초록 ▼

A combined heater and heat sink assembly regulates the temperature of a device under test. The combined heating/cooling assembly includes a heater assembly inlay that is received within a heat sink. The heater assembly includes a heating surface that is coplanar with a cooling surface of the heat si

A combined heater and heat sink assembly regulates the temperature of a device under test. The combined heating/cooling assembly includes a heater assembly inlay that is received within a heat sink. The heater assembly includes a heating surface that is coplanar with a cooling surface of the heat sink. In operation, the heating/cooling assembly provides concurrent hot and cold contact points for the device under test. The heater assembly is thermally insulated from the heat sink such that the majority of the heat generated by the heater assembly is directly applied to the device under test; very little of the generated heat is lost to the heat sink. On the other hand, the heat sink provides a relatively low thermal resistance between the device under test and a cold source such as a coolant. Accordingly, the combined heating/cooling assembly provides parallel thermal paths between the device under test and both a hot source and a cold source.

대표청구항 ▼

1. A method for controlling the temperature of a device under test, said method comprising:(a) obtaining a temperature control apparatus comprising: a heater assembly configured to provide a first thermal path to a device under test; and a heat sink configured to provide a second thermal path to sai

1. A method for controlling the temperature of a device under test, said method comprising:(a) obtaining a temperature control apparatus comprising: a heater assembly configured to provide a first thermal path to a device under test; and a heat sink configured to provide a second thermal path to said device under test, said first and second thermal paths corresponding to parallel thermal resistances associated with said device under test; wherein said heater assembly comprises a heating surface and said heat sink comprises a cooling surface that is coplanar with, and physically distinct from, said heating surface; (b) applying the cooling surface to a first portion of said device under test; and (c) concurrently applying the heating surface to a second portion of said device under test in response to a test temperature setting. 2. A method according to claim 1, further comprising the step of generating a control signal that controls the temperature of said heater assembly, said generating step being responsive to said test temperature setting.3. A method according to claim 1, further comprising the steps of:measuring the temperature of said device under test; and adjusting the temperature of said heater assembly in response to the temperature of said device under test. 4. The method according to claim 1, wherein the test device is an electronic semiconductor circuit device.5. The method according to claim 4, wherein the test device is a microprocessor chip.