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In a heat dissipating assembly, a base frame is disposed underneath a circuit board and includes a bottom part with opposite first and second sides that are formed with first and second engaging units, respectively. The first and second engaging units extend upwardly through a set of through holes i

In a heat dissipating assembly, a base frame is disposed underneath a circuit board and includes a bottom part with opposite first and second sides that are formed with first and second engaging units, respectively. The first and second engaging units extend upwardly through a set of through holes in the circuit board. A heat-dissipating module is mounted on the circuit board and includes a heat transfer plate to establish heat-conductive contact with an electronic component on the circuit board. An anchoring device includes a first anchoring unit that engages the first engaging unit, a second anchoring unit that engages the second engaging unit, and an abutting unit connected to the first and second anchoring units. The anchoring device biases the heat transfer plate toward the electronic component when the first and second anchoring units engage the first and second engaging units.

대표청구항 ▼

1. A heat dissipating assembly adapted to be provided on a circuit board for dissipating heat produced by an electronic component that is mounted on a first surface of the circuit board, the circuit board further having a second surface opposite to the first surface and being formed with a set of th

1. A heat dissipating assembly adapted to be provided on a circuit board for dissipating heat produced by an electronic component that is mounted on a first surface of the circuit board, the circuit board further having a second surface opposite to the first surface and being formed with a set of through holes, each of which extends from the first surface to the second surface, said heat dissipating assembly comprising:a base frame adapted to be disposed on the second surface of the circuit board and including a bottom part with first and second sides opposite to each other in a first direction, said first side being formed with a first engaging unit extending upwardly therefrom, said second side being formed with a second engaging unit extending upwardly therefrom, each of said first and second engaging units being adapted to extend through the through holes in the circuit board; a heat-dissipating module adapted to be mounted on the circuit board and including a heat transfer plate adapted to be disposed on and to establish heat-conductive contact with the electronic component; and an anchoring device including a first anchoring unit that engages said first engaging unit, a second anchoring unit that engages said second engaging unit, and an abutting unit connected to said first and second anchoring units, said anchoring device biasing said heat transfer plate of said heat-dissipating module toward the electronic component when said first and second anchoring units engage said first and second engaging units, wherein: said first engaging unit includes a first engaging post with a diameter-reduced neck portion; said second engaging unit including a second engaging post, and an enlarged head portion provided on a top end of said second engaging post and formed with a convex top surface; said first anchoring unit including a forked plate that engages said neck portion of said first engaging post; said second anchoring unit including a U-shaped plate that has upper and lower plate portions, and an intermediate plate portion interconnecting said upper and lower plate portions, said lower plate portion being formed with a notch that is slightly smaller than a largest diameter of said head portion on said second engaging post, said second engaging post engaging said notch and said head portion being retain between said upper and lower plate portions when said second anchoring unit engages said second engaging unit. 2. The heat dissipating assembly as claimed in claim 1, wherein said abutting unit includes an abutting plate, and opposite resilient lateral plates extending in the first direction and inclining upwardly from opposite sides of said abutting plate and connected respectively to said forked plate and said upper plate portion of said U-shaped plate.3. The heat dissipating assembly as claimed in claim 2, wherein said forked plate, said U-shaped plate, said resilient lateral plates and said abutting plate are formed integrally.4. A heat dissipating assembly adapted to be provided on a circuit board for dissipating heat produced by an electronic component that is mounted on a first surface of the circuit board, the circuit board further having a second surface opposite to the first surface and being formed with a set of through holes, each of which extends from the first surface to the second surface, said heat dissipating assembly comprising:a base frame adapted to be disposed on the second surface of the circuit board and including a bottom part with first and second sides opposite to each other in a first direction, said first side being formed with a first engaging unit extending upwardly therefrom, said second side being formed with a second engaging unit extending upwardly therefrom, each of said first and second engaging units being adapted to extend through the through holes in the circuit board; a heat-dissipating module adapted to be mounted on the circuit board and including a heat transfer plate adapted to be disposed on and to establish heat-conductive contact with the electronic component; and an anchoring device including a first anchoring unit that engages said first engaging unit, a second anchoring unit that engages said second engaging unit, and an abutting unit connected to said first and second anchoring units, said anchoring device biasing said heat transfer plate of said heat-dissipating module toward the electronic component when said first and second anchoring units engage said first and second engaging units, wherein said anchoring device includes two anchoring members, each of which has an abutting portion, two resilient portions extending in the first direction and including upwardly from opposite sides of said abutting portion, and first and second engaging hooks connected to said resilient portions, respectively, said first engaging hooks of said anchoring members serving as said first anchoring unit of said anchoring device, said second engaging hooks of said anchoring members serving as said second anchoring unit of said anchoring device. 5. The heat dissipating assembly as claimed in claim 4, wherein each of said first and second engaging units includes two ring members, each of said ring members having an upper ring portion that engages a corresponding one of said first and second engaging hooks.6. The heat dissipating assembly as claimed in claim 4, wherein said anchoring device further includes a coupling portion interconnecting said anchoring members.7. The heat dissipating assembly as claimed in claim 4, wherein said first engaging unit includes two engaging plates, each of which is formed with opposite notches that engage a corresponding one of said first engaging hooks of said anchoring members, said second engaging unit including two lugs that engage said second engaging hoc of said anchoring members.