초록 ▼

A system for manufacturing a semiconductor device, comprises first and second metal molds (100a, 100b) to form a cavity; a pair of plungers (102, 103) provided in cylinder holes (102a, 103b) of the second metal mold (100b); a pressure supplying unit for pushing the plungers (102, 103) under a pressu

A system for manufacturing a semiconductor device, comprises first and second metal molds (100a, 100b) to form a cavity; a pair of plungers (102, 103) provided in cylinder holes (102a, 103b) of the second metal mold (100b); a pressure supplying unit for pushing the plungers (102, 103) under a pressure lower than the injection pressure applied to the plunger (101) to form debris cavities (DC1, DC2) which absorb an excess resin, thereby reducing the height of a projection produced on the enclosing resin layer.

대표청구항 ▼

1. An apparatus for manufacturing a semiconductor device, comprising:a metal mold consisting of a first metal mold on which a semiconductor wafer substrate is placed, a second metal mold having a cavity, and a third metal mold; and enclosing resin layer forming means for filling said cavity with a m

1. An apparatus for manufacturing a semiconductor device, comprising:a metal mold consisting of a first metal mold on which a semiconductor wafer substrate is placed, a second metal mold having a cavity, and a third metal mold; and enclosing resin layer forming means for filling said cavity with a molten resin to form an enclosing resin layer on said semiconductor wafer substrate, said enclosing resin layer forming means including: at least one first plunger provided in said third metal mold for filling said cavity with said molten resin under a predetermined injection pressure; a surface of said third metal mold being opposed to said semiconductor wafer substrate on said first metal mold; and sliding means for making either said first and second metal molds or said third metal mold slidable with respect to each other under a pressure of said molten resin filled in said cavity, said apparatus further comprising: a first pressure application means for applying a first pressure higher than a resin pressure of said molten resin to either first and second metal molds or said third metal mold in a first direction opposite to a second direction of said resin pressure; and a second pressure application means for applying a second pressure lower than said resin pressure in said second direction. 2. The apparatus according to claim 1, wherein said first pressure application means comprises a piston to which a pressure higher than said resin pressure is applied.3. The apparatus according to claim 1, wherein said second pressure application means comprises a spring having a spring pressure lower than said resin pressure.4. An apparatus for manufacturing a semiconductor device, comprising:a metal mold consisting of a first metal mold on which a semiconductor wafer substrate is placed, a second metal mold having a cavity, and a third metal mold; and enclosing resin layer forming means for filling said cavity with a molten resin to form an enclosing resin layer on said semiconductor wafer substrate, said enclosing resin layer forming means including: at least one first plunger provided in said third metal mold for filling said cavity with said molten resin under a predetermined injection pressure; a surface of said third metal mold being opposed to said semiconductor wafer substrate on said first metal mold; and sliding means for making either said first and second metal molds or said third metal mold slidable with respect to each other under a pressure of said molten resin filled in said cavity, wherein said first plunger is provided at a position corresponding to a central area of said semiconductor wafer substrate. 5. A molding apparatus comprising:a first mold having a first cavity for supporting a semiconductor wafer therein; a second mold having a second cavity for injecting a resin therein, a first through hole connected to said second cavity at a central position of said cavity and a second through hole connected to said second cavity at a peripheral position of said second cavity; a first plunger provided within said first hole for injecting said resin; a second plunger provided within said second through hole for absorbing said resin overflowed from said second cavity; and a plunger unit connected to said first and second plungers, said plunger unit supplying a first pressure to said first plunger and a second pressure, which is smaller than said first pressure, to said second plunger by a single gauge pressure. 6. The molding apparatus according to claim 5, wherein said plunger unit has a first piston for providing said first pressure to said first plunger and a second piston for providing said second pressure to said second plunger.7. The molding apparatus according to claim 5, wherein said first plunger has a first bore diameter and said second plunger has a second bore diameter which is larger than said first bore diameter.8. The molding apparatus according to claim 5, wherein a tablet is placed on said first plunger.9. The molding apparatus according to claim 5, wherein said first and second through holes are cylindrical holes.