[특허]Pixel structure and an associated method of fabricating the same

DRS Sensors &; Targeting Systems, Inc.

검색어에 아래의 연산자를 사용하시면 더 정확한 검색결과를 얻을 수 있습니다.
검색연산자

검색도움말
검색연산자	기능	검색시 예
()	우선순위가 가장 높은 연산자	예1) (나노 (기계 \| machine))
공백	두 개의 검색어(식)을 모두 포함하고 있는 문서 검색	예1) (나노 기계) 예2) 나노 장영실
\|	두 개의 검색어(식) 중 하나 이상 포함하고 있는 문서 검색	예1) (줄기세포 \| 면역) 예2) 줄기세포 \| 장영실
!	NOT 이후에 있는 검색어가 포함된 문서는 제외	예1) (황금 !백금) 예2) !image
*	검색어의 *란에 0개 이상의 임의의 문자가 포함된 문서 검색	예) semi*
""	따옴표 내의 구문과 완전히 일치하는 문서만 검색	예) "Transform and Quantization"

과학기술 지식인프라 ScienceON

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

특허 상세정보

MyON담기

내보내기 페이스북 공유 트위터 공유 카카오톡 공유

Pixel structure and an associated method of fabricating the same

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G01J-005/00
미국특허분류(USC)	250/338.4; 250/338.1; 250/332
출원번호	US-0346213 (2003-01-17)
발명자 / 주소	Ionescu, Adrian C. Howard, Philip Earl
출원인 / 주소	DRS Sensors & Targeting Systems, Inc.
대리인 / 주소	Norris, McLaughlin &
인용정보	피인용 횟수 : 3 인용 특허 : 13

초록
▼

A pixel structure, which forms one element of a focal plane array, includes a bolometer having a detector and an insulator. The detector that is made from a material that absorbs incident thermal radiation and has an electrical resistance that varies in response to changes in the temperature of the material. The insulator has a plurality of serpentine legs disposed completely underneath the detector so that the insulator extends between the detector and the substrate. And the insulator supports the detector in a spaced-apart relationship with respect to the substrate to thermally isolate the detector from the substrate. To further improve the performance of the bolometer, the bolometer includes a resonant layer between the detector and the insulator. The resonant layer is disposed such that areas defined between the detector and the resonant layer, and between the resonant layer and the insulator, form first and second resonant cavities, respectively.

