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Cooling system for electronics with improved thermal interface 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0649454 (2003-08-26)
발명자 / 주소
  • Sarraf, David B.
  • DeHoff, Robert E.
  • Hartenstine, John
  • Todd, Jr., John J.
출원인 / 주소
  • Thermal Corp.
대리인 / 주소
    Duane Morris LLP
인용정보 피인용 횟수 : 31  인용 특허 : 39

초록

A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat to be transferred from the heat tra

대표청구항

1. A heat pipe system comprising:a heat transfer block including at least two clip channels that are defined in spaced relation to one another through a central portion of said heat transfer block; and, a heat pipe coupled to the heat transfer block by a flattened planar clip having (i) a central ch

이 특허에 인용된 특허 (39)

  1. Robert L. McMahan ; Damon W. Broder, Apparatus and method for cooling a heat generating component in a computer.
  2. Susan A. Yeager ; Rakesh Bhatia, Apparatus and method for mounting a heat generating component in a computer system.
  3. Chao Shun-Lung (Westboro MA), Arrangement for mounting and cooling high density tab IC chips.
  4. Cipolla Thomas Mario ; Holung Joseph Anthony ; Kamath Vinod ; Mansuria Mohanlal Savji ; Mok Lawrence Shungwei ; Wong Tin-Lup, Computer incorporating heat dissipator with hinged heat pipe arrangement for enhanced cooling capacity.
  5. Arii Hiroshi (Kawasaki JPX) Kawada Hirohito (Mitaka JPX) Yoshida Takashi (Tokyo JPX) Nonaka Chiaki (Tokyo JPX), Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat con.
  6. Lu Chun-Hsin,TWX, Cooling device for computer component.
  7. Goto Kazuhiko,JPX ; Mashiko Koichi,JPX ; Saito Yuji,JPX ; Nguyen Thang Toan,JPX ; Mochizuki Masataka,JPX ; Eguchi Katsuo,JPX ; Hasegawa Hitoshi,JPX, Cooling device for notebook personal computer.
  8. Cipolla, Thomas M; Jamal-Eddine, Tarek J; Mok, Lawrence S, Cooling mechanism for an electronic device.
  9. Suzuki Masahiro,JPX, Cooling system for electronic packages.
  10. O'Connor Michael ; Haley Kevin ; Bhatia Rakesh ; Adams Daniel Thomas ; Kast Michael Andrew, Cooling system for thin profile electronic and computer devices.
  11. Furuya, Keizo, Cooling unit for cooling heat generating component, circuit module including the cooling unit, and electronic apparatus mounted with the circuit module.
  12. Ishikawa, Kenichi, Cooling unit having a heat-receiving section and a cooling fan, and electronic apparatus incorporating the cooling unit.
  13. Lai, Chih-Hsi; Fang, Hawk, Double heat exchange module for a portable computer.
  14. Lee, Kuo-Shao, Edge-mounted heat dissipation device having top-and-bottom fan structure.
  15. Li Hsi-Shang,TWX ; Hsiao Chen-Ang,TWX, Flat plate heat pipe cooling system for electronic equipment enclosure.
  16. Wei, Wen-Chen, Flexible heat pipe.
  17. Nakagawa Tsuyoshi,JPX ; Neho Yasushi,JPX ; Sakamoto Naoyuki,JPX ; Ohashi Shigeo,JPX ; Ohmura Yoshito,JPX ; Iwama Yukiko,JPX ; Nakajima Tadakatsu,JPX ; Kondo Yoshihiro,JPX ; Iwai Susumu,JPX ; Matsushi, Heat dissipation structure for a personal computer including two heat dissipation block assemblies and two heat dissipation plates.
  18. Lev Jeffrey A. ; Deluga Ronald E., Heat dissipation structure for electronic apparatus component.
  19. Cipolla Thomas Mario, Heat pipe arrangement for enhancing the cooling capacity of a laptop computer.
  20. Todd, John J.; Longsderff, David R.; Toth, Jerome E., Heat pipe fin stack with extruded base.
  21. Hood ; III Charles D. ; Liu Peter, Heat sink assembly with rotating heat pipe.
  22. Feng Ku Wang TW, Heat sink modular structure inside an electronic product.
  23. Herman W. Chu ; Rakesh Bhatia, High performance notebook PC cooling system.
  24. Rajasubramanian Sathya ; DeVilbiss Roger S. ; Dedmon Thomas C. ; Quisenberry Tony M. ; Borman Ronald ; Boger ; Jr. Allen D., Hybrid air conditioning system and a method therefor.
  25. Podwalny Gary ; Penniman Mark ; Howell Bryan, Hybrid cooling heat exchanger fin geometry and orientation.
  26. Austin Thomas A. ; Greer Stephen ; Low Andrew, Integral heat pipe enclosure.
  27. Austin Thomas A. ; Greer Stephen ; Low Andrew, Integral heat pipe enclosure.
  28. Meyer ; IV George A. (Conestoga PA) Toth Jerome E. (Hatboro PA) Longsderff Richard W. (Lancaster PA), Integrated circuit cooling apparatus.
  29. Meyer ; IV George A. ; Toth Jerome E., Integrated circuit heat sink with rotatable heat pipe.
  30. Bookhardt Gary L. ; McEuen Shawn S., Integrated heat dissipation apparatus.
  31. Smith Russell ; Penniman Mark B. ; Steigerwald Todd, Integrated hybrid cooling with EMI shielding for a portable computer.
  32. Tanzer Herbert J. (Topanga CA), Method of making a heat pipe with improved end cap.
  33. Nelson Daryl (Beaverton OR), Multiple-fan microprocessor cooling through a finned heat pipe.
  34. Kobayashi Takashi,JPX ; Nonaka Takashi,JPX ; Sumi Noriaki,JPX ; Nakaoka Kunio,JPX, Notebook computer storage case.
  35. Cromwell S. Daniel, Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU).
  36. Mochizuki Masataka,JPX ; Saito Yuji,JPX ; Hasegawa Masashi,JPX ; Ono Motoyuki,JPX, Personal computer cooling device having hinged heat pipe.
  37. Lee, Sang-cheol, Supporting block of VGA chipset cooling device.
  38. Hasnain Shabbir ; Rakesh Bhatia, Thermally conductive interface member.
  39. Shanker Bangalore J. (Santa Clara CA) Belani Jagdish G. (Cupertino CA), Use of a heat pipe integrated with the IC package for improving thermal performance.

