Method and apparatus for individually cooling components of electronic systems
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-007/20
H01L-023/34
출원번호
US-0696999
(2003-10-31)
발명자
/ 주소
Beitelmal, Abdlmonem H.
Patel, Chandrakant D.
출원인 / 주소
Hewlett-Packard Development Company, L.P.
인용정보
피인용 횟수 :
43인용 특허 :
32
초록▼
A cooling system is configured to supply individually metered amounts of cooling fluid to heat generating components, e.g., processors, micro-controllers, high speed video cards, disk drives, semi-conductor devices, and the like, of an electronic system. The cooling system includes at least one vari
A cooling system is configured to supply individually metered amounts of cooling fluid to heat generating components, e.g., processors, micro-controllers, high speed video cards, disk drives, semi-conductor devices, and the like, of an electronic system. The cooling system includes at least one variable speed fan, e.g., blower, configured to supply fluid through a centralized plenum and thereafter through a plurality of nozzles to the components of the electronic system. Each of the nozzles contains a valve to control the amount of fluid flow through the each of the nozzles. A controller is provided to control the operation of the variable speed fan and the operation of each of the valves is also controlled by a controller. By substantially controlling the amount of cooling fluid supplied to each of the components based upon the amount of heat generated by each component, the cooling system of the present invention may operate in a more efficient manner, thereby requiring substantially less energy than conventional cooling systems.
대표청구항▼
1. A method of cooling a plurality of heat generating components of an electronic system having an enclosure and a plenum located within said enclosure, wherein a plurality of nozzles are provided along the plenum and wherein the plurality of valves are positioned alone the plurality of nozzles, sai
1. A method of cooling a plurality of heat generating components of an electronic system having an enclosure and a plenum located within said enclosure, wherein a plurality of nozzles are provided along the plenum and wherein the plurality of valves are positioned alone the plurality of nozzles, said method comprising:activating at least one variable speed blower and a plurality of valves, each of said valves terminating substantially close to a respective heat generating component, to thereby supply cooling fluid to said heat generating components; sensing the temperatures of each of said heat generating components; determining whether said sensed temperatures are within a predetermined temperature range; and varying said supply of said cooling fluid to said heat generating components in response to said sensed temperatures falling outside of said predetermined temperature range, wherein the step of varying said supply of said cooling fluid comprises varying the supply of cooling fluid through one or more of the plurality of nozzles by manipulating one or more of the plurality of valves. 2. The method according to claim 1, further comprising:determining whether the measured temperatures of said heat generating components are each below or equal to a predetermined minimum set point temperature. 3. The method according to claim 2, further comprising:decreasing the supply of said cooling fluid to said heat generating components for those heat generating components having measured temperatures that fall below or equal said predetermined minimum set point temperature. 4. The method according to claim 3, further comprising:decreasing the speed of said at least one blower in response to said decreasing cooling fluid supply to said heat generating components exceeding said increasing cooling fluid supply to said heat generating components. 5. The method according to claim 2, further comprising:increasing the supply of said cooling fluid to said heat generating components for those heat generating components having measured temperatures that exceed said predetermined minimum set point temperature. 6. The method according to claim 5, further comprising:increasing the speed of said at least one blower in response to said decreasing cooling fluid supply to said heat generating components falling below said increasing cooling fluid supply to said heat generating components. 7. The method according to claim 1, wherein the electronic system comprises a computer system and the heat generating components comprise one or more of processors, micro-controllers, high speed video cards, disk drives, and semi-conductor devices.8. The method according to claim 1, further comprising:supplying the plenum with cooling fluid with the at least one variable speed blower prior to supplying the cooling fluid to said heat generating components; and substantially maintaining a portion of the cooling fluid at a substantially uniform pressure. 9. The method according to claim 1, wherein the step of sensing the temperatures of each of said heat generating components comprises detecting the temperatures with one or more temperature sensors.10. The method according to claim 1, wherein the step of sensing the temperatures of each of said heat generating components comprises anticipating the temperatures of each of said heat generating components based upon an impending load on each of the heat generating components.11. A method for cooling a heat generating component, said heat generating component being housed in a computer system, said method comprising:causing cooling fluid to flow through a plenum, wherein a variable speed blower is positioned to vary the cooling fluid flow through the plenum, and wherein a nozzle is positioned along the plenum; causing cooling fluid to flow from the plenum and through the nozzle, wherein a valve is positioned along the nozzle to control the cooling fluid flow through the nozzle; delivering cooling fluid from the nozzle to tbe heat generating component, wherein the heat generating component is positioned to directly receive the cooling fluid from the nozzle; sensing the temperature of the heat generating component; determining whether the sensed temperature is within a predetermined temperature range; and varying the supply of said cooling fluid to the heat generating component in response to the sensed temperature falling outside of the predetermined temperature range. 12. The method according to claim 11, further comprising:supplying the plenum with cooling fluid with the at least one variable speed blower prior to supplying the cooling fluid to said heat generating component; and substantially maintaining a portion of the cooling fluid at a substantially uniform pressure. 13. The method according to claim 11, wherein the step of sensing the temperatures of the heat generating component comprises anticipating the temperature of the heat generating component based upon an impending load on the heat generating component.
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