Cadmium sulfoselenide surface-mountable optocoupler
IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0315317
(2002-12-06)
|
발명자
/ 주소 |
- Rohrbacher, Fred
- Chiasson, Michel
- Lacroix, Marc
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
1 인용 특허 :
1 |
초록
▼
The invention concerns an optocoupler. The optocoupler includes a substrate made of optically opaque electrically insulating material metallized to provide conductive traces on a top surface thereof which are electrically linked to metal pads on a bottom surface. A cadmium sulfoselenide photoresisto
The invention concerns an optocoupler. The optocoupler includes a substrate made of optically opaque electrically insulating material metallized to provide conductive traces on a top surface thereof which are electrically linked to metal pads on a bottom surface. A cadmium sulfoselenide photoresistor having an active surface is placed over the substrate with the active surface facing the substrate where the photoresistor has two electrodes. Metal leads connect each of the two electrodes of the photoresistor to two metallized traces on the substrate. A light emitting diode (LED) chip is mounted on the substrate facing the active surface of the photoresistor. The LED chip has a top and bottom electrode, where the bottom electrode is electrically attached to a third metallized trace and the top electrode is wire bonded to a fourth metallized trace. A cover made of optically opaque material is fixed to the substrate so as to enclose the photoresistor and the LED chip in a light tight enclosure. In an alternative embodiment of the invention, the photoresistor and the LED chip can lie side by side and be in optical communication with each other through a reflective coating on the inside of the cover.
대표청구항
▼
1. A surface mountable cadmium sulfoselenide optocoupler, said optocoupler comprising:a substrate made of optically opaque, electrically insulating material, metallized so as to provide conductive traces on a top surface thereof, said traces being electrically linked to metal pads on a bottom surfac
1. A surface mountable cadmium sulfoselenide optocoupler, said optocoupler comprising:a substrate made of optically opaque, electrically insulating material, metallized so as to provide conductive traces on a top surface thereof, said traces being electrically linked to metal pads on a bottom surface; a cadmium sulfoselenide photoresistor having an active surface, placed over said substrate with said active surface facing said substrate, said photoresistor having two electrodes; metal leads electrically connecting each of said two electrodes of the photoresistor to two metallized traces on said substrate; a light emitting diode (LED) chip, mounted on said same substrate, facing said active surface of the photoresistor and having a top and bottom electrode, where said bottom electrode is electrically attached to a third metallized trace on said substrate, and said top electrode is wire bonded to still another metallized trace; and a cover made of optically opaque material, fixed to said substrate so as to enclose the photoresistor and the LED chip in a light tight enclosure. 2. The optocoupler of claim 1 wherein the substrate is made of black composite material.3. The optocoupler of claim 1 wherein said metallized traces are made of gold- or silver-coated copper.4. The optocoupler of claim 1, wherein said bottom surface of said substrate is adapted for surface mounting on a printed circuit board.5. The optocoupler of claim 1 wherein the composition of the active film of the photoresistor, and the nature of the LED chip, are selected so that the maximum sensitivity of the former, and the maximum of optical emission of the latter, take place at similar wavelengths of light.6. The optocoupler of claim 1 wherein an optically transparent and electrically resistive material is placed between the LED chip and the active surface of the photoresistor, so as to optimize the transfer of light from one to the other.7. The optocoupler of claim 6, wherein said electrically resistive material is optical grade epoxy resin.8. The optocoupler of claim 6 wherein a ring of optically opaque material is placed in a substantially circular manner around the LED chip.9. The optocoupler of claim 1 wherein the surface of the substrate surrounding the LED chip is completely metallized, with the exception of a thin open gap along the metal traces connecting to the electrodes of the LED chip.10. A surface mountable cadmium sulfoselenide optocoupler, said optocoupler comprising:an optically opaque, electrically insulating substrate having conductive traces on a top surface thereof, said traces being electrically linked to metal pads on a bottom surface of said substrate; a cadmium sulfoselenide photoresistor having an active surface, and two electrodes paced over said substrate with said active surface facing away from said substrate; metal leads electrically connecting each of said two electrodes to a first and second trace of said traces; a light emitting diode chip having two electrodes, said LED chip being placed over said substrate, said two electrodes of said LED chip being connected to a third and fourth trace of said traces; and an optically opaque cover enclosing said photosensor and said LED chip fixed to said top surface of said substrate, said cover having a reflective or diffusive inner surface. 11. The optocoupler of claim 10, wherein said substrate is made of a black composite material.12. The optocoupler of claim 10, wherein said traces are made of gold- or silver-coated copper.13. The optocoupler of claim 10, wherein said bottom surface of said substrate is adapted for surface mounting on a printed circuit board.14. A surface mountable cadmium sulfoselenide optocoupler comprising:a cadmium sulfoselenide photoresistor having an active surface; a light emitting diode chip in optical communication with said active surface of said photoresistor; said photoresistor and said light emitting diode being electrically and mechanically connected to an optically opaque substrate and being encased inside an optically opaque housing sealingly fixed to said substrate.
이 특허에 인용된 특허 (1)
-
Kronberg James W. (Aiken SC), Optically isolated signal coupler with linear response.
이 특허를 인용한 특허 (1)
-
Cronk, Michael Kent; Stephens, Owen Boyd, Light emitting diode illumination system.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.