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Method and apparatus for individually cooling components of electronic systems

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • H01L-023/34
출원번호 US-0696999 (2003-10-31)
발명자 / 주소
  • Beitelmal, Abdlmonem H.
  • Patel, Chandrakant D.
출원인 / 주소
  • Hewlett-Packard Development Company, L.P.
인용정보 피인용 횟수 : 43  인용 특허 : 32

초록

A cooling system is configured to supply individually metered amounts of cooling fluid to heat generating components, e.g., processors, micro-controllers, high speed video cards, disk drives, semi-conductor devices, and the like, of an electronic system. The cooling system includes at least one vari

대표청구항

1. A method of cooling a plurality of heat generating components of an electronic system having an enclosure and a plenum located within said enclosure, wherein a plurality of nozzles are provided along the plenum and wherein the plurality of valves are positioned alone the plurality of nozzles, sai

이 특허에 인용된 특허 (32)

  1. Otsuka Nobuo (Kamakura JPX), Air conditioner.
  2. Jokinen Teppo K., Air conditioner with selected ranges of relative humidity and temperature.
  3. Nakazato Hideaki,JPX ; Hayama Hirofumi,JPX ; Kishita Manabu,JPX ; Nakao Masaki,JPX, Air conditioning method in machine room having forced air-cooling equipment housed therein.
  4. Beitelmal, Abdlmonem H; Patel, Chandrakant D., Air jet cooling arrangement for electronic systems.
  5. Stuckert Paul E. (Katonah NY), Air jet powered cooling system for electronic assemblies.
  6. Horstman Raymond H. ; Chung Dennis D. ; Hasenoehrl Thomas R. ; Lam Quy ; Kha Luc Tu ; Groat J. Everett, Alternate ventilation system.
  7. Patel Chandrakant D. ; Wagner Guy ; Beitelmal Abdlmonem H. ; Chavez Gustavo A., Apparatus and method for air-cooling an electronic assembly.
  8. McDunn Kevin J. ; Limper-Brenner Linda ; Press Minoo D., Apparatus and method for spray-cooling an electronic module.
  9. Goto Yukifumi (Shizuoka JPX) Chuma Yoshihiro (Shizuoka JPX) Narikiyo Hidetoshi (Shizuoka JPX), Central air conditioning system having remote controller in a plurality of rooms for starting or stopping air conditioni.
  10. Criss-Puszkiewicz Cynthia Rae ; Beadel John Leagh ; Haefeli Paul Scott ; Parrott Gregory Hopkins ; Tedsen Kirk Arnim, Central forced air cooling of a gaming machine.
  11. Takemae Motohiro (Fujisawa JPX) Okada Tsuguo (Yokohama JPX) Yamamoto Haruhiko (Yokohama JPX), Cooling method control system for electronic apparatus.
  12. Yuuichi Takeda JP, Cooling system for a computer apparatus.
  13. Bainbridge Gary Dean ; Betro Carla ; Dixit Mayankkumar M. ; Duong Quang ; Mistry Mahesh B. ; Palaszewski Stephen John ; Patel Chandrakant B., Cooling system for stand-alone battery cabinets.
  14. Gudmundsson Bjorn,SEX, Cooling system for telecommunications equipment arranged in a cabinet or similar.
  15. George A. Kaminski ; George F. Squibb, Dual power supply fan control-thermistor input or software command from the processor.
  16. Ohmori Akimitsu (Tokyo JPX) Kinjo Morishige (Tokyo JPX), Electronic equipment having integrated circuit device and temperature sensor.
  17. Rumbut ; Jr. John T., Environmentally controlled circuit pack and cabinet.
  18. Avinoam Livni IL, Forced convection cooling system for electronic equipment.
  19. Lee Richard (7F ; No. 152-1 ; Sec. 7 ; Chung Shan N. Rd. Taipei TWX), Heat dissipating apparatus.
  20. Havey Mort L. ; Hitch William Robert, Heat spreader system for cooling heat generating components.
  21. Tikhtman Jacob (Northbrook IL) Patel Bhakti S. (Bensenville IL), High accuracy weathering test machine.
  22. Corman Randal A. (Renton WA) Waldron Terry R. (Maple Valley WA), High reliability avionic cooling system.
  23. Ferchau Joerg (Morgan Hill CA) Trujillo Victor (Fremont CA), Method and apparatus for mounting, cooling, interconnecting, and providing power and data to a plurality of electronic m.
  24. Dage, Gerhard Allen; Girard, Hilton W., Multiple zone automatic HVAC control system and method.
  25. Lego Francois (Ste Luce Sur Lorie FRX), Process for supplying cold to an open refrigerated enclosure for display and sale of fresh products in a supermarket.
  26. Criniti Joseph ; Larranaga Javier I. ; Kim Edward E. ; Santos Esteban ; Vicente Nathaniel B., Semiconductor thermal protection arrangement.
  27. Chu Richard C. ; Chrysler Gregory M. ; Simons Robert E., Sub-dew point cooling of electronic systems.
  28. Dunsmore Richard F. (Marietta GA), Supplemental cooling system for avionic equipment.
  29. Brian G. Russell ; Robert R. Kreitzer ; Christopher R. Coleman ; Theodore S. Hetke, Thermal control for a test and measurement instrument.
  30. Nair Rajesh ; Holman Roger ; Gagnon David, Thermal management system.
  31. Severson Mark H. (Rockford IL) Tinkler Ian (Rockford IL), Two-channel cooling for providing back-up cooling capability.
  32. Wray Donald L. (Lauderdale FL), Ventilation system for modular electronic housing.

