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A spray cooling system for efficiently thermally managing a single or multiple semiconductor chip package. The spray cooling system includes a heat exchanger unit having a pump unit and a reservoir, a coaxial tube fluidly connected to the heat exchanger unit, a coupler unit attached to the coaxial t

A spray cooling system for efficiently thermally managing a single or multiple semiconductor chip package. The spray cooling system includes a heat exchanger unit having a pump unit and a reservoir, a coaxial tube fluidly connected to the heat exchanger unit, a coupler unit attached to the coaxial tube, and a spray module where the coupler unit is removably connected to the spray module. The heat exchanger unit has an air tolerant design that allows for the entry and release of air without interfering with the operation thereof.

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1. A spray cooling system for thermally managing an electronic device, comprising:a spray module; and a heat exchanger unit fluidly connected to said spray module, said heat exchanger including: a reservoir for storing a volume of coolant; a chamber fluidly connected to said reservoir, wherein said

1. A spray cooling system for thermally managing an electronic device, comprising:a spray module; and a heat exchanger unit fluidly connected to said spray module, said heat exchanger including: a reservoir for storing a volume of coolant; a chamber fluidly connected to said reservoir, wherein said chamber is positioned above said reservoir for receiving gases; a pump unit fluidly connected to said reservoir; and a pressure relief valve fluidly connecting said chamber to an exterior of said heat exchanger unit. 2. The spray cooling system of claim 1, wherein said pressure relief valve is positioned within an upper portion of said chamber.3. The spray cooling system of claim 1, wherein said heat exchanger unit includes a condensing section for condensing coolant vapor.4. The spray cooling system of claim 3, wherein said condensing section is comprised of a condensing passage fluidly connected to a fluid passage that is fluidly connected to said reservoir for allowing condensed coolant to return to said reservoir.5. The spray cooling system of claim 4, including a plurality of condensing members within said condensing passage.6. The spray cooling system of claim 5, including a plurality of heat exchange members protruding externally of said heat exchange unit opposite of said condensing members.7. The spray cooling system of claim 1, including a vapor passage fluidly connected to a main passage containing returned coolant and to said condensing passage.8. The spray cooling system of claim 1, wherein said vapor passage extends upwardly from said main passage.9. The spray cooling system of claim 1, wherein said heat exchanger unit is fluidly connected to said spray module by a coaxial tube containing a supply flow and a return flow of coolant.10. A heat exchanger apparatus for an electronic device thermal management system, comprising:a pump unit; a reservoir for storing a volume of coolant, wherein said reservoir is fluidly connected to said pump unit; a chamber fluidly connected to said reservoir, wherein said chamber is positioned above said reservoir for receiving gases; and a pressure relief valve fluidly connecting an upper portion of said chamber to an exterior of said heat exchanger unit. 11. The heat exchanger apparatus of claim 10, wherein less than 25% of the total interior volume of said reservoir and said chamber is comprised of liquid coolant.12. The heat exchanger apparatus of claim 10, including a condensing section for condensing coolant vapor fluidly connected to said reservoir.13. The heat exchanger apparatus of claim 12, wherein said condensing section is comprised of a condensing passage fluidly connected to a fluid passage that is fluidly connected to said reservoir for allowing condensed coolant to return to said reservoir.14. The heat exchanger apparatus of claim 13, including a plurality of condensing members within said condensing passage.15. The heat exchanger apparatus of claim 14, including a plurality of heat exchange members protruding externally of said condensing section opposite of said condensing members.16. The heat exchanger apparatus of claim 13, including a vapor passage fluidly connected to a main passage containing returned coolant and to said condensing passage.17. The heat exchanger apparatus of claim 16, wherein said vapor passage extends upwardly from said main passage.18. The heat exchanger apparatus of claim 10, wherein said pump unit is fluidly connected to a spray module by a coaxial tube containing a supply flow and a return flow of coolant.19. A method of operating a heat exchanger unit for an electronic device thermal management system, said method comprising:passing a return flow coolant into a main passage fluidly connected to a reservoir; permitting gases within said reservoir to flow upwardly into a chamber through a passage within an upper portion of said reservoir; permitting a coolant vapor to flow through a vapor passage to a condensing passage; condensing said coolant vapor within said condensing passage; permitting said condensed coolant to flow through a fluid passage fluidly connected to said reservoir; and permitting the collection of gases within a gas chamber. 