Apparatus and method for photocatalytic purification and disinfection of fluids
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C07C-006/00
C02F-001/48
B01J-019/08
출원번호
US-0294909
(2002-11-15)
발명자
/ 주소
Carmignani, Gary
Frederick, Lee
Sitkiewitz, Steve
출원인 / 주소
Titan Technologies
인용정보
피인용 횟수 :
25인용 특허 :
26
초록▼
An apparatus and method for the photocatalytic conversion of contaminants in a fluid stream. Fluid is directed through a semitransparent packed bed or an open cell, three dimensionally reticulated, fluid permeable, semiconductor unit. Within the unit, a semiconductor, when exposed to a photoactivati
An apparatus and method for the photocatalytic conversion of contaminants in a fluid stream. Fluid is directed through a semitransparent packed bed or an open cell, three dimensionally reticulated, fluid permeable, semiconductor unit. Within the unit, a semiconductor, when exposed to a photoactivating light source, converts the contaminants through a photocatalytic reaction. Both the substrate and the semiconductor photocatalyst are semitransparent to the activating light to allow penetration of light into the unit, thereby distributing the light, increasing the active specific surface area, and improving the net conversion performance of the unit.
대표청구항▼
1. An apparatus for photocatalytic conversion of contaminants in a fluid stream, said apparatus comprising:a reactor enclosure having a fluid inlet and a fluid outlet; at least one semiconductor unit in fluid communication with said fluid inlet and said fluid outlet, said semiconductor unit includin
1. An apparatus for photocatalytic conversion of contaminants in a fluid stream, said apparatus comprising:a reactor enclosure having a fluid inlet and a fluid outlet; at least one semiconductor unit in fluid communication with said fluid inlet and said fluid outlet, said semiconductor unit including a transparent or semi-transparent, three-dimensional substrate having a semi-transparent semiconductor photocatalytic surface with which the fluid stream comes into contact; and a light emitting device in optical proximity and communication to said at least one semiconductor unit, said light emitting device providing incident light having a wavelength corresponding to a semitransparent region of the absorption spectrum of the semiconductor unit; wherein said photocatalytic surface is of sufficient thickness to pass 60-95% of the incident light directed to said surface; said substrate is of sufficient thickness to pass greater than 80% of the incident light directed to said substrate; and said light emitting device and said semiconductor unit work cooperatively to remove contaminants in the fluid stream by photocatalytic reaction, said reaction having a reaction order, in respect to light intensity, that is less than unity. 2. The apparatus of claim 1, wherein said at least one semiconductor unit has multiple photocatalytic surfaces and is configured to permit the light to pass through said multiple surfaces.3. The apparatus of claim 1, wherein said photocatalytic surface and said substrate comprise the same material.4. The apparatus of claim 1, wherein a photocatalytic material is incorporated into the substrate.5. The apparatus of claim 1, wherein said semiconductor unit comprises a layer of semitransparent material bonded to said substrate.6. The apparatus of any one of claims 3, 4 or 5, wherein said photocatalytic surface of claim 3, said photocatalytic material of claim 4 or said semitransparent material of claim 5 includes at least one co-catalyst.7. The apparatus of claim 6, wherein said at least one co-catalyst material is selected from the group consisting of platinum, palladium, ruthenium, iridium, rhodium, gold, silver, copper, tin, iron, cobalt, vanadium, niobium, zirconium and zinc or their oxides or sulfides.8. The apparatus of claim 1, wherein said photocatalytic surface is 0.1-1 μm thick.9. The apparatus of claim 1, wherein said photocatalytic surface is selected from the group consisting of TiO2, ZrO2, ZnO, CaTiO3, SnO2, MoO3, Fe2O3, and WO3.10. The apparatus of claim 1, wherein said photocatalytic surface contains one or more of the polymorphs of TiO2.11. The apparatus of claim 1 or claim 10, wherein said at least one semiconductor unit is partially transparent to incident light having a wavelength between 340 and 390 nm.12. The apparatus of claim 1, wherein said substrate is a semitransparent, open-cell, three dimensionally reticulated, and fluid permeable structure.13. The apparatus of claim 12, wherein said at least one semiconductor unit has a pore size ranging from about 10 to about 200 pores per square inch.14. The apparatus of claim 1, wherein said substrate is packing material selected from the group consisting of spheres, cylinders, raschig rings, pall