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Method and apparatus for thermal management of integrated circuits

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/44
  • H01L-023/34
  • H01L-035/04
출원번호 US-0122613 (2002-04-11)
발명자 / 주소
  • Cordes, Michael James
  • Cordes, Steven Alan
  • Ghoshal, Uttam Shyamalindu
  • Robinson, Errol Wayne
  • Speidell, James Louis
출원인 / 주소
  • International Business Machines Corporation
인용정보 피인용 횟수 : 21  인용 특허 : 13

초록

Method and apparatus for thermal management of an integrated circuit. A semiconductor device includes an integrated circuit and an integrated thermoelectric cooler formed on a common substrate. A semiconductor device is fabricated by forming an integrated circuit on a front side of the substrate and

대표청구항

1. A method of fabricating a semiconductor device comprising:forming an integrated circuit on a front side of a substrate; and forming an integrated thermoelectric cooler capable of cooling the integrated circuit on a back side of the substrate. 2. The method, as claimed in claim 1, wherein forming

이 특허에 인용된 특허 (13)

  1. Hazen William A. (Hopkinton MA), Apparatus for cooling circuits.
  2. Vandersande Ian W. ; Ewell Richard ; Fleurial Jean-Pierre ; Lyon Hylan B., Cooling device featuring thermoelectric and diamond materials for temperature control of heat-dissipating devices.
  3. Shiomi Hiromu,JPX ; Nakahata Hideaki,JPX ; Nishibayashi Yoshiki,JPX ; Shikata Shin-ichi,JPX, Diamond heat sink including microchannel therein and methods for manufacturing diamond heat sinks.
  4. Ghoshal Uttam Shyamalindu, Electrically-isolated ultra-thin substrates for thermoelectric coolers.
  5. Shiu Shou-Yi,TWX ; Fang Yu-Ping,TWX ; Lui Hon-Hung,TWX, Integrated thermoelectric cooler formed on the backside of a substrate.
  6. Farnworth Warren M. (Nampa ID), Process for manufacturing semiconductor device structures cooled by Peltier junctions and electrical interconnect assemb.
  7. Iwamoto Koji (Kanagawa JPX), Structure of semiconductor laser package.
  8. Burward-Hoy Trevor (Cupertino CA), Sub-ambient temperature electronic package.
  9. Iwata Yuji,JPX ; Sasa Noriyasu,JPX, Thermoelectric cooling module and method for manufacturing the same.
  10. Ghoshal Uttam Shyamalindu, Thermoelectric cooling with dynamic switching to isolate heat transport mechanisms.
  11. Ghoshal Uttam Shyamalindu, Thermoelectric cooling with plural dynamic switching to isolate heat transport mechanisms.
  12. Johnson Gregory M. ; Casey Jon A. ; Dwyer Scott R. ; Long David C. ; Prettyman Kevin M., Thermoelectric devices and methods for making the same.
  13. Ghoshal Uttam Shyamalindu, Two dimensional thermoelectric cooler configuration.

이 특허를 인용한 특허 (21)

  1. Shimogishi,Kenji; Matsuo,Yoshihiko; Tsuda,Yoichi, Electronic heat pump device, laser component, optical pickup and electronic equipment.
  2. Waibel, Brian J., Energy storage systems.
  3. Dai, Ming-Ji; Liu, Chun-Kai; Yu, Chih-Kuang, Fabricating method of light emitting diode package.
  4. Yu, Chih-Kuang; Liu, Chun-Kai; Dai, Ming-Ji, Flexible thermoelectric device.
  5. Mowry, Anthony C.; Farber, David G.; Austin, Michael J.; Moore, John E., Heat management using power management information.
  6. Mowry, Anthony C.; Farber, David G.; Austin, Michael J.; Moore, John E., Heat management using power management information.
  7. Leech,Phillip A.; Frame,Kenneth B.; Alzien,Khaldoun, Heat sink detection.
  8. Leech, Phillip A.; Alzien, Khaldoun; Jacobs, William R., Heat sink verification.
  9. Veerasamy, Vijayen S.; Alvarez, Jemssy, Insulating glass (IG) or vacuum insulating glass (VIG) unit including light source, and/or methods of making the same.
  10. Dai, Ming Ji; Liu, Chun Kai; Yu, Chih Kuang, Light emitting diode package structure and fabricating method thereof.
  11. Phan, Khoi A.; Rangarajan, Bharath; Singh, Bhanwar, Mitigating heat in an integrated circuit.
  12. Janak, Christopher; Capezza, Steve; Jaggers, Christopher M; McAfee, David A; Merrikh, Ali Akbar; Grossman, Matthew; Poteracki, Nicholas; West, Jefferson; Hughes, Paul, Multi-compartment computing device with shared cooling device.
  13. Pham,Hung M.; Warner,Wayne R., Refrigeration system including thermoelectric module.
  14. Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.
  15. Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.
  16. Griebenow, Uwe; Hoentschel, Jan; Scheiper, Thilo; Beyer, Sven, Semiconductor device comprising a stacked die configuration including an integrated Peltier element.
  17. Griebenow, Uwe; Hoentschel, Jan; Scheiper, Thilo; Beyer, Sven, Semiconductor device comprising a stacked die configuration including an integrated peltier element.
  18. Nakazato, Norio; Sudo, Kimihiko, Semiconductor light source device.
  19. Hsu, Louis Lu-Chen; Wang, Ping-Chuan; Wei, Xiaojin; Zhu, Huilong, Thermoelectric 3D cooling.
  20. Akei, Masao; Ignatiev, Kirill M; Jayanth, Nagaraj; Pham, Hung M; Caillat, Jean-Luc M, Vapor compression circuit and method including a thermoelectric device.
  21. Akei, Masao; Ignatiev, Kirill; Jayanth, Nagaraj; Pham, Hung M.; Caillat, Jean-Luc M., Vapor compression circuit and method including a thermoelectric device.
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