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Apparatus, method and system of liquid-based, wide range, fast response temperature control of electric devices

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F24H-001/10
출원번호 US-0224571 (2002-08-21)
발명자 / 주소
  • Malinoski, Mark F.
  • Jones, Thomas P.
  • Annis, Brian
  • Turner, Jonathan E.
출원인 / 주소
  • Delta Design, Inc.
대리인 / 주소
    Foley &
인용정보 피인용 횟수 : 10  인용 특허 : 47

초록

An active temperature control system for a DUT utilizes a heat sink containing HFE7100 liquid and an electric heater. The liquid is cooled below the set point and the heater is used to bring the DUT up to the set point. Set points in the range of ?10 degrees C. to +110 degrees C. can be achieved. Th

대표청구항

1. An apparatus for controlling a temperature of a semiconductor device, the apparatus comprising:a plurality of heat exchangers provided at a corresponding plurality of regions on the semiconductor device; and a temperature control system, coupled to said plurality of heat exchangers, for controlli

이 특허에 인용된 특허 (47)

  1. DiBattista, Larry; Malinoski, Mark; Shitara, Tomoya, Apparatus and method for temperature control of IC device during test.
  2. Smith Nathan R. (Stillwater MN) Schmitt Steven E. (Stillwater MN), Apparatus for handling devices under varying temperatures.
  3. Smith Nathan R. (Stillwater MN) Schmitt Steven E. (Stillwater MN), Apparatus for handling devices under varying temperatures.
  4. Lipp Robert J. (15881 Rose Ave. Los Gatos CA 95030), Apparatus for heating and controlling temperature in an integrated circuit chip.
  5. Henderson G. Douglas (Orlando FL), Apparatus for heating and cooling devices under test.
  6. Jones Elmer R. (North Reading MA), Burn-in module.
  7. Jones Elmer R. (North Reading MA), Burn-in tower.
  8. Fu Deng-Yuan (Sunnyvale CA), Computer-implemented method and system for precise temperature control of a device under test.
  9. Horiuchi Akinori (Tokyo JPX) Binnaka Toshio (Kawasaki JPX) Maruyama Shigeyuki (Yokohama JPX), Device for testing semiconductor devices at a high temperature.
  10. Lewis David A. (Carmel NY) Narayan Chandrasekhar (Hopewell Junction NY), Device to monitor and control the temperature of electronic chips to enhance reliability.
  11. Bailey David F. (9921 Kenda Dr. Riverview FL 33569), Dynamic temperature control for use with a heating and/or cooling system including at least one temperature sensor.
  12. Miyata Eiji (Fuchu JPX) Sugiyama Masahiko (Nirasaki JPX) Kohno Masahiko (Yamanashi JPX) Hatta Masataka (Yamanashi JPX), Electric probing-test machine having a cooling system.
  13. Donovan William J. (San Bernardino CA) Sanford George G. (Los Angeles CA), Electrical test apparatus.
  14. Babock James Wittman ; Tustaniwskyi Jerry Ihor, Electro-mechnical subassembly having a greatly reduced thermal resistance between two mating faces by including a film.
  15. Kenny John D. (Sunnyvale CA) Lei Emilia V. (Union City CA), Heat regulator for integrated circuits.
  16. Burlison Phillip D. (Morgan Hill CA) DeHaven William R. (Los Altos CA) Pogrebinsky Victor (San Jose CA), High speed IDDQ monitor circuit.
  17. Kiyokawa Toshiyuki (Kitakatsushika JPX) Hayama Hisao (Gyoda JPX), IC test equipment.
  18. Kiyokawa Toshiyuki (Kitakatsushika JPX) Igarashi Noriyuki (Gyoda JPX) Hayama Hisao (Gyoda JPX), IC test equipment.
  19. Hirano Masashi (Tokyo JPX), LSI with built-in test circuit and testing method therefor.
  20. Pickering John R. (Alderford GBX), Method and apparatus for conditioning an electronic component having a characteristic subject to variation with temperat.
  21. Takamine Henry (Gardena CA), Method and apparatus for determination of junction-to-case thermal resistance for a hybrid circuit element.
  22. Taraci Richard (Phoenix AZ) Taraci Brian (Laguna Niguel CA) Gorgenyi Imre (Scottsdale AZ), Method and apparatus for maintaining electrically operating device temperatures.
  23. Taraci Richard (Phoenix AZ) Taraci Brian (Laguna Niguel CA) Gorgenyi Imre (Scottsdale AZ), Method and apparatus for maintaining electrically operating device temperatures.