rings, lessing rings, partition rings, berl saddles, intalox saddles, and tellerettes with characteristic length >0.1 cm.15. The apparatus of claim 1, wherein said substrate comprises a material or materials selected from the group consisting of alumina, zirconia, titania, silica, fused silica, glass, silicone, and organic polymers.16. The apparatus of claim 1 or claim 15, wherein said substrate comprises an organic polymer that is resistant to yellowing when exposed to said incident light.17. The apparatus of claim 1, wherein said light emitting device is selected from the group consisting of light emitting diode, low pressure mercury lamp, medium pressure mercury lamp, high pressure mercury lamp, xenon lamp, and the sun.18. The apparatus of claim 1, wherein said reaction order is about one-half.19. A method for photocatalytic conversion of contaminants in a fluid stream, comprising:providing a reactor enclosure having a fluid inlet and a fluid outlet; providing at least one semiconductor unit in fluid communication with said fluid inlet and said fluid outlet, said semiconductor unit including a transparent or semi-transparent, three-dimensional substrate having a semi-transparent semiconductor photocatalytic surface with which the fluid stream comes into contact; providing a light emitting device in optical proximity and communication to said at least one semiconductor unit; directing incident light having a wavelength corresponding to a semitransparent region of the absorption spectrum of the semiconductor unit toward said semiconductor unit, wherein the photocatalytic surface is of sufficient thickness to pass 60-95% of the incident light directed to the surface and the substrate is of sufficient thickness to pass greater than 80% of the incident light directed to the substrate; and converting contaminants in the fluid stream by photocatalytic reaction, the reaction having a reaction order, in respect to light intensity, that is less than unity. 20. The method of claim 19, wherein said at least one semiconductor unit has multiple photocatalytic surfaces and further comprising directing the light to pass through the multiple surfaces.21. The method of claim 19, wherein said photocatalytic surface and said substrate comprise the same material.22. The method of claim 19, wherein a photocatalytic material is incorporated into the substrate.23. The method of claim 19, wherein said semiconductor unit comprises a layer of semitransparent material bonded to said substrate.24. The method of any one of claims 21, 22, or 23, wherein said photocatalytic surface of claim 21, said photocatalytic material of claim 22 or said semitransparent material of claim 23 includes at least one co-catalyst.25. The method of claim 24, wherein said at least one co-catalyst material is selected from the group consisting of platinum, palladium, ruthenium, iridium, rhodium, gold, silver, copper, tin, iron, cobalt, vanadium, niobium, zirconium and zinc or their oxides or sulfides.26. The method of claim 19, wherein said photocatalytic surface is 0.1-1 μm thick.27. The method of claim 19, wherein said photocatalytic surface is selected from the group consisting of TiO2, ZrO2, ZnO, CaTiO3, SnO2, MoO3, Fe2O3, and WO3.28. The method of claim 19, wherein said photocatalytic surface contains one or more of the polymorphs of TiO2.29. The method of claim 19 or claim 28, wherein at least one semiconductor unit is partially transparent to incident light having a wavelength between 340 and 390 nm.30. The method of claim 19, wherein said substrate is a semitransparent, open-cell, three dimensionally reticulated, and fluid permeable structure.31. The method of claim 29, wherein said at least one semiconductor unit has a pore size ranging from about 10 to about 200 pores per square inch.32. The method of claim 19, wherein said substrate is packing material selected from the group consisting of spheres, cylinders, raschig rings, pall rings, lessing rings, partition rings, berl saddles, intalox saddles, and tellerettes with characteristic length >0.1 cm.33. The method of claim 19, wherein said substrate comprises a material selected from the group consisting of alumina, zirconium, titania, silica, fused silica, glass, silicone, and organic polymers.34. The method of claim 19 or claim 33, wherein said substrate comprises an organic polymer that is resistant to yellowing when exposed to the incident light.35. The method of claim 19, wherein said light emitting device is selected from the group consisting of light emitting diode, low pressure mercury lamp, medium pressure mercury lamp, high pressure mercury lamp, xenon lamp, and the sun.36. The method of claim 19, wherein the reaction order is about one-half.
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