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A method of forming a device including a plurality of micron or sub-micron sized features is provided. A master having a surface contour defining a plurality of features is provided. The surface contour of the master is coated with at least one layer of material to form a shell. The master is remove

A method of forming a device including a plurality of micron or sub-micron sized features is provided. A master having a surface contour defining a plurality of features is provided. The surface contour of the master is coated with at least one layer of material to form a shell. The master is removed from the shell to form a negative image of the surface contour in the shell. The negative image in the shell is filled with material, for example, polycarbonate, polyacrylic, or polystyrene, to form a device having features substantially the same as the master. The negative image may be filled using injection molding, compression molding, embossing or any other compatible technique.

대표청구항 ▼

1. A method of forming a mold for a micro-device including an array of microfeatures, comprising:providing a master having a surface contour which includes skin penetration features; covering the surface contour with a layer of material having a thickness of about 0.01-0.2 inches; removing the maste

1. A method of forming a mold for a micro-device including an array of microfeatures, comprising:providing a master having a surface contour which includes skin penetration features; covering the surface contour with a layer of material having a thickness of about 0.01-0.2 inches; removing the master from the layer of material to form a negative image of the master in the layer of material wherein the negative image is fillable by a flowable process; filling the negative image fluidically with a flowable powdered metallic materiel to form a device having substantially the same features as the master; and sintering the powdered metallic material to form the micro-device. 2. The method of claim 1, further comprising, coating the master with a release film, before the covering of the surface contour, to facilitate removal of the master.3. The method of claim 1, further comprising, etching to remove the master.4. The method of claim 3, wherein the etchant is hydroxide.5. The method of claim 1, wherein the layer of material is a metal.6. The method of claim 1, wherein the layer of material is nickel.7. The method of claim 1, wherein the master is sacrificed during its removal.8. The method of claim 1, Wherein the negative image has at least one structural feature of about 5 microns to about 250 microns in one dimension.9. The method of claim 1, wherein the negative image defines recesses having a depth from its surface of about 5 microns to about 250 microns.10. The method of claim 9, wherein the recesses are arranged in an array of uniformly spaced rows and columns to provide a density of about 1 to about 100 of the recess per mm2.11. The method of claim 1, wherein the master is formed from silicon.12. The method of claim 1, further comprising:individually forming portions of the master from silicon; and connecting the portions into a complete master. 13. The method of claim 1, wherein the layer of material is formed via sintering.14. A method of forming a device including a plurality of micron or sub-micron sized features, the method comprising:providing a master having a surface contour defining skin penetration features; coating the surface contour of the master with at least one layer of material having a thickness of about 0.01-0.2 inches; removing the master from the layer of material to form a negative image of the surface contour in the layer of material; forming a mold insert from the negative image; and performing injection molding to fill the negative image fluidicaily to form a device having substantially the same features as the master. 15. The method of claim 14, wherein the injection molding is done at a vacuum.16. The method of claim 14, further comprising drilling holes in the features of the device to form hollow micro-needles.17. The method of claim 14, wherein the layer of material is at about 0.07 inches thick.18. The method of claim 14, further comprising, coating the master with a release film, before the covering of the surface contour, to facilitate removal of the master.19. The method of claim 14, further comprising, etching to remove the master.20. The method of claim 14, wherein the layer of material is a metal.21. The method of claim 14, wherein the layer of material is nickel.22. The method of claim 14, further comprising removing residual air during the injection molding.23. The method of claim 14, further comprising forming vents in the mald insert.24. The method of claim 14, wherein the negative image is filled with a polymer.25. The method of claim 14, wherein the negative image is filled with one of polyethylene, polypropylene, acrylic, cyclic olefinic copolymers, polyamide, polystyrene, polyester and polycarbonate.26. The method of claim 16, wherein the drilling is performed via lasers.27. The method of claim 14, wherein the layer of material is formed via sintering.28. The method of claim 14, wherein the filling step further comprises:filling the negative image with a flowable powdered metallic material; and sintering the powdered metallic material to form the micro-device. 29. The method of claim 14, wherein the master is formed from silicon.30. The method of claim 29, further comprising:individually forming portions of the master from silicon; and connecting the portions into a complete master. 31. A method of forming a device including a plurality of micron or sub-micron sized features, the method comprising:providing a master having a surface contour defining features; coating the surface contour of the master with at least one layer of material at about 0.07 inches thick; removing the master from the layer of material to form a negative image of the surface contour in the layer of material; and filling the negative image to form a device having substantially the same features as the master. 32. The method claim 31, further comprising, forming a mold insert from the negative image; andperforming injection molding to fill the negative image. 33. The method of claim 32, wherein the injection molding is done at a vacuum.34. The method of claim 31, wherein the negative image is filled with a polymer.35. The method of claim 34, wherein the negative image is filled with one of polyethylene, polypropylene acrylic, cyclic olefinic copolymers, polyamide, polystyrenes, polyester and polycarbonate.36. A method of forming a medical device including a plurality of micron or sub-micron sized features which form skin penetration members, the method comprising:providing a master having a surface contour defining skin penetration features; coating the surface contour of the master with a single layer of material having a thickness of about 0.01-0.2 inches; removing the master from the layer of material to form a negative image of the surface contour in the layer of material forming a mold insert from the negative image; and performing injection molding to fill the negative image fluidically to form the medical device having substantially the same features as the master. 37. The method of claim 36, wherein the injection molding is done at a vacuum.38. The method of claim 36, wherein the negative image is filled with a polymer.39. The method of claim 38, wherein the negative image is filled with one of polyethylene, polypropylene, acrylic, cyclic olefinic copolymers, polyamide, polystyrenes, polyester and polycarbonate.