이 특허를 인용한 특허 (31)

  1. Farrow, Timothy Samuel; Herring, Dean Frederick, Apparatus, system, and method for efficient heat dissipation.
  2. Lin, Chia-Jui; Chang, Kuo-Ching; Lin, Hui-Chih, Cooling module for use with a projection apparatus.
  3. Lin, Yu-Cheng, Easily disassembling cooling apparatus.
  4. Lin, Yu-Cheng, Easily disassembling cooling apparatus.
  5. Chen, Chin-Hsien; Chen, Rung-An, Fastening device for thermal module.
  6. Lin,Cheng Hsing, Heat dissipating assembly of heat dissipating device.
  7. Wang, Shaw-Fuu; Huang, Ting-Chiang; Syu, Sheng-Jie; Chen, Chiun-Peng; Chung, Chih-Kuang; Wang, Li-Ting, Heat dissipating module.
  8. Wu, Hung-Yi; Ye, Zhen-Xing; Sun, Ke; Chen, Ming-Ke; Chen, Xiao-Zhu, Heat dissipation assembly.
  9. Chen, Chun-Chi; Yang, Hong-Cheng; Liu, Xin-Lei, Heat dissipation device.
  10. Hwang, Ching Bai; Meng, Jin Gong, Heat dissipation device.
  11. Zhou, Zhi-Yong; Qin, Ji-Yun; Liu, Hao-Xia, Heat dissipation device.
  12. Lee,Hsieh Kun; Xia,Wan Lin; Li,Tao; Xiao,Min Qi, Heat dissipation device for heat-generating electronic component.
  13. Yang, Jian, Heat dissipation device with bracket.
  14. Li, Wei; Wu, Yi-Qiang, Heat dissipation device with heat pipe and elastic member.
  15. Hung,Jui Wen, Heat dissipation module for electronic device.
  16. Chen,Chin ming; Huang,Yu hung; Wu,Wei fang, Heat dissipation structure.
  17. Huang,Yu Nien; Yu,Shun Ta; Wang,Cheng Yu; Tseng,Jim Fat; Chien,Tsan Nan; Liu,Yu, Heat-dissipation device with elastic member and heat-dissipation method thereof.
  18. Wang,Frank; Fan,Jui Chan, Heatsink device of video graphics array and chipset.
  19. Frank,Wang; Chun Yi,Chang, Heatsink module for electronic device.
  20. Van Elmpt, Rob Franciscus Maria, Light emitting module, heat sink and illumination system.
  21. Wertz, Darrell Lynn, Lower profile heat dissipating system embedded with springs.
  22. Ahrens,Michael E., Optical transponder with active heat transfer.
  23. Farner, Rachel; Kokas, Jay W.; Trotman, Kenneth J.; Querns, Kerry R., PWB cooling system with heat dissipation through posts.
  24. Liu, Tay Jian; Sun, Chih Hsien; Tung, Chao Nien; Hou, Chuen Shu, Performance testing apparatus for heat pipes.
  25. Liu, Tay Jian; Tung, Chao Nien; Hou, Chuen Shu; Sun, Chih Hsien, Performance testing apparatus for heat pipes.
  26. Liu, Tay-Jian; Hou, Chuen-Shu; Tung, Chao-Nien, Performance testing apparatus for heat pipes.
  27. Liu,Tay Jian; Hou,Chuen Shu; Tung,Chao Nien, Performance testing apparatus for heat pipes.
  28. Liu,Tay Jian; Sun,Chih Hsien; Tung,Chao Nien; Hou,Chuen Shu, Performance testing apparatus for heat pipes.
  29. Hung, Jui-Wen; Liang, Shang-Chih, Resilient fastener and thermal module incorporating the same.
  30. Hsu,Hul Chun, Shrinkage-free sealing structure of heat pipe.
  31. Wertz, Darrell; Howell, David Gregory; Terhune, Albert; Szu, Ming Lun, Socket connector with flexible orientation heat pipe.
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