$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Clamping case 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/14
  • H05K-007/18
출원번호 US-0918989 (2001-07-31)
발명자 / 주소
  • Gustine, Gary
  • Ham, Charles
  • Kusz, Matthew
  • Sawyer, Michael
출원인 / 주소
  • ADC Telecommunications, Inc.
대리인 / 주소
    Fogg and Associates, LLC
인용정보 피인용 횟수 : 6  인용 특허 : 74

초록

In one embodiment, a case for confining at least one circuit card to a location within a housing is provided. The case has at least one slot that contains the circuit card. The case also has at least one actuator adapted to clamp the circuit card within the slot.

대표청구항

1. A case for confining a first circuit card to a particular location within a housing, the case comprising:a pair of opposing end walls; a pair of opposing side walls coupled to the end walls; wherein the pair of end walls and the side walls form a slot; an actuator disposed within the slot, the ac

이 특허에 인용된 특허 (74)

  1. Hayashi Eriko (Kanagawa) Sakai Tadashi (Kanagawa) Noda Fumio (Kanagawa JPX), AM/FM receiver with insertable memory card and display of frequencies and respective geographic regions.
  2. Giehl Kevin (Milwaukee WI) Brandt David (Milwaukee WI) Franke David (Menasha WI), AT computer card mounting bracket.
  3. Johnson Robert W. ; Eddings ; II Richard L. ; Curlee James D., Apparatus and method for mounting and cooling a system component assembly in a computer.
  4. Houston, John M., Apparatus for maintaining electronic equipment and the like at low temperatures in hot ambient environments.
  5. Cantrell Gregory A. (Mesquite TX), Apparatus for supporting circuit cards in slot locations.
  6. Murchison Loren ; Burbano Carlos ; Reeve Brian Geroge, Backplate for securing a circuit card to a computer chassis.
  7. Weimer Michael G. ; Wetzel David K. ; Powers Larry D., Beverage dispenser tap cover with position sensing switch.
  8. Boda James C. (Winneconne WI), Cam adjustment assembly.
  9. Hendrix Walter M. ; Ati Babi ; Guy Michael, Circuit board enclosure having heat transfer circuit board support.
  10. Ross Suydam Heitkamp, Circuit card captivation and ejection mechanism including a lever to facilitate removal of the mechanism from a housing.
  11. Cipolla Thomas M. (Katonah NY) Coteus Paul W. (Yorktown Heights NY), Circuit card interconnecting structure.
  12. Hallum Donald W. (Glendale AZ) Gray ; Jr. George N. (Phoenix AZ), Circuit card retainer.
  13. Giannatto Carl J. ; Cornish Kevin C., Closed loop cooling housing for printed circuit card-mounted, sealed heat exchanger.
  14. Niggemann Richard E. (Rockford IL), Cold chassis for cooling electronic circuit components on an electronic board.
  15. Martin Jacob (Wellesley MA), Combination conductive and convective heatsink.
  16. Grapes Thomas F. (Columbia MD) Fertig Timothy M. (Pasadena MD) Schroeder Mark S. (Severna Park MD), Composite heat transfer means.
  17. Randall D. Hutchison ; Robert Shiffbauer ; Kevan Smith, Concentrical slot telecommunications equipment enclosure.
  18. Andress Jeffrey D. ; Pottebaum Kenneth L., Constrain layer damping of a disc drive printed wiring assembly.
  19. Ito Eiji (Aichi JPX), Control device case.
  20. Falaki Hamid Reza,GBX ; Gates William George,GBX ; Hanlon Patrick Francis,IEX ; Keegan Martin Michael Mark,IEX ; Kelly Daniel Peter,IEX, Cooling electronic apparatus.
  21. Leyssens Francois J. C. (Mortsel BEX) Rombouts Hendrikus M. J. (Zoersel BEX), Cooling system.
  22. Rauth Erich (Auenwald DEX) Form Ernst (Sulzbach DEX), Cooling system for communications devices with high power losses.
  23. Rein Charles R. (Panama City FL), Electronic card mount and heat transfer assembly for underwater vehicles.
  24. Bitller Jean-Pierre (Plaisir FRX) Faucher Pascal (Longjumeau FRX) Hang-Hu Monique (Sainte Genevieve des Bois FRX) Pelet Andr (Maurepas FRX), Electronic circuit housing.
  25. Hata Kanji (Katano JPX) Maruyama Masahiro (Mino JPX) Itemadani Eiji (Sakai JPX), Electronic component mounting device.
  26. Ono Hideyo (Hyogo JPX) Yoshitake Kunitoshi (Hyogo JPX) Kakuta Nobuyuki (Hyogo JPX), Electronic device housing with temperature management functions.
  27. Hiroaki Momiyama JP; Takao Mokutani JP, Electronic equipment.
  28. Murphy John E. (Los Angeles CA) Gardner William T. (Los Angeles CA), Electronic module with self-activated heat pipe.
  29. Zapach Trevor,CAX ; Jeakins William D.,CAX ; Muegge Steven,CAX, Electronic unit.
  30. Beavers Roger L., Enclosure for high-density subscriber line modules.
  31. Hutchison Randy ; Shiffbauer Robert, Enclosure for telecommunications equipment.
  32. Hutchison Randy ; Shiffbauer Robert, Enclosure for telecommunications equipment.
  33. Bachman Wesley H. ; Baska Douglas A. ; Butterbaugh Matthew Allen ; Kang Sukhvinder Singh ; Lubahn Kenneth Edward ; Mullenbach Brian Scott ; Qualters Kevin Robert, Enhanced circuit board arrangement for a computer.
  34. Pandolfi Richard, Environmental system for rugged disk drive.
  35. Eckberg Eric Alan ; Goodman Dale Ernest ; Hanssen Steven Alf ; Price Kirk Barrows, Gasket frame for grounding an actuator flex cable in a disc drive.
