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A bridge clip with a leaf holds an integrated heat spreader on a die during curing. The leaf may have at least two metal portions with different coefficients of thermal expansion (CTE) to exert a changing force on the heat spreader over temperature. The die may be coupled to the heat spreader with a

A bridge clip with a leaf holds an integrated heat spreader on a die during curing. The leaf may have at least two metal portions with different coefficients of thermal expansion (CTE) to exert a changing force on the heat spreader over temperature. The die may be coupled to the heat spreader with a polymer interface material which is cured at an elevated temperature. In embodiments in which the die is located off-center under the heat spreader, the clip may exert an off-center force on the heat spreader when curing at the elevated temperature due to the differing CTEs. In other embodiments, in which the die is located toward the center of the heat spreader, a leaf with two layers having different CTEs may help reduce variable contact geometry, which may be especially helpful in higher force situations.

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1. A bridge clip comprising:a bridge; and a leaf to couple to the bridge and to exert an off-center force on a heat spreader, the leaf comprising first and second layers, the first layer having first and second metal portions with differing coefficients of thermal expansion (CTE) to exert a substant

1. A bridge clip comprising:a bridge; and a leaf to couple to the bridge and to exert an off-center force on a heat spreader, the leaf comprising first and second layers, the first layer having first and second metal portions with differing coefficients of thermal expansion (CTE) to exert a substantially centralized force on the heat spreader at a room temperature and the off-center force at an elevated temperature. 2. The bridge clip of claim 1, where the bridge clip holds the heat spreader over an off-center die, and wherein the leaf exerts an off-center force on the heat spreader toward the off-center die at the elevated temperature.3. The clip of claim 2 wherein a polymer interface material (PIM) thermally couples the off-center die to the heat spreader, the PIM being to be cured at the elevated temperature.4. The clip of claim 3 wherein the off-center die is located on a substrate toward one side of the heat spreader, and wherein the first and second metal portions of the first layer of the leaf are selected to provide an increased force on the one side of the heat spreader at least at the elevated temperature.5. The clip of claim 4 wherein the leaf has first and second ends that attach to the bridge and meet at a central location, and wherein the second layer in part contacts the heat spreader, and wherein the first metal portion extends from the first end to the central location, and the second metal portion extends from the second end to at least the central location, andwherein the first and second metal portions of the first layer are bonded together the central location of the first layer. 6. The clip of claim 5 wherein the first metal portion has a greater coefficient of thermal expansion than the second metal portion,wherein the off-center die is located toward the first end, and wherein the leaf exerts a greater force toward the first end at the elevated temperature than toward the second end at the elevated temperature. 7. The clip of claim 6 wherein the second layer is a base metal layer extending between the ends of the leaf, and wherein the first layer, including the first and second metal portions, is disposed over the base metal layer.8. The clip of claim 7 wherein the first and second metal portions of the first layer of the leaf are bonded to the base metal layer, andwherein the base metal layer comprises a stainless steel and at least the first metal portion of the first layer has a greater coefficient of thermal expansion than the base metal layer. 9. The clip of claim 5 wherein the bridge clips into a carrier which supports a substrate upon which the off-center die is mounted, andwherein the heat spreader is adhered to the substrate with a sealant, and wherein curing at the elevated temperature cures the sealant and the polymer interface material. 10. A method comprising:providing a bridge clip having a bridge and a leaf coupled to the bridge, the leaf comprising first and second layers, the first layer having first and second metal portions with differing coefficients of thermal expansion (CTE); clipping the bridge clip into retaining slots of a carrier to secure a heat spreader in position on a substrate over an off-center die, the off-center die, the substrate and the heat spreader comprising a package, wherein an interface material couples the off-center die to the heat spreader, and wherein a sealant couples the heat spreader to the substrate; and raising an assembly to an elevated temperature to cure the interface material, the leaf to exert an off-center force on the heat spreader toward the die at the elevated temperature and a substantially centralized force on the heat spreader at a room temperature, the bridge clip, carrier and package comprising the assembly. 11. The method of claim 10 wherein the off-center die is located on the substrate toward one side of the heat spreader,wherein the first and second metal portions of the first layer of the leaf are selected to provide an increased force on the one side of the heat spreader at the elevated temperature, and wherein when raising the assembly to the elevated temperature, the first and second metal portions of the first layer of the leaf exert the off-center force on the heat spreader at the elevated temperature. 12. The method of claim 10 wherein the first metal portion has a greater CTE than the second metal portion, and wherein the second layer of the leaf is to contact the heat spreader, andwherein the first and second metal portions of the first layer are bonded at a central location of the first layer, and wherein the first metal portion extends from a first end of the leaf to the central location, and wherein the second metal portion extends from a second end of the leaf to the central location. 13. An assembly comprising:a process carrier; a package comprising a substrate, an off-center die and thermal interface material bonding the off-center die to a heat spreader; and a bridge clip clipped into retaining slots of the carrier to secure the heat spreader in position on the substrate, the bridge clip having a bridge and a leaf coupled to the bridge, the leaf comprising first and second layers, wherein the first layer has first and second metal portions with differing coefficients of thermal expansion (CTE) to exert an off-center force on the heat spreader at an elevated temperature. 14. The assembly of claim 13 wherein the off-center die is located on the substrate toward one side of the heat spreader, the first and second metal portions of the first layer of the leaf to provide an increased force on the one side of the heat spreader at the elevated temperature.15. The assembly of claim 13 wherein the first metal portion has a greater CTE than the second metal portion,wherein the second layer is to contact the heat spreader, and wherein the first and second metal portions of the first layer are bonded together at central location of the first layer, and wherein the first metal portion extends from a first end of the leaf to the central location, and wherein the second metal portion extends from a second end of the leaf to the central location.