IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0329416
(2002-12-27)
|
우선권정보 |
KR-0015975 (2002-03-25) |
발명자
/ 주소 |
- Lee, Sang Seok
- Park, Sang Ho
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
3 인용 특허 :
37 |
초록
▼
A bonding machine for fabrication of a large size LCD having an upper stage and a lower stage provided in a bonding chamber to face each other, for adsorbing the first and second substrates carried in the bonding chamber, and bonding the substrates together. The bonding machine having supporting mea
A bonding machine for fabrication of a large size LCD having an upper stage and a lower stage provided in a bonding chamber to face each other, for adsorbing the first and second substrates carried in the bonding chamber, and bonding the substrates together. The bonding machine having supporting means in the bonding chamber, lifting means, and process supplementing means fitted in the bonding chamber so as to be rotatable and movable up/down. The method including loading the first and second substrates on respective stages, driving the supporting means to support the second substrate loaded on the upper stage, and evacuating the bonding chamber, the upper stage adsorbing the second substrate and bonding the first and second substrates together, and lifting the bonded first and second substrates from the lower stage by using the lifting means, and unloading the first and second substrates.
대표청구항
▼
1. A method for fabricating an LCD by using a bonding machine having an upper stage and a lower stage provided in a bonding chamber to face each other, for adsorbing the first and second substrates carried in the bonding chamber, and bonding the substrates together, supporting means in the bonding c
1. A method for fabricating an LCD by using a bonding machine having an upper stage and a lower stage provided in a bonding chamber to face each other, for adsorbing the first and second substrates carried in the bonding chamber, and bonding the substrates together, supporting means in the bonding chamber for receiving the second substrate, lifting means for lifting the substrate when the first substrate is loaded on the lower stage, and the bonded first and second substrates are unloaded from the lower stage, and process supplementing means fitted in the bonding chamber so as to be rotatable and movable up/down, for one of holding the bonded substrates and supporting the substrate to be held at the upper stage, the method comprising:loading the first and second substrates on respective stages; driving the supporting means to support the second substrate loaded on the upper stage, and evacuating the bonding chamber; adsorbing the second substrate using the upper stage and bonding the first and second substrates together; and lifting the bonded first and second substrates from the lower stage by using the lifting means, and unloading the first and second substrates. 2. A method as claimed in claim 1, wherein loading includes:carrying the second substrate into the bonding chamber by using a carrying device, and adsorbing the second substrate to the upper stage, and carrying the first substrate into the bonding chamber by using the carrying device, supporting the first substrate on the lifting means, and adsorbing the first substrate to the lower stage. 3. A method as claimed in claim 2, wherein supporting the first substrate on the lifting means includes:supporting the first substrate on second lifting means at first and subsequently supporting the second substrate on first lifting means, the lifting means including first lifting means at the lower stage for supporting a central part of the substrate, and second lifting means at opposite edges of a top of the lower stage for supporting a periphery of the substrate. 4. A method as claimed in claim 2, further comprising supporting one side of the carrying device using a driving process supplementing means.5. A method as claimed in claim 4, wherein supporting one side of the carrying device using the driving process supplementing means includes:driving the driving part for moving the supporting parts to a location of the carrying device, and rotating the supporting parts so that the carrying device can be supported on the supporting part, the process supplementing means including a rotating shaft fitted so as to be rotatable and movable up/down, a supporting part formed as one unit with the rotating shaft at one end thereof for one of being brought into contact with a part of the substrate and the carrying device, and a driving part fitted to the other end of the rotating shaft. 6. A method as claimed in claim 1, further comprising venting the bonding chamber for applying a pressure to the bonded substrates after adsorbing the second substrate using the upper stage.7. A method as claimed in claim 6, wherein venting includes:holding the bonded substrates at the lower stage by using the process supplementing means, and venting the bonding chamber to an atmospheric state. 8. A method as claimed in claim 7, wherein holding the bonded substrates at the lower stage by using the process supplementing means includes:driving the driving part to move the supporting part to a location of the bonded substrates, rotating the supporting part so that the carrying part is supported thereon, and moving the supporting part down for holding the bonded substrates at the lower stage, the process supplementing means including a rotating shaft fitted to be rotatable and movable up/down, a supporting part formed as one unit with the rotating shaft at one end thereof for being brought into contact with a part of the substrate or the carrying device, and a driving part fitted to the other end of the rotating shaft. 9. A method as claimed in claim 1, further comprising fixing the bonded substrates after adsorbing the second substrate using the upper stage.10. A method as claimed in claim 1, wherein loading the first and second substrates includes adsorbing the substrates by vacuum.11. A method as claimed in claim 1, further comprising adsorbing the upper stage electro-statically, and moving the second substrate supported on the supporting means upward after driving the supporting means.12. A method as claimed in claim 11, wherein adsorbing the upper stage electro-statically using the second substrate includes driving the process supplementing means for pressing the second substrate on the supporting means toward the upper stage.13. A method as claimed in claim 1, further comprising loading the substrate to be bonded before lifting the bonded first and second substrates.14. A method as claimed in claim 1, further comprising setting a sealant to fix the first and second substrates together after bonding the first and second substrates.15. A method as claimed in claim 1, further comprising moving the upper stage upward to separate the upper stage from the bonded first and second substrates.16. A method as claimed in claim 13, further comprising unloading the pressed substrates by driving the first and second lifting means for separating the bonded substrates.
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