이 특허를 인용한 특허 (43)

  1. Ong, Brett C.; Milo, Michael T.; Vu, Quyen T., Air baffle with integrated tool-less expansion card attachment.
  2. Doll, Wade J.; Kelley, Douglas P., Air conditioning systems for computer systems and associated methods.
  3. Joshi,Shrikant Mukund; Bhatti,Mohinder Singh, Air cooled computer chip.
  4. Lima, David J.; Kull, John, Air flow ducts for cooling electronic devices within a data processing unit.
  5. Bash,Cullen E.; Beitelmal,Abdlmonem H.; Sharma,Ratnesh K.; Patel,Chandrakant D., Air-cooled heat generating device airflow control system.
  6. Mallia, Michael; Fulton, James, Cabinet for electronic equipment.
  7. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
  8. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
  9. Cheng, Hao-Der; Peng, Wen-Tang, Computer server system and fan module thereof.
  10. Miyahara, Munetoshi; Sawai, Jun, Cooling duct and electronic apparatus.
  11. Siracki, Glenn T.; Rosswurm, Kim James; Riley, Patrick J.; Keegan, Jeremy J., Cooling duct attachment and sealing for a motor drive.
  12. Aybay, Gunes; Lima, David J.; Moeller, Olaf, Cooling system for a data processing unit.
  13. Aybay, Gunes; Lima, David J.; Moeller, Olaf, Cooling system for a data processing unit.
  14. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  15. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  16. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  17. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  18. Aybay, Gunes; Pradeep, Sindhu; Frailong, Jean-Marc; Lima, David J., Front-to-back cooling system for modular systems with orthogonal midplane configuration.
  19. Aybay, Gunes; Pradeep, Sindhu; Frailong, Jean-Marc; Lima, David J., Front-to-back cooling system for modular systems with orthogonal midplane configuration.
  20. Chen, Lee-Long; Huang, Chien-Hsiung; Tu, Ya-Sen, Heat exchange device and closed-type electronic apparatus using the same.
  21. Yu, Zhihai Zack; Lee, Tommy C., Heat exchanger system and method for circulating external air about a chipset.
  22. Weiss, Bruce W., Heat sink cooling arrangement for multiple power electronic circuits.
  23. Weiss, Bruce W., Heat sink cooling arrangement for multiple power electronic circuits.
  24. Wexler, Peter, In-row air containment and cooling system and method.
  25. Hosokawa, Daisuke, Information processing apparatus.
  26. Craft, Jr.,Thomas Francis, Jet impingement cooling apparatus and method.
  27. Ong, Brett C.; Olesiewicz, Timothy W.; Willis, Clifford B., Low airflow impedance PCBA handling device.
  28. Beitelmal,Abdlmonem H.; Patel,Chandrakant D., Method and apparatus for individually cooling components of electronic systems.
  29. Wang,David G.; Muller,P. Keith, Minimization of cooling air preheat for maximum packaging density.
  30. Siracki, Glenn T.; Riley, Patrick J., Motor drive cooling duct system and method.
  31. Graczyk, Frank J.; Ramey, Samuel C.; Fleming, James N.; Herbst, Paul M.; McGrath, Michael J.; Wentworth, Joseph D.; Eaton, Alva B., Passive cooling systems for network cabinet.
  32. Griffel,Marc; Hummel,Jacques; Schaefer,Michael; Uhl,Karl H., Passive rear door for controlled hot air exhaust.
  33. Leigh, Kevin B; Megason, George D; Sherrod, David W, Plenums for removable modules.
  34. Bash, Cullen E.; Beitelmal, Abdlmonem H.; Sharma, Ratnesh K.; Patel, Chandrakant D., Refrigeration system with parallel evaporators and variable speed compressor.
  35. Bash, Cullen E.; Beitelmal, Abdlmonem H.; Sharma, Ratnesh K.; Patel, Chandrakant D., Refrigeration system with parallel evaporators and variable speed compressor.
  36. Kull, John; Lima, David J.; Vanhoy, Gilbert, Removable fan tray.
  37. Kull, John; Lima, David J.; Vanhoy, Gilbert, Removable fan tray.
  38. Nishiyama, Shinichi; Miyamoto, Kenichi; Tanaka, Shigeaki, Storage apparatus.
  39. Miyamoto, Kenichi; Nishiyama, Shinichi, Storage device.
  40. Espinoza-Ibarra, Ricardo; Barr, Andrew H., System fan management based on system loading options for a system having replaceable electronics modules.
  41. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
  42. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
  43. Wei,Wen, Telecom equipment chassis using modular air cooling system.
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