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Pattern inspection apparatus, pattern inspection method, and recording medium 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06K-009/00
출원번호 US-0648372 (2000-08-25)
우선권정보 JP-0239586 (1999-08-26); JP-0078847 (2000-03-21)
발명자 / 주소
  • Yamamoto, Masahiro
  • Kitamura, Tadashi
출원인 / 주소
  • Nanogeometry Research
대리인 / 주소
    Finnegan, Henderson, Farabow, Garrett &
인용정보 피인용 횟수 : 68  인용 특허 : 6

초록

First, a pattern inspection apparatus detects the first edge from an image of a pattern to-be-inspected. Next, the pattern inspection apparatus conducts matching of the image of the pattern to-be-inspected and the first reference pattern by comparing the first edge and an edge of the first reference

대표청구항

1. A pattern inspection apparatus for inspecting a pattern to-be-inspected by comparing an image of said pattern to-be-inspected with a reference pattern obtained from design data, said pattern inspection apparatus comprising:storage means for storing said reference pattern; inputting means for inpu

이 특허에 인용된 특허 (6)

  1. Emery David G. (San Jose CA) Saidin Zain K. (Sunnyvale CA) Wihl Mark J. (Tracy CA) Fu Tao-Yi (Fremont CA) Zywno Marek (San Jose CA) Kvamme Damon F. (Ann Arbor MI) Fein Michael E. (Mountain View CA), Automated photomask inspection apparatus and method.
  2. LeBeau Christopher J. (Tempe AZ), Automatic package inspection method.
  3. Specht Donald F. (Los Altos CA) Wihl Tim S. (San Jose CA) Young Scott A. (Scotts Valley CA) Hager ; Jr. James J. (San Jose CA) Lutzker Matthew B. (Menlo Park CA), Automatic photomask and reticle inspection method and apparatus including improved defect detector and alignment sub-sys.
  4. Aoyama Chiaki (Wako JPX), Edge detecting apparatus.
  5. Lebeau Christopher J. (Tempe AZ), Method for automatic semiconductor wafer inspection.
  6. Mizuno Fumio,JPX, Method of and apparatus for pattern inspection.

이 특허를 인용한 특허 (68)

