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특허 상세정보

Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) G01B-009/02    G01B-011/28    B24B-049/00   
미국특허분류(USC) 356/503; 356/630; 451/006
출원번호 US-0399310 (1999-09-20)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Fish &
인용정보 피인용 횟수 : 24  인용 특허 : 27
초록

An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.

대표
청구항

1. An apparatus for chemical polishing (CMP) of a wafer, comprising:(a) a rotatable polishing platen to support a polishing pad, the platen having a hole formed therethrough and rotatably mounted to a chassis; (b) a polishing head for holding the wafer against the polishing pad and, (c) an endpoint detector, comprising, (c1) a stationary light source capable of generating a light beam directed towards the wafer from a side of the wafer contacting the polishing pad, (c2) a window disposed adjacent to the hole formed through the platen, the window rotating...

이 특허에 인용된 특허 (27)

  1. Manoocher Birang ; Boguslaw Swedek. Adaptive endpoint detection for chemical mechanical polishing. USP2002056383058.
  2. Birang, Manoocher; Gleason, Allan. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations. USP2004016676717.
  3. Birang, Manoocher; Johansson, Nils; Gleason, Allan. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations. USP2004046719818.
  4. Birang Manoocher ; Pyatigorsky Grigory. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations. USP1999105964643.
  5. Hyde Thomas C. (Chandler AZ) Roberts John V. H. (Newark DE). Apparatus for interlayer planarization of semiconductor material. USP1993115257478.
  6. Birang Manoocher ; Gleason Allan ; Guthrie William L.. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus. USP2000046045439.
  7. Birang Manoocher ; Gleason Allan ; Guthrie William L.. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus. USP1999045893796.
  8. Dieckmann John T. ; Nowicki Brian J. ; Teagan W. Peter ; Zogg Robert. Heat pump water heater and storage tank assembly. USP1999095946927.
  9. Lustig Naftali E. (Croton-on-Hudson NY) Saenger Katherine L. (Ossining NY) Tong Ho-Ming (Yorktown Heights NY). In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing. USP1995075433651.
  10. Tang Wallace T. Y.. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical po. USP1999095949927.
  11. Tang, Wallace T. Y.. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization. USP2003096614529.
  12. Chaussade Pierre,FRX ; Heutte Catherine,FRX. Laminated safety pane for aircraft. USP1998065766755.
  13. Cheng David (San Jose CA) Hartlage Robert P. (Santa Clara CA) Zhang Wesley W. (Burlingame CA). Laser interferometer system for monitoring and controlling IC processing. USP1990054927485.
  14. Schultz Laurence D. (Boise ID). Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer. USP1992015081796.
  15. Sandhu Gurtej S. (Boise) Doan Trung T. (Boise ID). Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image o. USP1993035196353.
  16. Birang, Manoocher; Johansson, Nils; Gleason, Allan. Method for in-situ endpoint detection for chemical mechanical polishing operations. USP2003036537133.
  17. Birang Manoocher ; Gleason Allan ; Guthrie William L.. Method of forming a transparent window in a polishing pad. USP2001086280290.
  18. Koos Daniel A. (Boise ID) Meikle Scott (Boise ID). Optical end point detection methods in semiconductor planarizing polishing processes. USP1995055413941.
  19. Litvak Herbert E. (Cupertino CA). Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment. USP1996035499733.
  20. Takahashi Tsutomu (Yokohama JPX) Tohyama Keiichi (Kawasaki JPX) Takahashi Tamami (Yamato JPX). Polishing apparatus having endpoint detection device. USP1997095672091.
  21. Moriyama Shigeo (Tama JPX) Kawamura Yoshio (Kokubunji JPX) Homma Yoshio (Hinode-machi JPX) Kusukawa Kikuo (Fujino-machi JPX) Furusawa Takeshi (Hachioji JPX). Polishing method. USP1997035609511.
  22. Aiyer Arun A.. Polishing pad thinning to optically access a semiconductor wafer surface. USP2001066248000.
  23. Tolles, Robert D.. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus. USP2003026524164.
  24. Roberts John V. H. (Newark DE). Polishing pads. USP1997025605760.
  25. Cook Lee M. (Steelville PA) Roberts John V. H. (Newark DE) Jenkins Charles W. (Newark DE) Pillai Raj R. (Newark DE). Polishing pads and methods for their use. USP1996025489233.
  26. Kajimoto Nobuyuki (Omuta JPX) Tamaki Akihiro (Omuta JPX) Nagata Teruyuki (Omuta JPX). Sulfur-containing polyurethane base lens resin. USP1987074680369.
  27. Sandhu Gurtej S. (Boise ID) Doan Trung T. (Boise ID). System and method for real-time control of semiconductor a wafer polishing, and a polishing head. USP1996015486129.