20. The method of operating a heat exchanger unit of claim 19, including the step of purging said chamber.21. The method of operating a heat exchanger unit of claim 19, wherein less than 25% of the total interior volume of said heat exchanger unit is comprised of liquid coolant.22. A method of manufacturing a computer system having a semiconductor to be thermally managed, said method comprising the steps of:securing a spray module upon said semiconductor, wherein said spray module has an initial state of dry; fluidly connecting a heat exchanger unit to said spray module, wherein said heat exchanger unit has an initial state prior to connecting to said spray module; and allowing air to migrate into said heat exchanger unit. 23. The method of manufacturing a computer system of claim 22, wherein said initial state of said heat exchanger unit is pre-charged with at least 10% liquid coolant by available interior fluid volume.24. A spray cooling system for thermally managing an electronic device, comprising:a spray module; and a heat exchanger unit fluidly connected to said spray module, said heat exchanger including a reservoir for storing a volume of coolant, a chamber fluidly connected to said reservoir, wherein said chamber is positioned above said reservoir for receiving gases, and a pump unit fluidly connected to said reservoir; wherein said heat exchanger unit includes a condensing section comprised of a condensing passage fluidly connected to a fluid passage that is fluidly connected to said reservoir for allowing condensed coolant to return to said reservoir. 25. The spray cooling system of claim 24, including a plurality of condensing members within said condensing passage.26. The spray cooling system of claim 25, including a plurality of heat exchange members protruding externally of said heat exchange unit opposite of said condensing members.27. The spray cooling system of claim 24, including a vapor passage fluidly connected to a main passage containing returned coolant and to said condensing passage.28. The spray cooling system of claim 27, wherein said vapor passage extends upwardly from said main passage.29. A spray cooling system for thermally managing an electronic device, comprising:a spray module; and a heat exchanger unit fluidly connected to said spray module by a coaxial tube containing a supply flow and a return flow of coolant, said heat exchanger including a reservoir for storing a volume of coolant, a chamber fluidly connected to said reservoir, wherein said chamber is positioned above said reservoir for receiving gases, and a pump unit fluidly connected to said reservoir. 30. A heat exchanger apparatus for an electronic device thermal management system, comprising:a pump unit; a reservoir for storing a volume of coolant, wherein said reservoir is fluidly connected to said pump unit; a chamber fluidly connected to said reservoir, wherein said chamber is positioned above said reservoir for receiving gases; and a condensing passage fluidly connected to a fluid passage that is fluidly connected to said reservoir for allowing condensed coolant to return to said reservoir. 31. The heat exchanger apparatus of claim 30, including a plurality of condensing members within said condensing passage.32. The heat exchanger apparatus of claim 31, including a plurality of heat exchange members protruding externally of said heat exchange unit opposite of said condensing members.33. The heat exchanger apparatus of claim 30, including a vapor passage fluidly connected to a main passage containing returned coolant and to said condensing passage.34. The heat exchanger apparatus of claim 33, wherein said vapor passage extends upwardly from said main passage.35. A heat exchanger apparatus for an electronic device thermal management system, comprising:a pump unit; a reservoir for storing a volume of coolant, wherein said reservoir is fluidly connected to said pump unit; a chamber fluidly connected to said reservoir, wherein said chamber is positioned above said reservoir for receiving gases; and wherein said pump unit is fluidly connected to a spray module by a coaxial tube containing a supply flow and a return flow of coolant.