  24. Schinabeck John (Pleasanton CA), Method and apparatus for monitoring automated testing of electronic circuits.
  25. Canella Robert L. (Meridian ID), Method and apparatus for positioning a workpiece.
  26. Hashinaga Tatsuya (Yokohama JPX) Nishiguchi Masanori (Yokohama JPX), Method and apparatus for varying temperature and electronic load conditions of a semiconductor device in a burn-in test.
  27. Farwell William D. (Thousand Oaks CA) Henson Bradley S. (Lakewood CA), Method for self regulating CMOS digital microcircuit burn-in without ovens.
  28. Miller Vernon R. (Atlanta GA) Roberts Lincoln E. (Decatur GA), Microelectronic burn-in system.
  29. Eager George (Cambridge MA) Schey Thomas J. (Woonsocket RI) Selverstone Peter (Cambridge MA), Mixing valve air source.
  30. Rignall Michael W. (Dursley GB3), Oven for the burn-in of integrated circuits.
  31. Itoyama Taketoshi (Tokorozawa JPX) Abe Yuichi (Tokyo JPX) Yamaguchi Masao (Tokyo JPX), Probe apparatus and burn-in apparatus.
  32. Ahmad Aftab (Boise ID) Weber Larren G. (Caldwell ID) Green Robert S. (Boise ID), Semiconductor array having built-in test circuit for wafer level testing.
  33. Goto Masaharu (Hanno CO JPX) Koerner Christopher (Fort Collins CO), System and method for dynamic power compensation.
  34. Witkin Donald E. (Warren PA) Bowles Arnold G. (Warren PA), Temperature control apparatus.
  35. Eager George (Cambridge MA) Selverstone Pater (Cambridge MA), Temperature control for device under test.
  36. Burton David P. (Parteen IEX) Dillon Paul A. (Foxrock IEX) Stephenson Malcolm I. (Adare IEX), Temperature control instrument for electronic components under test.
  37. Pearson Wayne K. (North Attleboro MA) Cordino ; Jr. Charles E. (Plymouth MA), Temperature control method and apparatus.
  38. Witkin ; Donald E. ; Bowles ; Arnold G., Temperature control method and apparatus.
  39. Tustaniwskyj Jerry Ihor ; Babcock James Wittman, Temperature control system for an electronic device in which device temperature is estimated from heater temperature and.
  40. Tustaniwskyj Jerry Ihor ; Babcock James Wittman, Temperature control system for an electronic device which achieves a quick response by interposing a heater between the.
  41. Hamilton Harold E. (Minneapolis MN) Zimmer James R. (Cologne MN), Temperature regulator for burn-in board components.
  42. Jones Elmer R., Test handler for DUT's.
  43. Igarashi Noriyuki,JPX ; Suzuki Kenpei,JPX, Test handler having turn table.
  44. O\Connor R. Bruce (San Diego CA) Toth Thomas E. (El Cajon CA) Ross James A. (Poway CA), Test station.
  45. Jones Elmer R. (North Reading MA), Thermal control system for a semi-conductor burn-in.
  46. Jones Elmer R. (North Reading MA), Thermal control system for a semi-conductor burn-in.
  47. Stanley Gerald R. (Mishawaka IN), Thermal protection circuit for the die of a transistor.

이 특허를 인용한 특허 (10)

  1. Kabbani,Samer; Beyerle,Rick; Bachelder,Don, Active thermal control system with miniature liquid-cooled temperature control device for electronic device testing.
  2. Di Stefano, Thomas H., Apparatus to control device temperature utilizing multiple thermal paths.
  3. Di Stefano, Thomas H., Apparatus to control device temperature utilizing multiple thermal paths.
  4. Earle, Terry R.; Pursel, Timothy; Sundstrom, Lance LeRoy, Ducted test socket.
  5. Cheng, Andrew A.; Gu, James J.; Scott, Graham A., Dynamic linear control methods and apparatus for variable speed pump control.
  6. Chiu, Fang-Yu; Chou, Chun-Hung, Heating element and circuit module stack structure.
  7. Di Stefano, Thomas H., Method and apparatus for controlling temperature.
  8. Cheng, Andrew A.; Gu, James J., Method and apparatus for pump control using varying equivalent system characteristic curve, AKA an adaptive control curve.
  9. Di Stefano, Peter T.; Di Stefano, Thomas H., Method and apparatus for setting and controlling temperature.
  10. Oishi,Hideo, Semiconductor wafer test system.
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