이 특허를 인용한 특허 피인용횟수: 24

  1. Lee, Chu-An; Huang, Hui-Chi; Jangjian, Peng-Chung. Adaptive endpoint method for pad life effect on chemical mechanical polishing. USP2013028367429.
  2. Lee, Chu-An; Huang, Hui-Chi; Jangjian, Peng-Chung. Adaptive endpoint method for pad life effect on chemical mechanical polishing. USP2016059333619.
  3. Birang, Manoocher; Johansson, Nils; Gleason, Allan. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations. USP2013088506356.
  4. Birang, Manoocher; Johansson, Nils; Gleason, Allan. Apparatus and method for in-situ endpoint detection for semiconductor processing operations. USP2014088795029.
  5. Agarwal,Vishnu K.. Apparatuses and methods for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies. USP2007067229338.
  6. Allison, William; Huang, Ping; Scott, Diane; Frentzel, Richard; Kerprich, Robert. CMP pad with local area transparency. USP2015049017140.
  7. Cheng, Chung-Liang; Chen, Yen-Yu; Lee, Chang-Sheng; Zhang, Wei. Chemical-mechanical planarization system. USP20190110166650.
  8. Nakamura, Akira. Film thickness measuring device, polishing apparatus, film thickness measuring method and polishing method. USP20181110138548.
  9. Fukuda, Takeshi; Watanabe, Tsuguo; Hirose, Junji; Nakamura, Kenji; Doura, Masato. Method for manufacturing polishing pad. USP2013088500932.
  10. Fukuda, Takeshi; Watanabe, Tsuguo; Hirose, Junji; Nakamura, Kenji; Doura, Masato. Method for manufacturing polishing pad. USP2015069050707.
  11. Elledge, Jason B.. Methods and systems for planarizing workpieces, e.g., microelectronic workpieces. USP2009107604527.
  12. Elledge,Jason B.. Methods and systems for planarizing workpieces, e.g., microelectronic workpieces. USP2008037341502.
  13. Elledge,Jason B.. Methods and systems for planarizing workpieces, e.g., microelectronic workpieces. USP2007027182669.
  14. Cheng, Chung-Liang; Chen, Yen-Yu; Lee, Chang-Sheng; Zhang, Wei. Planarization method, method for polishing wafer, and CMP system. USP2016089425109.
  15. Birang,Manoocher; Gleason,Allan; Guthrie,William L.. Polishing assembly with a window. USP2007087255629.
  16. Namiki, Keisuke; Yasuda, Hozumi; Togashi, Shingo. Polishing method and polishing apparatus. USP2017069676076.
  17. Ogawa, Kazuyuki; Kazuno, Atsushi; Kimura, Tsuyoshi; Shimomura, Tetsuo. Polishing pad. USP2015049018099.
  18. Doura, Masato; Hirose, Junji; Nakamura, Kenji; Fukuda, Takeshi; Sato, Akinori. Polishing pad manufacturing method. USP2013018348724.
  19. Sato, Akinori; Hirose, Junji; Nakamura, Kenji; Fukuda, Takeshi; Doura, Masato. Process for manufacturing polishing pad. USP2013048409308.
  20. Allison, William; Scott, Diane; Kerprich, Robert; Huang, Ping; Frentzel, Richard. Soft polishing pad for polishing a semiconductor substrate. USP2015109156124.
  21. Birang, Manoocher; Pyatigorsky, Grigory. Substrate polishing metrology using interference signals. USP2010117841926.
  22. Birang, Manoocher; Pyatigorsky, Grigory. Substrate polishing metrology using interference signals. USP2010067731566.
  23. Birang, Manoocher; Pyatigorsky, Grigory. Substrate polishing metrology using interference signals. USP2013108556679.
  24. Birang, Manoocher; Pyatigorsky, Grigory. Substrate polishing metrology using interference signals. USP2012018092274.