  36. Baum Walter (Hanover DEX) Still Michael (Langenhagen DEX) Becker Erich (Seeheim-Jugenheim DEX), Heat-producing elements with heat pipes.
  37. Sharp, Stanley O., High density electronics packaging system for hostile environment.
  38. Fathi Saul S. (Huntington NY), Holder and heat sink for electronic components.
  39. Eggert Hans-Joachim (Karlsfed DT) Oberberger Otto (Gilching DT) Zenkert Heinrich (Munich DT), Housing for electrical communications and measuring devices.
  40. Pelet Andr (Maurepas FRX) Cachot Jacques (Saint Michel sur Orge FRX), Housing for submersible equipment.
  41. Bitller Jean-Pierre (Orsay FRX) Pelet Andr (Maurepas FRX) Wirth Guy (Paris FRX) Hang-Hu Monique (Saintry sur Seine FRX), Housing for underwater electronic circuits.
  42. Cobb Lane C. (Ridgefield WA) Kuzmanich Gregory M. (Portland OR), I/O riser card for motherboard in a personal computer/server.
  43. Kausch Marvin L. (San Jose CA), Isolation chamber for electronic devices.
  44. Laetsch Erich K., Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction.
  45. Laetsch, Erich K., Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction.
  46. Laetsch, Erich K., Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction.
  47. Holt George T., Locking personal computer expansion card guide.
  48. Stephen D. Smithson ; Bruce Garrett ; Roger Ramseier ; Steve J. Dean ; Paul Wiley, Method and assembly for installation or removal of printed circuit card.
  49. Buron Douglas J. (Plantation FL) Steinman Sheldon (Miramar FL) Wray Donald L. (Lauderhill FL), Modular expandable housing arrangement for electronic apparatus.
  50. Harris Michael P. (San Diego CA), Modular segment adapted to provide a passively cooled housing for heat generating electronic modules.
  51. Richard G Sevier, Module removal system.
  52. Glover Hugh B. (Cary NC) Jones Clifford T. (Raleigh NC), Optical network unit.
  53. Davis Arthur A. (Harrold Wood GB2) Eady Robert W. (London GB2), Optical repeaters.
  54. Davis Aurthur A. (Harrold Wood GB2) Eady Robert W. (London GB2), Optical repeaters.
  55. Glover Richard John,CAX ; Bishop Michael Reginald,CAX ; Tencer Michal Stefan,CAX, Packaging system for thermally controlling the temperature of electronic equipment.
  56. Mefford John B. (Madison IN) Scott Bob G. (Brownsburg IN) Cotherman Jesse W. (Camby IN), Pipe jack.
  57. Jordan Thomas W. (Berkeley IL), Printed circuit board faceplate assembly.
  58. Goodman Walter A. (Binghamton NY) Ott ; III William F. (Endicott NY), Printed circuit card latching and stiffening assembly.
  59. Daniels, Fredrick; Kachurick, Christopher, Protective pot or container.
  60. Perry Michael W. (Ocean NJ), Repeater housing and circuit mounting structure.
  61. Morris ; Jr. Corydon E., Retention gasket with cooperating cover.
  62. Hastings Robert J. ; Varghese Paily T. ; Allen Joseph R., Securing a card in an electronic device.
  63. Farnworth Warren M. ; Kinsman Larry D. ; Moden Walter L., Semiconductor device socket, assembly and methods.
  64. Naedel Richard G. (Rockville MD) Bogdan Francis J. (Baltimore MD) Richardson Michael (Annapolis MD) Rosenberger Keith (Baltimore MD), Severe environment enclosure with thermal heat sink and EMI protection.
  65. Heinzer Hans E. (Chula Vista CA), Submarine housing for submarine cable system repeater components or the like.
  66. Wade H. White ; Michael J. Fisher, System and method for a self aligning multiple card enclosure with hot plug capability.
  67. Hutchison, Randall D.; Taubert, Tomasz, Telecommunications enclosure with individual, separated card holders.
  68. Randall D. Hutchinson ; Tomasz Taubert, Telecommunications enclosure with individual, separated card holders.
  69. Ernest Pagnozzi, Thermal cover for T1/HDSL repeater case.
  70. Garcia-Ortiz Asdrubal, Thermal management apparatus for a sealed enclosure.
  71. Reimer William A. (Wheaton IL), Thermal management plate.
  72. Vos David L. ; Hughto-Delzer Francis W., Thermally conductive vibration isolators.
  73. Ater Dan,ILX ; Avitan Eli,ILX, Ventilation and cooling control system for modular platforms.
  74. Jungersen Thoger G. (Rte. 2 ; Box 94-R Concord VA 24538), Wheelchair safety brakes.

이 특허를 인용한 특허 (6)

  1. Fischer,Larry G.; Wayman,Michael J., Apparatus for enclosing electronic components.
  2. Fischer, Larry G.; Moreau, Eric S.; Martell, Gregory, Apparatus for enclosing electronic components used in telecommunication systems.
  3. Wayman,Michael J., Chassis mounted heat sink system.
  4. Gustine,Gary; Ham,Charles; Kusz,Matthew; Sawyer,Michael, Clamping receptacle.
  5. Rapp, John W.; Nagurny, Nicholas J.; Gouldey, Brent I.; Jones, Mark; Normark, Wendy S., Electronics module, enclosure assembly housing same, and related systems and methods.
  6. Rapp, John W.; Nagurny, Nicholas J.; Gouldey, Brent I.; Jones, Mark; Normark, Wendy S., Enclosure assembly housing at least one electronic board assembly and systems using same.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로