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Multi-chamber carrier head with a flexible membrane 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-029/00
출원번호 US-0712389 (2000-11-13)
발명자 / 주소
  • Chen, Hung Chih
  • Zuniga, Steven M.
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Fish &
인용정보 피인용 횟수 : 45  인용 특허 : 39

초록

A carrier head that has a base assembly and a flexible membrane. The flexible membrane has a generally circular main portion with a lower surface that provides a substrate-mounting surface and a plurality of concentric annular portions extending from the main portion and secured to the base assembly

대표청구항

1. A carrier head, comprising:a housing to be secured to a drive shaft; a base assembly; a loading chamber controlling the position of the base assembly relative to the housing; a flexible membrane having a generally circular main portion with a lower surface that provides a substrate-mounting surfa

이 특허에 인용된 특허 (39)

  1. Nakashiba Masamichi,JPX ; Kimura Norio,JPX ; Watanabe Isamu,JPX ; Yoshida Kaori,JPX, Apparatus for and method for polishing workpiece.
  2. Lee Lawrence L., Apparatus for chemical mechanical polishing.
  3. Hasegawa Fumihiko,JPX ; Kobayashi Makoto,JPX ; Suzuki Fumio,JPX, Apparatus for mirror-polishing thin plate.
  4. Arai Hatsuyuki,JPX, Carrier and polishing apparatus.
  5. Zuniga Steven M. ; Blumenkranz Stephen J., Carrier head design for a chemical mechanical polishing apparatus.
  6. Zuniga Steven ; Chen Hung, Carrier head for chemical mechanical polishing.
  7. Zuniga Steven ; Chen Hung ; Birang Manoocher, Carrier head for chemical mechanical polishing a substrate.
  8. Chen Hung ; Zuniga Steven M., Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus.
  9. Perlov Ilya ; Gantvarg Eugene ; Ko Sen-Hou, Carrier head with a flexible membrane for a chemical mechanical polishing system.
  10. Govzman Boris ; Zuniga Steven M. ; Chen Hung ; Somekh Sasson, Carrier head with a substrate detection mechanism for a chemical mechanical polishing system.
  11. Steven M. Zuniga, Carrier head with controllable pressure and loading area for chemical mechanical polishing.
  12. Chen Hung Chih ; Zuniga Steven M. ; Bose Frank, Carrier head with pressurizable bladder.
  13. Shendon Norman (San Carlos CA), Chemical mechanical polishing apparatus with improved carrier and method of use.
  14. Shendon Norm (San Carlos CA), Chemical mechanical polishing apparatus with improved polishing control.
  15. Tolles Robert D. ; Shendon Norm ; Somekh Sasson ; Perlov Ilya ; Gantvarg Eugene ; Lee Harry Q., Continuous processing system for chemical mechanical polishing.
  16. Bukhman Yefim (Scottsdale AZ), Distributed polishing head.
  17. Lansford Jeremy ; Evans Allen L., Feedback control of deposition thickness based on polish planarization.
  18. Hoshizaki Jon A. ; Williams Roger O. ; Buhler James D. ; Reichel Charles A. ; Hollywood William K. ; de Geus Richard ; Lee Lawrence L., Method for chemical mechanical polishing.
  19. Kitta Satoru (Nagano JPX), Method for lapping a wafer material and an apparatus therefor.
  20. Banks Edward L. (Willingboro Township ; Burlington County NJ), Methods and apparatus for polishing a semiconductor wafer.
  21. Jackson Paul David (Scottsdale AZ) Schultz Stephen Charles (Gilbert AZ), Pneumatic polishing head for CMP apparatus.
  22. Hirose Masayoshi (Tokyo JPX) Tsujimura Manabu (Tokyo JPX) Ishikawa Seiji (Tokyo JPX) Kimura Norio (Tokyo JPX) Ishii You (Tokyo JPX), Polishing apparatus.
  23. Tanaka Kouichi (Takasaki JPX) Uchiyama Isao (Nishigo JPX), Polishing apparatus.
  24. Nakajima Makoto (Nagano JPX), Polishing machine.
  25. Lansford Jeremy, Reduced variation in interconnect resistance using run-to-run control of chemical-mechanical polishing during semiconductor fabrication.
  26. Volodarsky Konstantine (San Francisco CA) Kajiwara Jiro (Foster City CA) Owens ; Jr. Herbert W. (San Jose CA) King Jan H. (Sunnyvale CA), Rotary union for coupling fluids in a wafer polishing apparatus.
  27. Koeth Joe E. (Mesa AZ) Hoffman Melvin J. (Scottsdale AZ) Jackson Paul D. (Scottsdale AZ), Semiconductor wafer carrier and method.
  28. Barns Chris E. ; Charif Malek ; Lefton Kenneth D. ; Mitchel Fred E., Semiconductor wafer polishing apparatus with a flexible carrier plate.
  29. Mitchel Fred E. ; Adams John A. ; Bibby Thomas Frederick A., Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head.
  30. Olmstead Dennis L. (Sherman TX), Semiconductor wafer polishing using a hydrostatic medium.
  31. Prince John, Substrate retaining ring.
  32. Strasbaugh Alan (825 Buckley Rd. San Luis Obispo CA 93401), Wafer carrier for film planarization.
  33. Shendon Norm (San Carlos CA) Struven Kenneth C. (San Carlos CA) Kolenkow Robert J. (Berkeley CA), Wafer polisher head having floating retainer ring.
  34. Kobayashi Hiroyuki (Omiya JPX) Miyairi Hiroo (Omiya JPX) Endo Osamu (Omiya JPX), Wafer polishing apparatus.
  35. Volodarsky Konstantin ; Weldon David E., Wafer polishing head.
  36. Karlsrud Chris E. (Chandler AZ) Van Woerkom Anthony G. (Chandler AZ) Odagiri Shigeru (Yokohama JPX) Nagahashi Isao (Fujisawa AZ JPX) Preston Spencer (Chandler AZ), Wafer polishing method and apparatus.
  37. Strasbaugh Alan (825 Buckley Rd. San Luis Obispo CA 93401), Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied.
  38. Korovin, Nikolay N.; Schultz, Stephen C.; Herb, John D.; Farmer, James L., Workpiece carrier with adjustable pressure zones and barriers.
  39. Nikolay N. Korovin ; Stephen C. Schultz ; John D. Herb ; James L. Farmer, Workpiece carrier with adjustable pressure zones and barriers.

