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Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermal

Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.

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1. A printed wiring board comprising:at least one carbon containing layer; at least one electrically conductive layer that includes at least one circuit; at least one dielectric layer located between the carbon containing layer and the electrically conductive layer; and wherein at least one electric

1. A printed wiring board comprising:at least one carbon containing layer; at least one electrically conductive layer that includes at least one circuit; at least one dielectric layer located between the carbon containing layer and the electrically conductive layer; and wherein at least one electrical connection exists between the carbon containing layer and the circuit on the electrically conductive layer. 2. The printed wiring board of claim 1, wherein the carbon containing layer comprises a substrate containing carbon impregnated with a resin.3. The printed wiring board of claim 2, wherein the substrate comprises woven carbon fibers.4. The printed wiring board of claim 2, wherein the substrate comprises unidirectional carbon fibers.5. The printed wiring board of claim 2, wherein the resin is an electrically conductive resin.6. The printed wiring board of claim 5, wherein the electrically conductive resin has a dielectric constant greater than 6.0 at 1 MHz.7. The printed wiring board of claim 5, wherein the electrically conductive resin contains a pyrolytic carbon additive.8. The printed wiring board of claim 5, wherein the electrically conductive resin contains a silver oxide additive.9. The printed wiring board of claim 5, wherein the electrically conductive resin contains carbon powder as an additive.10. The printed wiring board of claim 5, wherein:the carbon containing layer is clad on at least one side with second electrically conductive layer; and an electrical connection between the carbon containing layer and the second electrically conductive layer is established by contact between the electrically conductive resin impregnated into the carbon substrate in the carbon containing layer and the second electrically conductive layer. 11. The printed wiring board of claim 1, wherein the carbon containing layer comprises a carbon plate.12. The printed wiring board of claim 1, wherein the electrical connection includes a lined through hole.13. The printed wiring board of claim 2, wherein:the carbon containing layer is clad on at least one side with second electrically conductive layer; and an electrical connection between the carbon containing layer and the second electrically conductive layer is established by contact between the carbon substrate in the carbon containing layer and the second electrically conductive layer. 14. The printed wiring board of claim 12, wherein the lining of the lined through hole contacts the carbon containing layer.15. The printed wiring board of claim 12, wherein the lining of the lined through hole contacts the circuit on the electrically conductive layer.