  1. Onishi, Hiroyuki; Asai, Hiroshi; Ogi, Hiroshi, Apparatus and method for inspecting pattern.
  2. Ogawa,Ryuji, Apparatus for optical proximity correction, method for optical proximity correction, and computer program product for optical proximity correction.
  3. Usui, Satoshi; Hashimoto, Koji, Calibration method, inspection method, and semiconductor device manufacturing method.
  4. Sato, Mitsugu; Sakai, Katsuhiko; Takane, Atsushi; Nakayama, Yoshihiko, Charged particle beam apparatus and dimension measuring method.
  5. Sato, Mitsugu; Sakai, Katsuhiko; Takane, Atsushi; Nakayama, Yoshihiko, Charged particle beam apparatus and dimension measuring method.
  6. Abe,Hideaki, Charged particle beam irradiation method, method of manufacturing semiconductor device and charged particle beam apparatus.
  7. Sugiyama, Akiyuki; Morokuma, Hidetoshi; Hojo, Yutaka; Yoshizawa, Yukio, Charged particle system.
  8. Kitamura, Tadashi; Ishikawa, Akio, Defect and critical dimension analysis systems and methods for a semiconductor lithographic process.
  9. Mitsui, Tadashi, Defect inspection apparatus and defect inspection method.
  10. Beale,Daniel, Edge-based proximity correction.
  11. Sundararajan, Srikanth; Ho, Siu May; Shetty, Shivananda S., Efficient storage of fail data to aid in fault isolation.
  12. Tsuneta,Ruriko; Inada,Hiromi; Koguchi,Masanari; Hashimoto,Takahito, Electric charged particle beam microscopy, electric charged particle beam microscope, critical dimension measurement and critical dimension measurement system.
  13. Ikeda,Takahiro, Extracting method of pattern contour, image processing method, searching method of pattern edge, scanning method of probe, manufacturing method of semiconductor device, pattern inspection apparatus, and program.
  14. Ikeda,Takahiro, Extracting method of pattern contour, image processing method, searching method of pattern edge, scanning method of probe, manufacturing method of semiconductor device, pattern inspection apparatus, and program.
  15. Simmons, Mark C; Otto, Oberdan, Fast pattern matching.
  16. Tasker, David J.; Lezec, Henri J.; Head, David A., Graphical automated machine control and metrology.
  17. Tasker, David J.; Lezec, Henri J.; Head, David A., Graphical automated machine control and metrology.
  18. Tasker,David J.; Lezec,Henri J.; Head,David A., Graphical automated machine control and metrology.
  19. Konishi, Yoshinori, Image comparison device, image sensor, processing system, and image comparison method.
  20. Kato, Yutaka; Kiuchi, Yutaka, Image processing apparatus, image processing method and program.
  21. Ono, Mitsuhiro; Goto, Fumitaka; Goto, Fumihiro; Kato, Masao; Yamada, Akitoshi; Suwa, Tetsuya; Hashii, Yusuke; Miyagi, Arata, Image processing apparatus, image processing method, and program.
  22. Okada, Motohiro; Sota, Shuhei; Hashimoto, Takaki; Kai, Yasunobu; Masukawa, Kazuyuki; Kono, Yuko; Kodama, Chikaaki; Uno, Taiga; Mashita, Hiromitsu, Integrated circuit device, method for producing mask layout, and program for producing mask layout.
  23. Bryll,Robert Kamil; Venkatachalam,Vidya, Magnified machine vision user interface.
  24. Ohnuma,Hidetoshi; Kawahara,Kazuyoshi, Mask pattern correction apparatus and mask pattern correction method and mask preparation method and method of production of a semiconductor device.
  25. Miyamoto, Atsushi; Nagatomo, Wataru; Matsuoka, Ryoichi; Morokuma, Hidetoshi; Sutani, Takumichi, Method and apparatus for creating imaging recipe.
  26. Miyamoto, Atsushi; Nagatomo, Wataru; Matsuoka, Ryoichi; Morokuma, Hidetoshi; Sutani, Takumichi, Method and apparatus for creating imaging recipe.
  27. Miyamoto, Atsushi; Nagatomo, Wataru; Matsuoka, Ryoichi; Morokuma, Hidetoshi; Sutani, Takumichi, Method and apparatus for creating imaging recipe.
  28. Miyamoto, Atsushi; Tanaka, Maki; Morokuma, Hidetoshi, Method and apparatus for measuring shape of a specimen.
  29. Joshi, Rajashri; Dorum, Ole Henry; Israni, Vijaya, Method and system for representation of geographical features in a computer-based system.
  30. Sukegawa, Shigeki; Koshihara, Shunsuke; Yang, Kyoungmo, Method for adjusting imaging magnification and charged particle beam apparatus.
  31. Sukegawa, Shigeki; Koshihara, Shunsuke; Yang, Kyoungmo, Method for adjusting imaging magnification and charged particle beam apparatus.
  32. Hsieh, Te-Hsien; Chen, Ming-Jui; Wang, Cheng-Te; Hsieh, Ping-I; Lee, Jing-Yi, Method of optical proximity correction.
  33. Morokuma, Hidetoshi; Sutani, Takumichi; Matsuoka, Ryoichi; Komuro, Hitoshi; Sugiyama, Akiyuki, Method, device and computer program of length measurement.
  34. Volk, William; Wiley, James; Watson, Sterling; Kekare, Sagar A.; Hess, Carl; Marella, Paul Frank; McCauley, Sharon; Chang, Ellis, Methods and systems for inspection of wafers and reticles using designer intent data.