이 특허를 인용한 특허 (45)

  1. Manens, Antoine P.; Liu, Feng Q; Butterfield, Paul D.; Duboust, Alain; Mavliev, Rashid, Biased retaining ring.
  2. Chen, Hui; Zuniga, Steven M.; Chen, Hung Chih; Lau, Eric; Sin, Garrett Ho Yee; Chang, Shou-Sung, Carrier for small pad for chemical mechanical polishing.
  3. Paik, Young J.; Bhatnagar, Ashish; Narendrnath, Kadthala Ramaya, Carrier head membrane.
  4. Paik, Young J.; Bhatnagar, Ashish; Narendrnath, Kadthala Ramaya, Carrier head membrane roughness to control polishing rate.
  5. Gajendra, Manoj A.; Giriyapura, Kiran, Carrier head with composite plastic portions.
  6. Zuniga, Steven M.; Nagengast, Andrew J.; Oh, Jeonghoon, Carrier head with retaining ring and carrier ring.
  7. Zuniga, Steven M.; Nagengast, Andrew J.; Oh, Jeonghoon, Carrier head with retaining ring and carrier ring.
  8. Zuniga, Steven M.; Nagengast, Andrew J.; Oh, Jeonghoon, Carrier ring for carrier head.
  9. Bennett,Doyle E; David,Jeffrey Drue; Birang,Manoocher; Zhang,Jimin; Swedek,Boguslaw A, Chemical mechanical polishing control system and method.
  10. David,Jeffrey Drue; Roover,Dirk De; Zhang,Jimin; Swedek,Boguslaw A.; Bennett,Doyle E.; Birang,Manoocher, Chemical mechanical polishing with multi-stage monitoring of metal clearing.
  11. Basol,Bulent M.; Ashjaee,Jalal; Volodarsky,Konstantin, Constant low force wafer carrier for electrochemical mechanical processing and chemical mechanical polishing.
  12. Fukushima, Makoto; Yasuda, Hozumi; Nabeya, Osamu; Togashi, Shingo, Elastic membrane and substrate holding apparatus.
  13. Fukushima, Makoto; Yasuda, Hozumi; Nabeya, Osamu; Watanabe, Katsuhide; Namiki, Keisuke, Elastic membrane for semiconductor wafer polishing.
  14. Fukushima, Makoto; Yasuda, Hozumi; Nabeya, Osamu; Watanabe, Katsuhide; Namiki, Keisuke, Elastic membrane for semiconductor wafer polishing.
  15. Oh, Jeonghoon; Nagengast, Andrew; Zuniga, Steven M.; Chen, Hung Chih, Fast substrate loading on polishing head without membrane inflation step.
  16. Zuniga, Steven M.; Nagengast, Andrew J.; Oh, Jeonghoon, Flexible membrane for carrier head.
  17. Zuniga, Steven M.; Nagengast, Andrew J.; Oh, Jeonghoon, Flexible membrane for carrier head.
  18. Son, Jun Ho, Membrane assembly and carrier head having the membrane assembly.
  19. Oh, Jeonghoon; Siu, Tsz-Sin; Chen, Hung Chih; Nagengast, Andrew J.; Zuniga, Steven M.; Brezoczky, Thomas B., Multi-chamber carrier head with a textured membrane.
  20. Oh, Jeonghoon; Siu, Tsz-Sin; Chen, Hung Chih; Nagengast, Andrew J.; Zuniga, Steven M.; Brezoczky, Thomas B., Multi-chamber carrier head with a textured membrane.
  21. Duboust, Alain; Chang, Shou-Sung; Lu, Wei; Neo, Siew; Wang, Yan; Manens, Antoine P.; Moon, Yongsik, Multi-layer polishing pad for low-pressure polishing.
  22. Chen, Hung Chih; Oh, Jeonghoon; Siu, Tsz-Sin; Brezoczky, Thomas B.; Zuniga, Steven M., Multiple zone carrier head with flexible membrane.
  23. Chen, Hung Chih; Oh, Jeonghoon; Siu, Tsz-Sin; Brezoczky, Thomas; Zuniga, Steven M., Multiple zone carrier head with flexible membrane.
