A thermoelectric semiconductor module (10) includes a plurality of semiconductor pellets (14, 18) having Peltier characteristics are mechanically interconnected and arranged in an electrical series circuit with heat transferring means (12, 16, 20) with all interconnections being directly made. The m
A thermoelectric semiconductor module (10) includes a plurality of semiconductor pellets (14, 18) having Peltier characteristics are mechanically interconnected and arranged in an electrical series circuit with heat transferring means (12, 16, 20) with all interconnections being directly made. The means (12, 16, 20) can be of platelike construction with an L-shaped cross-section or, alternatively, with a U-shaped cross-section. A large number of modules (10) can be arranged in a two-dimensional or three-dimensional stack (30) with adjacent lines or planes of modules electrically interrelated by end segment connectors (32). In a further version, one side of a modular plane has heat exchanger fins (44-50) while the other side is electrically connected by ceramic segments (58) with deposited conductors (56). In yet another version, the modules are mounted onto rotating discs (94, 96) so as to act as a fluid impeller moving therepast enhancing thermal efficiency.
대표청구항▼
1. A thermoelectric couple comprising:a quantity of p-type thermoelectric semiconductor material; a quantity of n-type thermoelectric semiconductor material; first, second and third one-piece heat transferring structures constructed of a good electrical and heat conducting material; first means for
1. A thermoelectric couple comprising:a quantity of p-type thermoelectric semiconductor material; a quantity of n-type thermoelectric semiconductor material; first, second and third one-piece heat transferring structures constructed of a good electrical and heat conducting material; first means for directly contacting and electrically connecting the first heat transferring structure to the quantity of p-type semiconductor material; second means for directly contacting and electrically connecting the quantity of p-type material to the second heat transferring structure; third means for directly contacting and electrically connecting the quantity of n-type material to the second heat transferring structure; fourth means for directly contacting and electrically connecting the quantity of n-type material to the third heat transferring structure; and non-electrically conducting plate means with openings for receiving the respective heat transferring structures therein and positioning said plate means closely adjacent the thermoelectric semiconductor material quantities. 2. A thermoelectric couple as in claim 1, in which a first plate means is received onto the first and third heat transferring structures and a second plate means is received onto the second heat transferring structure, said first and second plate means being separated by a space including the p-type and n-type thermoelectric materials.3. A thermoelectric couple as in claim 2, in which means are received between outer edge portions of the first and second plate means for sealing the space therebetween against ingress and egress of ambient fluids.4. A thermoelectric couple as in claim 1, in which the plate means are constructed of a material selected from the list of polymers, glass fibers, and linen.5. A thermoelectric couple as in claim 1, in which the plate means are constructed of a synthetic plastic material extruded in place about the heat transferring structures.6. A thermoelectric couple as in claim 1, in which a single plate means is received onto heat transferring structures extending from a first side only of the thermoelectric quantities, and means are provided for sealing the plate mans to heat transferring structures from other sides of the thermoelectric quantities.7. A thermoelectric couple arrangement, comprising: a plurality of complementary thermoelectric semiconductor pellets serially interconnected with separating heat transferring means arranged in a curved configuration;a pair of discs having facing major surfaces spaced apart and aligned; a plurality of supports provided on each of the facing surfaces of the discs, the interconnected pellets and heat transferring means being unitarily mounted to the supports; and means for rotating discs and mounted pellets and heat transferring means for inducing ambient fluid flow past the pellets and heat transferring means. 8. A thermoelectric couple arrangement as in claim 7, in which adjacent heat transfering means are spaced from one another and on assembly a support fits in between adjacent heat transferring means.9. A thermoelectric couple arrangement as in claim 8, in which the pellets are arranged in spaced apart relation along the curve; and an insulative foam is located in the spaces between adjacent pellets providing rigidity and preventing ambient air flow between adjacent pellets.10. A thermoelectric couple arrangement as in claim 7, in which first inlet and outlet conduits are provided for directing ambient air across those parts of the pellets and those heat transferring means conditioning ambient air; and second inlet and outlet conduits for directing ambient air across those parts of the pellets and those heat transferring means handling waste heat.11. A thermoelectric couple arrangement, comprising:a plurality of thermoelectric semiconductor pellets serially interconnected with individual heat transferring means arranged in a generally linear configuration; a pair of base means having major surfaces spaced apart and aligned; a plurality of spacers mounted in spaced apart relation on oppositely directed major surfaces of the base means in a linear configuration conforming to that of the pellets; slotted openings formed in the base means between adjacent apacers dimensioned to receive the heat transferring means therethrough and with the pellets being located between said pair of base means; and means for moving the base means, pellets, heat transferring means and spacers with respect to the ambient. 12. A thermoelectric couple arrangement as in claim 11, in which each spacer includes first and second slotted edge walls on opposite edge portions of the spacer for receiving heat transferring means therein.13. A thermoelectric couple arrangement as in claim 12, in which the spacers are base means are and unitarily molded.14. A thermoelectric couple arrangement as in claim 11, in which the pellets and heat transferring means are arranged in a curved path.15. A thermoelectric couple arrangement as in claim 11, in which the base means include first and second discs mounted for rotation about a common axis.
Akei, Masao; Ignatiev, Kirill M; Jayanth, Nagaraj; Pham, Hung M; Caillat, Jean-Luc M, Vapor compression circuit and method including a thermoelectric device.
Akei, Masao; Ignatiev, Kirill; Jayanth, Nagaraj; Pham, Hung M.; Caillat, Jean-Luc M., Vapor compression circuit and method including a thermoelectric device.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.