  35. Takai,Mitsuru; Suwa,Takahiro, Next process-determining method, inspecting method and inspecting apparatus.
  36. Takai,Mitsuru; Suwa,Takahiro, Next process-determining method, inspecting method and inspecting apparatus.
  37. Veneruso,Anthony Frank, Non-destructive inspection of downhole equipment.
  38. Knippelmeyer, Rainer; Kienzle, Oliver; Kemen, Thomas; Mueller, Heiko; Uhlemann, Stephan; Haider, Maximilian; Casares, Antonio; Rogers, Steven, Particle-optical systems and arrangements and particle-optical components for such systems and arrangements.
  39. Knippelmeyer, Rainer; Kienzle, Oliver; Kemen, Thomas; Mueller, Heiko; Uhlemann, Stephan; Haider, Maximilian; Casares, Antonio; Rogers, Steven, Particle-optical systems and arrangements and particle-optical components for such systems and arrangements.
  40. Knippelmeyer, Rainer; Kienzle, Oliver; Kemen, Thomas; Mueller, Heiko; Uhlemann, Stephan; Haider, Maximillian; Casares, Antonio; Rogers, Steven, Particle-optical systems and arrangements and particle-optical components for such systems and arrangements.
  41. Sutani, Takumichi; Matsuoka, Ryoichi; Morokuma, Hidetoshi; Sugiyama, Akiyuki; Shindo, Hiroyuki, Pattern displacement measuring method and pattern measuring device.
  42. Sutani, Takumichi; Matsuoka, Ryoichi; Morokuma, Hidetoshi; Sugiyama, Akiyuki; Shindo, Hiroyuki, Pattern displacement measuring method and pattern measuring device.
  43. Mitsui, Tadashi, Pattern evaluation method, pattern matching method and computer readable medium.
  44. Toyoda, Yasutaka; Sakai, Hideo; Matsuoka, Ryoichi, Pattern generating apparatus and pattern shape evaluating apparatus.
  45. Toyoda, Yasutaka; Sakai, Hideo; Matsuoka, Ryoichi, Pattern generating apparatus and pattern shape evaluating apparatus.
  46. Toyoda, Yasutaka; Sakai, Hideo; Matsuoka, Ryoichi, Pattern generating apparatus and pattern shape evaluating apparatus.
  47. Toyoda, Yasutaka; Sakai, Hideo; Matsuoka, Ryoichi, Pattern generating apparatus and pattern shape evaluating apparatus.
  48. Kitamura, Tadashi; Hasebe, Toshiaki; Tsuneoka, Masatoshi, Pattern inspection apparatus and method.
  49. Kitamura, Tadashi; Hasebe, Toshiaki; Tsuneoka, Masotoshi, Pattern inspection apparatus and method.
  50. Kitamura, Tadashi; Hasebe, Toshiaki; Tsuneoka, Masotoshi, Pattern inspection apparatus and method.
  51. Kitamura, Tadashi; Kubota, Kazufumi; Nakazawa, Shinichi; Vohra, Neeti; Yamamoto, Masahiro, Pattern inspection apparatus and method.
  52. Kitamura, Tadashi; Kubota, Kazufumi; Nakazawa, Shinichi; Vohra, Neeti; Yamamoto, Masahiro; Hasebe, Toshiaki, Pattern inspection apparatus and method.
  53. Kitamura, Tadashi; Kubota, Kazufumi; Nakazawa, Shinichi; Vohra, Neeti; Yamamoto, Masahiro; Hasebe, Toshiaki, Pattern inspection apparatus and method.
  54. Yamamoto, Masahiro; Kitamura, Tadashi, Pattern inspection apparatus, pattern inspection method, and recording medium.
  55. Nagahama, Ichirota, Pattern inspection method and pattern inspection apparatus.
  56. Toyoda, Yasutaka; Ikeda, Mitsuji; Takane, Atsushi, Pattern matching apparatus and scanning electron microscope using the same.
  57. Onishi, Atsushi; Mitsui, Tadashi; Yamazaki, Yuichiro, Pattern matching method, program and semiconductor device manufacturing method.
  58. Sato, Hidetoshi; Matsuoka, Ryoichi; Sutani, Takumichi, Pattern measurement method and pattern measurement system.
  59. Sato, Hidetoshi; Matsuoka, Ryoichi, Pattern measurement methods and pattern measurement equipment.
  60. Sutani, Takumichi; Matsuoka, Ryoichi; Morokuma, Hidetoshi; Komuro, Hitoshi; Sugiyama, Akiyuki, Pattern measuring method and pattern measuring device.
  61. Sutani, Takumichi; Matsuoka, Ryoichi; Morokuma, Hidetoshi; Komuro, Hitoshi; Sugiyama, Akiyuki, Pattern measuring method and pattern measuring device.
  62. Shindo, Hiroyuki, Pattern shape evaluation device and method.
  63. Mitsui, Tadashi, Pattern shape evaluation method, program, and semiconductor device manufacturing method.
  64. Isomura, Ikunao, Photomask inspection apparatus comparing optical proximity correction patterns to minimum and maximum limits.
  65. Nehmadi, Youval; Abraham, Zamir; Sod Moriah, Gil; Eran, Yair; Ofek, Chen; Cohen, Yaron; Ben Porath, Ariel, Process monitoring system and method for processing a large number of sub-micron measurement targets.
  66. Kitamura, Tadashi; Ishikawa, Akio, System and method for a semiconductor lithographic process control using statistical information in defect identification.
  67. Melikian, Simon, System and method for visual searching of objects using lines.
  68. Nehmadi, Youval; Menadeva, Ovadya; Latinsky, Sergey; Abraham, Zamir; Afek, Orit, System, method and computer software product for inspecting charged particle responsive resist.
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