초록 ▼

The invention relates to heat transfer apparatus for cooling electronic components. There is a continuously increasing demand for compact electronic systems such as portable laptop computers and thirst for high processing power, leading to high heat generated by components residing within these syst

The invention relates to heat transfer apparatus for cooling electronic components. There is a continuously increasing demand for compact electronic systems such as portable laptop computers and thirst for high processing power, leading to high heat generated by components residing within these systems. These electronic systems have to be cooled due to their fixed operating temperature ranges. Operating an electronic component beyond its rated operating temperature range will damage electronic components. Instead of conventionally utilising a bigger fan, a smaller sized solution is required for cooling an electronic component contained in a compact electronic system, for example a notebook computer. A heat transfer apparatus includes a heat carrier for conveying heat away from the electronic system into a radiator for dissipation. The radiator is placed into a cooler for directing air through the radiator and expelling heated air, cooling the radiator in the process.

대표청구항 ▼

1. A heat transfer apparatus for exhausting heat of an electronic component, the heat transfer apparatus comprising:a heat carrier for receiving heat generated by the electronic component, the heat carrier being thermally coupled to the electronic component; a radiator for receiving heat conveyed by

1. A heat transfer apparatus for exhausting heat of an electronic component, the heat transfer apparatus comprising:a heat carrier for receiving heat generated by the electronic component, the heat carrier being thermally coupled to the electronic component; a radiator for receiving heat conveyed by the heat carrier and for emanating heat into air, the radiator being thermally coupled to the heat carrier, and the radiator comprising at least one of a plurality of fins extending from an upper face of a base; and a cooler comprising: a chamber; and a guide disposed adjacent to a first opening formed in fluid communication with the chamber; in fluid communication with the radiator for providing the passage of air therethrough, the radiator being received in the chamber, wherein heat received in the radiator is dissipated by airflow through the chamber, and the radiator being shaped for generating a substantially straight airflow therealong. 2. The heat transfer apparatus as in claim 1, the base being coupled to the heat carrier and for providing heat received from the heat carrier to the plurality of fins.3. The heat transfer apparatus as in claim 2, wherein each fin is rectangularly-shaped, planar and having a thickness within a range of 0.3 mm to 0.9 mm, and the upper face of the base and a lower face of the base being outwardly facing and generally parallel.4. The heat transfer apparatus as in claim 3, wherein each adjacent pair of fins having a fin gap, the fin gap being the distance between each pair of adjacent fins, and the fin gap and fin thickness having a ratio between the range of two (2) to four (4).5. The heat transfer apparatus as in claim 4, wherein the fin has a length within a range of 30 mm to 60 mm, the length of the fin being generally parallel to the longitudinal axis of the base.6. The heat transfer apparatus as in claim 4, wherein the combined height of the fins and the base is within a range of 15 mm to 25 mm, the combined height of the fins and the base being generally perpendicular to the longitudinal axis of the base.7. The heat transfer apparatus as in claim 4, wherein a distance between the two furthermost fins is within a range of 45 mm to 55 mm.8. The heat transfer apparatus as in claim 4, wherein a portion of the plurality of fins further extends from the lower face of the base, the fins extending from the upper face being parallel and outwardly opposite of the fins extending from the lower face.9. The heat transfer apparatus as in claim 2, the cooler comprising an air mover for generating air circulation between any pair of fins.10. The heat transfer apparatus as in claim 9, the cooler further comprising:a second openings and the chamber extending from the first opening to the second opening. 11. The heat transfer apparatus as in claim 10, the:guide for directing the flow of air from the chamber into the surroundings, wherein the air mover is disposed adjacent to the second opening, the air mover for introducing air surrounding the cooler into the chamber. 12. The heat transfer apparatus as in claim 10, theguide for directing the flow of air received into the chamber from the surrounding atmosphere, wherein the air mover is disposed proximal to the second opening, the air mover for extracting air from the chamber into the surrounding atmosphere. 13. The heat transfer apparatus as in claim 1, the heat carrier comprising an array of one or more heat pipes, each heat pipe for homogeneously distributing throughout the heat pipe heat concentrated at any portion of the heat pipe.14. The heat transfer apparatus as in claim 13, the heat carrier further comprising a pair of heat spreaders constituting two ends of the array of heat pipes.15. The heat transfer apparatus as in claim 14, wherein at least one heat spreader is coupled to one of electronic component or cooler.16. The heat transfer apparatus as in claim 14, wherein each heat spreader is shaped and sized for substantial contact with one of cooler or electronic component.17. A method for heat transfer and dissipation comprising the steps of:receiving heat generated by an electronic component into a heat carrier, the heat carrier being thermally coupled to the electronic component; receiving heat conveyed by the heat carrier into a radiator, the radiator being thermally coupled to the heat carrier, and the radiator comprising at least one of a plurality of fins extending from an upper face of a base; emanating heat from the radiator into air; and generating airflow through a chamber for dissipating heat received by the radiator, the radiator being disposed within the chamber and the chamber being in fluid communication with the radiator, and the radiator being shaped for generating a substantially straight airflow therealong; and disposing a guide adjacent to a first opening formed in fluid communication with the chamber. 