대표
청구항
▼

1. A pixel structure of a bolometer-based focal plane array for detecting radiation comprising:a substrate; and a bolometer comprising: a detector supported in a spaced-apart relationship with respect to said substrate, said detector adapted to absorb incident thermal radiation, wherein said detector has an electrical resistance that varies in response to changes in the temperature of said detector; an insulator comprising a plurality of serpentine legs disposed completely underneath said detector, wherein said insulator extends between said detector and said substrate to support said detector in a spaced-apart relationship with respect to said substrate; and a resonant layer disposed between said detector and said insulator, wherein said resonant layer is disposed such that an area defined between said detector and said resonant layer forms a first resonant cavity, and wherein said resonant layer is disposed such that an area defined between said resonant layer and said insulator forms a second resonant cavity. 2. A pixel structure according to claim 1 wherein said detector and said insulator are disposed in respective planes and are at least partially separated by a gap.3. A pixel structure according to claim 2 wherein said substrate and said insulator are disposed in respective planes and are at least partially separated by a gap.4. A pixel structure according to claim 1 wherein said detector comprises vanadium oxide.5. A pixel structure according to claim 1 further comprising a plurality of base anchors extending between said substrate and said insulator, wherein said base anchors support said insulator in a spaced-apart relationship with respect to said substrate.6. A pixel structure according to claim 5 wherein said base anchors are frustum shaped.7. A pixel structure according to claim 5 wherein said bolometer further comprises at least one elevation anchor extending between said detector and said insulator, wherein said at least one elevation anchor supports said detector in a spaced-apart relationship with respect to said insulator.8. A pixel structure according to claim 7 wherein said at least one elevation anchor is frustum shaped.9. A pixel structure according to claim 1 wherein said insulator further at least partially reflects incident thermal radiation at least partially toward said detector.10. A pixel structure according to claim 1 wherein said plurality of serpentine legs of said insulator comprise a plurality of branches comprised of a first set of branches extending in a first direction and a second set of branches that interconnect respective branches of the first set and that extend in a second direction that is different than the first direction.11. A pixel structure comprising:a substrate; and a bolometer comprising: a detector supported in a spaced-apart relationship with respect to said substrate, said detector adapted to absorb incident thermal radiation, wherein said detector has an electrical resistance that varies in response to changes in the temperature of said detector; an insulator comprising a plurality of two-dimensional serpentine legs extending between said detector and said substrate to support said detector in a spaced-apart relationship with respect to said substrate; and a resonant layer disposed between said detector and said insulator, wherein said resonant layer is disposed such that an area defined between said detector and said resonant layer forms a first resonant cavity, and wherein said resonant layer is disposed such that an area defined between said resonant layer and said insulator forms a second resonant cavity. 12. A pixel structure according to claim 11 wherein said insulator is disposed completely underneath said detector.13. A pixel structure according to claim 11 wherein said two-dimensional serpentine legs of said insulator comprise a plurality of branches comprised of a first set of branches extending in a first direction and a second set of branches that interconnect respective branches of the first set and that extend in a second direction that is different than the first direction.14. A pixel structure according to claim 11 wherein said detector and said insulator are disposed in respective planes and are at least partially separated by a gap.15. A pixel structure according to claim 14 wherein said substrate and said insulator are disposed in respective planes and are at least partially separated by a gap.16. A pixel structure according to claim 11 wherein said detector comprises vanadium oxide.17. A pixel structure according to claim 11 further comprising a plurality of base anchors extending between said substrate and said insulator, wherein said base anchors support said insulator in a spaced-apart relationship with respect to said substrate.18. A pixel structure according to claim 17 wherein said base anchors are frustum shaped.19. A pixel structure according to claim 17 wherein said bolometer further comprises at least one elevation anchor extending between said detector and said insulator, wherein said at least one elevation anchor supports said detector in a spaced-apart relationship with respect to said insulator.20. A pixel structure according to claim 19 wherein said at least one elevation anchor is frustum shaped.21. A pixel structure according to claim 11 wherein said insulator further at least partially reflects incident thermal radiation at least partially toward said detector.22. A method of fabricating a pixel structure comprising:depositing a first sacrificial layer upon a substrate; forming a plurality of thermal impedance legs upon the first sacrificial layer; depositing a second sacrificial layer upon the thermal impedance legs; depositing a resonant layer upon the second sacrificial layer, wherein the resonant layer comprises an electrically conductive material; depositing a bolometer material upon the resonant layer, wherein the bolometer material is adapted to absorb incident thermal radiation, wherein the bolometer material has an electrical resistance that varies in response to changes in the temperature of the bolometer material, and wherein the bolometer material is deposited such that an area defined between the bolometer material and the resonant layer forms a first resonant cavity; and removing the first and second sacrificial layers such that the bolometer material is spaced-apart from the substrate, wherein the second sacrificial layer is removed such that an area defined between the thermal impedance legs and the resonant layer forms a second resonant cavity. 23. A method according to claim 22 wherein depositing the bolometer material comprises depositing the bolometer material such that the bolometer material completely covers the thermal impedance legs following the removal of the first and second sacrificial layers.24. A method according to claim 22 wherein forming the thermal impedance legs comprises forming the plurality of thermal impedance legs in a serpentine shape.25. A method according to claim 24 wherein forming the thermal impedance legs comprises forming the plurality of thermal impedance legs in a two-dimensional serpentine leg shape having a plurality of branches comprised of a first set of branches extending in a first direction and a second set of branches that interconnect respective branches of the first set and that extend in a second direction that is different than the first direction.26. A method according to claim 22 wherein forming the thermal impedance legs comprises:creating a plurality of contact holes completely through the first sacrificial layer; forming a plurality of base anchors within the contact holes; and forming the plurality of thermal impedance legs upon the first sacrificial layer and in mechanical connection with the base anchors such that the base anchors support the thermal impedance legs in a spaced-apart relationship with respect to said substrate when the first sacrificial layer is removed. 27. A method according to claim 26 wherein forming the base anchors comprises forming the plurality of base anchors in a v-shape in cross-section.28. A method according to claim 22 wherein forming the thermal impedance legs comprises:creating a plurality of holes completely through the first sacrificial layer to thereby define a plurality of contact locations; depositing a first thermal insulating layer upon the first sacrificial layer and at least partially within the holes at the contact locations; creating a plurality of apertures through the first thermal insulating layer at the contact locations; depositing a first electrically conductive layer upon at least a portion of the first thermal insulating layer and within the apertures; and depositing a second thermal insulating layer upon the first thermally conductive material, wherein depositing the first thermal insulating layer, the first electrically conductive layer and second thermal insulating layer at the contact locations forms a plurality of base anchors. 29. A method according to claim 28 wherein said depositing the bolometer material comprises depositing the bolometer material such that the bolometer material is in electrical communication with said first electrically conductive layer.30. A method according to claim 29 further comprising forming an electrical connector between the electrically conductive layer and the bolometer material before depositing the bolometer material, wherein forming the electrical connector comprises:creating at least one cavity completely through the resonant layer, the second sacrificial layer and second thermal insulating layer to thereby define at least one connection location on the first electrically conductive layer; depositing a thermal insulating layer upon the resonant layer and at least partially within the at least one cavity at the at least one connection location; creating at least one opening through the thermal insulating layer at the at least one connection location to thereby expose the first electrically conductive layer; and depositing a second electrically conductive layer within the opening upon the exposed first electrically conductive layer such that the second electrically conductive layer is in electrical communication with the first electrically conductive layer and at least partially extends beyond the opening such that when the bolometer material is deposited upon the second sacrificial layer the bolometer material is in electrical communication with the second electrically conductive material.

이 특허에 인용된 특허 (13)

이 특허를 인용한 특허 피인용횟수: 3

IPC 상위 출원인

내보내기

상세정보
내보내기 구분	파일저장 인쇄 메일전송
구성항목	관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	> 총 건의 자료가 검색되었습니다. > 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) > 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. > 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) > 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오 > ~ > Text(ASCII format) Excel format

과학기술 지식인프라 ScienceON

ScienceON Chatbot

연합인증

특허 상세정보

Pixel structure and an associated method of fabricating the same

초록
▼

대표
청구항
▼

이 특허에 인용된 특허 (13)

이 특허를 인용한 특허 피인용횟수: 3

IPC 상위 출원인

과제정보

상세정보조회

원문조회

IPC 상세정보(version : 201201)

연구과제 성과물(0)

참여연구원의 다른 문헌(0)

처리중입니다.

잠시만 기다려주세요.

ScienceON Chatbot

연합인증

특허 상세정보

Pixel structure and an associated method of fabricating the same

초록 ▼

대표청구항 ▼

이 특허에 인용된 특허 (13)

이 특허를 인용한 특허 피인용횟수: 3

IPC 상위 출원인

과제정보

상세정보조회

원문조회

IPC 상세정보(version : 201201)

연구과제 성과물(0)

참여연구원의 다른 문헌(0)

처리중입니다.

잠시만 기다려주세요.

초록
▼

대표
청구항
▼