초록 ▼

An electronic module having a configuration for promoting efficient heat dissipation and a circuit board assembly are provided such that when the electronic module is inserted within the circuit board assembly a portion of the electronic module overlaps an EMI shield, with the portion of the electro

An electronic module having a configuration for promoting efficient heat dissipation and a circuit board assembly are provided such that when the electronic module is inserted within the circuit board assembly a portion of the electronic module overlaps an EMI shield, with the portion of the electronic module having a configuration for promoting efficient heat dissipation and being external of the EMI shield.

대표청구항 ▼

1. An electronic module comprising:a housing accommodating an electronic assembly, said housing having a configuration for promoting efficient heat dissipation and said electronic assembly being connectable to an electrical connector having an EMI shield adjacent thereof; wherein, when said electron

1. An electronic module comprising:a housing accommodating an electronic assembly, said housing having a configuration for promoting efficient heat dissipation and said electronic assembly being connectable to an electrical connector having an EMI shield adjacent thereof; wherein, when said electronic assembly is connected to said electrical connector, said housing comprises a lip portion and said lip portion at least partially overlaps said EMI shield, with said housing being external of said EMI shield at said partial overlap. 2. The electronic module according to claim 1, wherein said lip portion comprises a plurality of fins.3. A circuit board assembly comprising:an enclosure mounted upon a circuit board for receiving an electronic module comprising a housing accommodating an electronic assembly; an EMI shield disposed adjacent an electrical connector connectable to said electronic assembly, said electrical connector being disposed within said enclosure; wherein, when said electronic assembly is connected to said electrical connector, said housing comprises a lip portion and said lip portion at least partially overlaps said EMI shield, with said housing being external of said EMI shield at said partial overlap. 4. The circuit board assembly according to claim 3, wherein said EMI shield comprises a plurality of projections trappable against said module.5. The circuit board assembly according to claim 4, wherein said projections are resiliently biased.6. A system comprising:an electronic module comprising: a housing accommodating an electronic assembly, said housing having a configuration for promoting efficient heat dissipation and said electronic assembly being connectable to an electrical connector having an EMI shield adjacent thereof; wherein, when said electronic assembly is connected to said electrical connector, said housing comprises a lip portion and said lip portion at least partially overlaps said EMI shield, with said housing being external of said EMI shield at said partial overlap; and a circuit board assembly comprising: an enclosure mounted upon a circuit board for receiving said electronic module, wherein said electrical connector is disposed within said enclosure. 7. The system according to claim 6, wherein said lip portion comprises a plurality of fins.8. The system according to claim 6, wherein said EMI shield comprises a plurality of projections trappable against said module.9. The system according to claim 8, wherein said projections are resiliently biased.