초록 ▼

An electromagnetic compliant (EMC) shield for shielding electronic components on a circuit board from electromagnetic energy generated by electronics modules inside the EMC shield. The shield also contains electromagnetic energy generated by the electronic components on the circuit board from escapi

An electromagnetic compliant (EMC) shield for shielding electronic components on a circuit board from electromagnetic energy generated by electronics modules inside the EMC shield. The shield also contains electromagnetic energy generated by the electronic components on the circuit board from escaping to outside the EMC shield. The EMC shield includes a first side and a second side. The first side has a plurality of openings. Each of the openings is configured to receive a respective electronics module. The second side has a bottom edge with a groove to receive a conductive gasket. The first and second sides extend normal to the circuit board when the EMC shield is mounted to the circuit board.

대표청구항 ▼

1. An electromagnetic compliant (EMC) shield for shielding electronic components on a circuit board from electromagnetic energy generated by electronics modules inside the EMC shield and containing electromagnetic energy generated by the electronic components on the circuit board from escaping to ou

1. An electromagnetic compliant (EMC) shield for shielding electronic components on a circuit board from electromagnetic energy generated by electronics modules inside the EMC shield and containing electromagnetic energy generated by the electronic components on the circuit board from escaping to outside the EMC shield, the EMC shield comprising:a first side having a plurality of openings, each of the openings configured to receive one of the electronics modules; a second side having a bottom edge with a groove therein to receive a conductive gasket, the first and second sides extending substantially normal to the circuit board when the EMC shield is mounted to the circuit board; and a plurality of electrostatic discharge (ESD) tabs, each of the ESD tabs disposed adjacent to a respective opening and configured for electrical communication with a conductive element of a respective one of the electronics modules. 2. The EMC shield of claim 1 further comprising a third side disposed between the first and second sides, wherein the third side has a plurality of fins for removal of heat generated inside the EMC shield.3. The EMC shield of claim 1 wherein the second side has a plurality of fins for removal of heat generated inside the EMC shield.4. The EMC shield of claim 1 further comprising a conductive gasket partially disposed in the groove in the bottom edge of the second side.5. The EMC shield of claim 1 further comprising one of the electronics modules coupled to the EMC shield at one of the openings in the first side and extending inside the EMC shield.6. The EMC shield of claim 5 wherein the one of the electronics modules comprises an optics module.7. The EMC shield of claim 6 wherein the optics module comprises a laser transmitter and a laser receiver.8. The EMC shield of claim 1 wherein at least one of the first and second sides has an opening adapted to receive a fastener for attachment of the EMC shield to the circuit board.9. The EMC shield of claim 1 wherein the first and second sides are fabricated from a thermally conductive material.10. An electromagnetic compliant (EMC) circuit module comprising:a circuit board having an electronic component mounted thereon; and an EMC shield having: a conductive gasket in contact with the circuit board; a first side having a plurality of openings, each of the openings configured to receive one of the electronics modules, the first side extending substantially normal to the circuit board; a second side attached to the first side and having a bottom edge with a groove therein to receive the conductive gasket, the second side extending substantially normal to the circuit board; and a plurality of electrostatic discharge (ESD) tabs, each of the ESD tabs disposed adjacent to a respective opening on the first and configured for electrical communication with a conductive element of a respective one of the electronics modules. 11. The circuit of claim 10 further comprising a third side disposed between the first and second sides, wherein the third side has a plurality of fins for removal of heat generated inside the EMC shield.12. The circuit of claim 10 wherein the second side has a plurality of fins for removal of heat generated inside the EMC shield.13. The circuit of claim 10 further comprising a conductive gasket partially disposed in the groove in the bottom edge of the second side.14. The circuit of claim 10 further comprising one of the electronics modules coupled to the EMC shield at one of the openings in the first side and extending inside the EMC shield.15. The circuit of claim 10 wherein at least one of the first and second sides has an opening adapted to receive a fastener for attachment of the EMC shield to the circuit board.16. The circuit of claim 10 wherein the first and second sides are fabricated from a thermally conductive material.17. The circuit of claim 10 wherein the circuit board is a printed circuit board.