IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0252302
(2002-12-23)
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발명자
/ 주소 |
- Radosevich, Lawrence D.
- Meyer, Andreas A.
- Beihoff, Bruce C.
- Kannenberg, Daniel G.
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출원인 / 주소 |
- Rockwell Automation Technologies, Inc.
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인용정보 |
피인용 횟수 :
24 인용 특허 :
63 |
초록
▼
A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by
A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
대표청구항
▼
1. A modular power converter comprising:a thermal support configured to receive and circulate a coolant stream for extraction of heat; and at least two power electronics circuits secured on the thermal support, the power electronics circuits including a switching circuit for outputting controlled ou
1. A modular power converter comprising:a thermal support configured to receive and circulate a coolant stream for extraction of heat; and at least two power electronics circuits secured on the thermal support, the power electronics circuits including a switching circuit for outputting controlled output power, and a separate circuit board supporting a separate circuit for enabling operation of the switching circuit, the power electronics circuits generating heat during operation that is at least partially extracted by the coolant stream via the thermal support. 2. The modular power converter of claim 1, wherein at least one of the power electronics circuits is bonded to at least one substrate secured to the support.3. The modular power converter of claim 1, wherein the thermal support is a single-piece support.4. The modular power converter of claim 1, wherein the thermal support is a multi-piece support.5. The modular power converter of claim 1, wherein the thermal support includes at least one extension for supporting and cooling additional circuitry.6. The modular power converter of claim 1, wherein the power electronics circuits form a uni-directional power converter.7. The modular power converter of claim 1, wherein the power electronics circuits form a bi-directional power converter.8. The modular power converter of claim 1, wherein one of the power electronics circuits is secured to a first side of the support and the other of the power electronics circuits is secured to a second side of the support opposite the first side.9. The modular power converter of claim 1, wherein the power electronics circuits are secured to a first side of the support and the separate circuit board is secured to a second side of the support.10. The modular power converter of claim 9, wherein the first side is opposite the second side.11. The modular power converter of claim 1, comprising filtering circuitry disposed on the support.12. The modular power converter of claim 1, further comprising line and load conductors for applying the incoming power to the power electronics circuits and for directing the outgoing controlled power therefrom, and wherein the line and load conductors are disposed on a first side of the support.13. The modular power converter of claim 12, further comprising inlet and outlet ports for the coolant stream, and wherein the inlet and outlet ports are disposed on a side of the support other then the first side.14. The modular power converter of claim 13, wherein the inlet and outlet ports are disposed on a same side of the support.15. A modular power converter for providing three phase, controlled frequency AC power signals to a load, the converter comprising:a thermal support configured to receive and to circulate a coolant stream; a control circuit; a driver circuit coupled to the control circuit to receive control signals from the control circuit; a power converter circuit coupled to the driver circuit to receive drive signals for outputting a controlled frequency output power, the converter circuit including a plurality of power electronic device subassemblies bonded to a substrate for converting input power to AC power signals based upon the drive signals; and a capacitor circuit coupled to the power converter circuit; wherein at least the substrate of the inverter circuit, and a separate circuit board supporting one of the drive, control and capacitor circuits are supported on the thermal support for extracting heat from the power electronic device subassemblies during operation of the power converter circuit. 16. The modular power converter of claim 15, wherein the power converter circuit is configured to receive DC input power.17. The modular power converter of claim 15, wherein the power converter is configured to receive AC input power.18. The modular power converter of claim 15, wherein the device subassemblies are bonded to a single substrate.19. The modular power converter of claim 15, wherein the device subassemblies are bonded to a plurality of substrates.20. The modular power converter of claim 19, wherein the substrates are disposed on different sides of the support.21. The modular power converter of claim 20, wherein the different sides are mutually opposed to one another.22. The modular power converter of claim 15, wherein the support cools at least two of the circuits.23. The modular power converter of claim 22, wherein the support cools the capacitor circuit.24. The modular power converter of claim 23, wherein the capacitor circuit is supported on a side of the support opposite a side on which the substrate is supported.25. A modular power converter providing three phase, controlled frequency AC power signals to a load, the converter comprising:a thermal support having first and second sides and configured to receive and to circulate a coolant stream; a power converter circuit for outputting a controlled frequency output power, the converter circuit including a plurality of power electronic device subassemblies bonded to at least one substrate; and an energy storage circuit coupled to the converter circuit; wherein the substrate of the converter circuit is supported on the first side of the thermal support and the energy storage circuit is supported on the second side of the thermal support, whereby the coolant stream extracts heat from the substrate and the energy storage circuit during operation of the power converter circuit. 