about 11 to about 12.