  24. Chen,Hung Chih; Oh,Jeonghoon; Siu,Tsz Sin; Brezoczky,Thomas; Zuniga,Steven M., Multiple zone carrier head with flexible membrane.
  25. Mavliev,Rashid A.; Yavelberg,Simon; Alonzo,Gerald J., Pad characterization tool.
  26. David,Jeffrey Drue, Platen and head rotation rates for monitoring chemical mechanical polishing.
  27. Nabeya, Osamu; Togawa, Tetsuji; Fukushima, Makoto; Yasuda, Hozumi, Polishing apparatus.
  28. Nabeya, Osamu; Togawa, Tetsuji; Fukushima, Makoto; Yasuda, Hozumi, Polishing apparatus.
  29. Nabeya, Osamu; Togawa, Tetsuji; Fukushima, Makoto; Yasuda, Hozumi, Polishing apparatus.
  30. Chen, Hung Chih; Hsu, Samuel Chu-Chiang; Dandavate, Gautam Shashank; Koosau, Denis M., Polishing head zone boundary smoothing.
  31. Chen, Hung Chih; Hsu, Samuel Chu-Chiang; Dandavate, Gautam Shashank; Koosau, Denis M., Polishing head zone boundary smoothing.
  32. Oh, Jeonghoon; Zuniga, Steven M.; Nagengast, Andrew J.; Hsu, Samuel Chu-Chiang; Dandavate, Gautam Shashank, Retaining ring having inner surfaces with facets.
  33. Manens,Antoine P.; Shrauti,Suresh; Duboust,Alain; Wang,Yan; Chen,Liang Yuh, Retaining ring with conductive portion.
  34. Zuniga, Steven M.; Nagengast, Andrew J.; Oh, Jeonghoon, Retaining ring, flexible membrane for applying load to a retaining ring, and retaining ring assembly.
  35. Togawa, Tetsuji; Yoshida, Hiroshi; Nabeya, Osamu; Fukushima, Makoto; Fukaya, Koichi, Substrate holding apparatus and polishing apparatus.
  36. Togawa, Tetsuji; Yoshida, Hiroshi; Nabeya, Osamu; Fukushima, Makoto; Fukaya, Koichi, Substrate holding apparatus and polishing apparatus.
  37. Yasuda, Hozumi; Togawa, Tetsuji; Nabeya, Osamu; Saito, Kenichiro; Fukushima, Makoto; Inoue, Tomoshi, Substrate holding apparatus, polishing apparatus, and polishing method.
  38. Yasuda, Hozumi; Togawa, Tetsuji; Nabeya, Osamu; Saito, Kenichiro; Fukushima, Makoto; Inoue, Tomoshi, Substrate holding apparatus, polishing apparatus, and polishing method.
  39. Yasuda, Hozumi; Togawa, Tetsuji; Nabeya, Osamu; Saito, Kenichiro; Fukushima, Makoto; Inoue, Tomoshi, Substrate holding apparatus, polishing apparatus, and polishing method.
  40. Togawa, Tetsuji; Yoshida, Hiroshi; Nabeya, Osamu; Fukushima, Makoto; Fukaya, Koichi, Substrate holding device and polishing apparatus.
  41. Katsuoka, Seiji; Sekimoto, Masahiko; Kunisawa, Junji; Miyazaki, Mitsuru; Watanabe, Teruyuki; Kobayashi, Kenichi; Kumekawa, Masayuki; Yokoyama, Toshio, Substrate polishing apparatus and method.
  42. Chen,Hung Chih; Zuniga,Steven M.; Siu,Tsz Sin, Substrate removal from polishing tool.
  43. Oh, Jeonghoon; Siu, Tsz-Sin; Chen, Hung Chih; Nagengast, Andrew J.; Zuniga, Steven M.; Brezoczky, Thomas B., Textured membrane for a multi-chamber carrier head.
  44. Korovin,Nikolay N.; Schultz,Stephen C.; Herb,John D.; Farmer,James L., Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece.
  45. Korovin,Nikolay N.; Schultz,Stephen C.; Herb,John D.; Farmer,James L., Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece.
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