18. The method for heat transfer and dissipation as in claim 17, the base being coupled to the heat carrier and for providing heat received from the heat carrier to the plurality of fins.19. The method for heat transfer and dissipation as in claim 18, wherein each fin is rectangularly-shaped, planar and having a thickness within a range of 0.3 mm to 0.9 mm, and the upper face of the base and a lower face of the base being outwardly facing.20. The method for heat transfer and dissipation as in claim 19, wherein each adjacent pair of fins having a fin gap, the fin gap being the distance between each pair of adjacent fins, and the fin gap and fin thickness having a ratio between the range of two (2) to four (4).21. The method for heat transfer and dissipation as in claim 20, wherein the fin has a length within a range of 30 mm to 60 mm, the length of the fin being generally parallel to the longitudinal axis of the base.22. The heat transfer apparatus as in claim 20, wherein the combined height of the fins and the base is within a range of 15 mm to 25 mm, the combined height of the fins and the base being generally perpendicular to the longitudinal axis of the base.23. The method for heat transfer and dissipation as in claim 20, wherein a distance between the two furthermost fins is within a range of 45 mm to 55 mm.24. The heat transfer apparatus as in claim 20, wherein a portion of the plurality of fins further extends from the lower face of the base, the fins extending from the upper face being parallel and outwardly opposite of the fins extending from the lower face.25. The method for heat transfer and dissipation as in claim 18, further including the step of generating air circulation between any pair of fins by an air mover, the air mover being coupled to the cooler.26. The method for heat transfer and dissipation as in claim 25, wherein the base includes a second openings and the chamber extending from the first opening to the second opening.27. The method for heat transfer and dissipation as in claim 26, further comprising the step of:directing the flow of air from the chamber into the surroundings using the guide, wherein the air mover is disposed proximal to the second opening, the air mover for introducing air from the surrounding atmosphere into the channel. 28. The method for heat transfer and dissipation as in claim 26, further comprising the step of:directing the flow of air received into the chamber from the surroundings using the guide, wherein the air mover is disposed adjacent to the second opening, the air mover for extracting air from the chamber into the surrounding atmosphere. 29. The method for heat transfer and dissipation as in claim 17, wherein the heat carrier includes an array of one or more heat pipes, each heat pipe for homogeneously distributing throughout the heat pipe heat concentrated at any portion of the heat pipe.30. The method for heat transfer and dissipation as in 29, wherein the heat carrier further includes a pair of heat spreaders constituting two ends of the array of heat pipes.31. The method for heat transfer and dissipation as in claim 30, wherein at least one heat spreader is coupled to one of electronic component or cooler.32. The method for heat transfer and dissipation as in claim 30, wherein each heat spreader is shaped and sized for substantial contact with one of cooler or electronic component.33. A heat transfer apparatus for exhausting heat of an electronic component, the heat transfer apparatus comprising: a heat carrier for receiving heat generated by the electronic component, the heat carrier being thermally coupled to the electronic component; a radiator for receiving heat conveyed by the heat carrier and for emanating heat into air, the radiator being thermally coupled to the heat carrier, and the radiator comprising at least one of a plurality of fins extending from an upper face and a lower face of a base; and a cooler comprising: a chamber in fluid communication with the radiator for providing the passage of air therethrough, the radiator being received in the chamber, wherein heat received in the radiator is dissipated by airflow through the chamber, and the radiator being shaped for generating a substantially straight airflow therealong.34. The heat transfer apparatus as in claim 33, the base being coupled to the heat carrier and for providing heat received from the heat carrier to the plurality of fins, wherein each fin is rectangularly-shaped, planar and having a thickness within a range of 0.3 mm to 0.9 mm, and the upper face of the base and a lower face of the base being outwardly facing and generally parallel.35. The heat transfer apparatus as in claim 34, wherein each adjacent pair of fins having a fin gap, the fin gap being the distance between each pair of adjacent fins, the fin gap and fin thickness having a ratio between the range of two (2) to four (4), and each fin has a length within a range of 30 mm to 60 mm, the length of the fin being generally parallel to the longitudinal axis of the base.36. The heat transfer apparatus as in claim 33, the cooler further comprising: a pair of openings and the chamber extending from one opening to the other opening; and a guide for directing the flow of air from the chamber into the surroundings, wherein the guide is disposed adjacent to one opening and an air mover is disposed adjacent to the other opening, the air mover for introducing air surrounding the cooler into the chamber.37. The heat transfer apparatus as in claim 33, the cooler further comprising: a pair of openings and the chamber extending from one opening to the other opening; and a guide for directing the flow of air received into the chamber from the surrounding atmosphere, wherein the guide is disposed adjacent to one opening and an air mover is disposed proximal to the other opening, the air mover for extracting air from the chamber into the surrounding atmosphere.