IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0155050
(2002-05-24)
|
발명자
/ 주소 |
- Sawyer, Michael
- Kusz, Matthew J.
- Gustine, Gary
- Ham, Charles G.
- Daniels, Fredrick A.
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
11 인용 특허 :
60 |
초록
▼
A housing for circuit cards is provided. The housing has a shell. A thermally conductive liner integral with the shell lines an interior of the shell. A protrusion of the liner extends through the shell and contacts the shell to form a pressure seal between the liner and the shell. A heat sink is di
A housing for circuit cards is provided. The housing has a shell. A thermally conductive liner integral with the shell lines an interior of the shell. A protrusion of the liner extends through the shell and contacts the shell to form a pressure seal between the liner and the shell. A heat sink is disposed on an exterior surface of the shell and is thermally coupled to the protrusion of the liner. A case is disposed within the liner and is thermally coupled to the liner. The case is adapted to receive a plurality of circuit cards so that the plurality of circuit cards is thermally coupled to the case.
대표청구항
▼
1. A housing for circuit cards, comprising:a shell; a thermally conductive liner integral with the shell and lining an interior of the shell, a protrusion of the liner extending through the shell and contacting the shell to form a pressure seal between the liner and the shell; a heat sink disposed o
1. A housing for circuit cards, comprising:a shell; a thermally conductive liner integral with the shell and lining an interior of the shell, a protrusion of the liner extending through the shell and contacting the shell to form a pressure seal between the liner and the shell; a heat sink disposed on an exterior surface of the shell and thermally coupled to the protrusion of the liner; and a case disposed within the liner and thermally coupled to the liner, the case adapted to receive a plurality of circuit cards so that the plurality of circuit cards is thermally coupled to the case. 2. The housing of claim 1, further comprising first and second opposing covers adapted to selectively close the shell.3. The housing of claim 1, further comprising first and second opposing covers adapted to selectively seal the shell against at least one of the weather and a pressure differential.4. The housing of claim 1, wherein the shell extends into slots in a perimeter of the protrusion to form the pressure seal between the liner and the shell.5. The housing of claim 1, wherein the heat sink includes a plurality of fins.6. The housing of claim 1, wherein the case comprises a plurality of slots adapted to respectively receive the plurality of circuit cards therein.7. The housing of claim 1, wherein the case is in direct contact with the liner.8. The housing of claim 1, wherein the heat sink is in direct contact with the protrusion of the liner.9. The housing of claim 1, further comprising a seal disposed between the heat sink and the exterior surface of the shell around the perimeter of the protrusion of the liner for sealing against at least one of a pressure differential and the weather.10. The housing of claim 1, wherein the pressure seal between the liner and the shell also seals against weather.11. The housing of claim 1, wherein the heat sink includes one or more seals disposed between the heat sink and the protrusion for sealing against at least one of a pressure differential and the weather.12. A housing for circuit cards comprising:a shell having at least two compartments; at least two thermally conductive liners integral with the shell and respectively lining the at least two compartments, each of the at least two liners having a protrusion extending through the shell, the protrusion contacting the shell to form a pressure seal between the respective liner and the shell; at least two cases respectively disposed in each of the at least two liners and thermally coupled thereto, each of the at least two cases having a plurality of slots, each slot adapted to receive each of a plurality of circuit cards so that each of the plurality of circuit cards is thermally coupled to the respective case; and a heat sink disposed on an exterior surface of the shell and thermally coupled to the protrusion of each of the at least two liners. 13. The housing of claim 12, wherein the shell extends into slots in a perimeter of the protrusion of each of the at least two liners to form the pressure seal between the respective liner and the shell.14. The housing of claim 12, wherein the heat sink includes a plurality of fins.15. The housing of claim 12, wherein each of the at least two cases is respectively in direct contact with each of the at least two liners.16. The housing of claim 12, wherein the heat sink is in direct contact with the protrusion of each of the at least two liners.17. The housing of claim 12, further comprising at least two first covers each adapted to respectively selectively close each of at least two apertures respectively of the at least two compartments.18. The housing of claim 17, further comprising a second cover adapted to selectively close an aperture of the shell located opposite each of the at least two apertures respectively of the at least two compartments.19. The housing of claim 18, wherein the at least two first covers and the second cover selectively seal the shell against at least one of the weather and a pressure differential.20. The housing of claim 12, wherein the pressure seal between the respective liner and the shell also seals against weather.21. A housing for circuit cards comprising:a shell having two sidewalls in opposition, two end walls in opposition, and two compartments; two thermally conductive liners integral with the shell and respectively lining the two compartments, each of the two liners having two first protrusions respectively extending through the two side walls and a second protrusion extending through one of the two end walls, each of the two first protrusions and the second protrusion of each of the two liners contacting the shell to form a pressure seal between the respective liner and the shell; two cases respectively disposed in each of the two liners and thermally coupled thereto, each of the two cases having a plurality of slots, each slot adapted to receive each of a plurality of circuit cards so that each of the plurality of circuit cards are thermally coupled to the respective case; a first heat sink disposed on each of the two sidewalls and thermally coupled to one of the two first protrusions of each of the two liners; and a second heat sink disposed on each of the two end walls and thermally coupled to the second protrusion of each of the two liners. 22. The housing of claim 21, wherein the shell extends into slots in a perimeter of each of the two first protrusions and the second protrusion of each of the two liners to form the pressure seal between the respective liner and the shell.23. The housing of claim 21, wherein the first and second heat sinks include a plurality of fins.24. The housing of claim 21, further comprising two first covers each adapted to respectively selectively close each of two apertures respectively of the two compartments.25. The housing of claim 24, further comprising a second cover adapted to selectively close an aperture of the shell located opposite each of the two apertures respectively of the at least two compartments.26. The housing of claim 25, wherein the two first covers and the second cover selectively seal the shell against at least one of the weather and a pressure differential.27. The housing of claim 21, wherein the first heat sink comprises one first heat sink thermally coupled one of the two first protrusions of one of the two liners and another first heat sink thermally coupled one of the two first protrusions of another of the two liners.28. A method for transferring heat from a circuit card, the method comprising:conducting heat from the circuit card to a case adapted to contain the circuit card; conducting the heat from the case to a liner that contains the case, wherein the liner lines an interior of a housing and is integral with the housing, wherein a protrusion of the liner extends through the housing to an exterior of the housing and contacts the housing to form a pressure seal between the liner and the housing; and conducting the heat through the protrusion to a heat sink disposed on the exterior of the housing. 29. The method of claim 28, further comprising transferring the heat from the heat sink to an environment surrounding the housing.30. The method of claim 28, wherein conducting heat from the circuit card to a case adapted to contain the circuit card comprises conducting heat from each of a plurality of circuit cards respectively contained in slots of a case.31. The method of claim 28, wherein conducting the heat through the protrusion to a heat sink comprises conducting the heat through the protrusion to a heat sink having a plurality of fins.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.