초록 ▼

A chip device including a leadframe that includes source and gate connections, a bumped die including solder bumps on a top side that is attached to the leadframe such that the solder bumps contact the source and gate connections, and a copper clip attached to the backside of the bumped die such tha

A chip device including a leadframe that includes source and gate connections, a bumped die including solder bumps on a top side that is attached to the leadframe such that the solder bumps contact the source and gate connections, and a copper clip attached to the backside of the bumped die such that the copper clip contacts drain regions of the bumped die and a lead rail. The chip device is manufactured by flip chipping a bumped die onto the leadframe and placing the copper clip on a backside of; the trench die such that the backside of the trench die is coupled to the lead rail. The process involves reflowing the solder bumps on the bumped die and solder paste that is placed between the copper clip and the backside of the bumped die.

대표청구항 ▼

1. A chip device comprising:a leadframe including source and gate connections; a bumped die having solder bumps including source solder bumps and a gate solder bump source and gate on a frontside, the bumped die being attached to the leadframe such that the solder bumps contact the source and gate c

1. A chip device comprising:a leadframe including source and gate connections; a bumped die having solder bumps including source solder bumps and a gate solder bump source and gate on a frontside, the bumped die being attached to the leadframe such that the solder bumps contact the source and gate connections respectively; a copper clip attached to a backside of the bumped die and having an edge; a lead rail including leads and an elongated v-groove along an edge of the lead rail, wherein the edge of the copper clip is in the elongated v-groove along the edge of the lead rail; solder paste coupling the edge of the copper clip and the elongated v-grove of the lead rail; and apparatus in the leadframe and being located under the die and being between the source solder bumps. 2. A chip device in accordance with claim 1 wherein the copper clip is attached to the bumped die with solder paste.3. A chip device of claim 1, wherein the lead rail comprises copper.4. A chip device of claim 1, wherein the lead frame and the lead rail comprise copper.5. A chip device of claim 1, wherein the bumped die comprises an underbump metallurgy layer.6. A chip device of claim 1, wherein the bumped die comprises an underbump metallurgy layer comprising Ti.7. A chip device of claim 1, wherein the edge of the copper clip terminates in the elongated v-groove.8. A chip device of claim 1, further comprising flux on the leadframe.