26. The modular power converter of claim 25, wherein the power electronics circuit is bonded to the substrate.27. The modular power converter of claim 25, wherein the thermal support is a single-piece support.28. The modular power converter of claim 25, wherein the thermal support is a multi-piece support.29. The modular power converter of claim 25, wherein the thermal support includes at least one extension for supporting and cooling the circuitry.30. The modular power converter of claim 25, wherein the device subassemblies are bonded to a single substrate.31. The modular power converter of claim 25, wherein the device subassemblies are bonded to a plurality of substrates.32. The modular power converter of claim 25, wherein at least one of the substrates are disposed on a side of the support other than the first side.33. A modular power converter providing three phase, controlled frequency AC power signals to a load, the converter comprising:a thermal support having first and second sides and configured to receive and to circulate a coolant stream; a first power converter circuit for outputting a controlled frequency output power, the converter circuit including a plurality of power electronic device subassemblies secured to at least one first substrate; and a second power converter circuit for outputting a controlled frequency output power, the converter circuit including a plurality of power electronic device subassemblies secured to a second substrate; wherein the at least one first substrate is supported on the first side of the thermal support and the at least one second substrate is supported on the second side of the thermal support, whereby the coolant stream extracts heat from the first and second substrates during operation of the converter. 34. The modular power converter of claim 33, wherein the device subassemblies are bonded to their respective substrates.35. The modular power converter of claim 33, further comprising an energy storage circuit coupled to at least one of the first or second converter circuits, the energy storage circuit being cooled by the thermal support during operation.36. The modular power converter of claim 33, wherein the energy storage circuit is coupled to both the first and second converter circuits.37. The modular power converter of claim 33, wherein the device subassemblies of each converter circuit are bonded to a single substrate.38. The modular power converter of claim 33, wherein the device subassemblies of each converter circuit arc bonded to a plurality of substrates.39. The modular power converter of claim 33, wherein the second side is mutually opposed to the first side.40. A modular power converter comprising:a controlled power electronics circuit including solid state switches configured to convert incoming power to controlled outgoing power; a driver circuit secured to a separate circuit board and coupled to the power electronics circuit for controlling operation of the solid state switches; and a fluid cooled support on which the power electronics circuit and the separate circuit board are secured, the fluid cooled support including inlet and outlet ports for a cooling fluid and an internal fluid conduit for directing flow of cooling fluid adjacent to the power electronics circuit and the separate circuit board for removal of heat therefrom. 41. The modular power converter of claim 40, wherein the power electronics circuit forms an inverter.42. The modular power converter of claim 40, wherein the power electronics circuit forms a matrix converter.43. The modular power converter of claim 40, wherein the power electronics circuit is secured to a first side of the support and the separate circuit board is secured to a second side of the support.44. The modular power converter of claim 43, wherein the first side is opposite the second side.45. The modular power converter of claim 40, wherein a first portion of the power electronics circuit including a first set of solid state switches is secured to a first side of the support and second portion of the power electronics circuit including a second set of solid state switches is secured to second side of the support opposite the first side.46. The modular power converter of claim 40, further comprising line and load conductors for applying the incoming power to the power electronics circuit and for directing the outgoing controlled power therefrom.47. The modular power converter of claim 46, wherein the line and load conductors are disposed on a same side of the support.48. The modular power converter of claim 47, wherein the inlet and outlet ports are disposed in a different side of the support.49. The modular power converter of claim 48, wherein the inlet and outlet ports are disposed on a same side of the support.50. A modular power converter comprising:a controlled power electronics circuit including solid state switches configured to convert incoming power to controlled outgoing power; at least one additional circuit coupled to the power electronics circuit for operation of the solid state switches; and a fluid cooled support on which the power electronics circuit and the at least one additional circuit are directly secured, the fluid cooled support including inlet and outlet ports for a cooling fluid and an internal fluid conduit for directing flow of cooling fluid adjacent to the power electronics circuit and the at least one additional circuit for removal of heat therefrom, at least a portion of the power electronics circuit being secured to a first side of the support and at least a portion of the at least one additional circuit being secured to a second side of the support opposite the first side. 51. The modular power converter of claim 50, wherein the at least one additional circuit includes a driver circuit for controlling switching of the solid state switches.52. The modular power converter of claim 50, wherein the at least one additional circuit includes a capacitor circuit.53. The modular power converter of claim 50, wherein the at least one additional circuit includes an energy storage circuit.54. The modular power converter of claim 50, further comprising a control circuit coupled to the power electronics circuit and configured to generate control signals for operation of the solid state switches, the control circuit being cooled by the support during operation.55. A modular power converter comprising:a plurality of power electronics circuits including solid state switches configured to convert incoming power to controlled outgoing power; a support circuit including a support circuit board enabling operation of the solid state switches; and a fluid cooled support on which the power electronics circuits are directly secured, the fluid cooled support including inlet and outlet ports for a cooling fluid and an internal fluid conduit for directing flow of cooling fluid adjacent to the power electronics circuits for removal of heat therefrom; wherein the plurality of power electronics circuit and the support circuit board are secured to a plurality of sides of the support. 56. The modular power converter of claim 55, wherein the plurality of sides are mutually opposed sides.
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