초록

An implantable component including a feedthrough assembly and a method for forming the feedthrough assembly wherein a coating forming a fluid barrier over an insulator, an insulator-to-terminal pin interface and an insulator-to-ferrule interface is incorporated.

대표청구항 ▼

1. An implantable component including a feedthrough assembly, the feethrough assembly comprising:an insulator electrically isolating a terminal pin from a ferrule, the terminal pin extending through the ferrule; an insulator-to-ferrule interface; an insulator-to-terminal pin interface; and a backfil

1. An implantable component including a feedthrough assembly, the feethrough assembly comprising:an insulator electrically isolating a terminal pin from a ferrule, the terminal pin extending through the ferrule; an insulator-to-ferrule interface; an insulator-to-terminal pin interface; and a backfill deposited over the insulator and including a coating forming a fluid barrier over the insulator, the insulator-to-ferrule interface and the insulator-to-terminal pin interface;wherein the backfill further includes a layer of epoxy and the coating is located between the epoxy and the insulator. 2. An implantable component including a feedthrough assembly, the feedthrough assembly comprising:an insulator electrically isolating a terminal pin from a ferrule, the terminal pin extending through the ferrule; an insulator-to-ferrule interface; an insulator-to-terminal pin interface; and a backfill deposited over the insulator and including a coating forming a fluid barrier over the insulator, the insulator-to-ferrule interface and the insulator-to-terminal pin interface;wherein the backfill further includes a layer of epoxy and the epoxy layer is located between the coating and the insulator. 3. An implantable component including a feedthrough assembly, the feedthrough assembly comprising:an insulator electrically isolating a terminal pin from a ferrule, the terminal pin extending through the ferrule; an insulator-to-ferrule interface; an insulator-to-terminal pin interface; and a backfill deposited over the insulator and including a coating forming a fluid barrier over the insulator, the insulator-to-ferrule interface and the insulator-to-terminal pin interface;wherein the backfill further includes a layer of silicone and the coating is located between the silicone layer and the insulator. 4. An implantable component including a feedthrough assembly, the feedthrough assembly comprising:an insulator electrically isolating a terminal pin from a ferrule, the terminal pin extending through the ferrule; an insulator-to-ferrule interface; an insulator-to-terminal pin interface; and a backfill deposited over the insulator and including a coating forming a fluid barrier over the insulator, the insulator-to-ferrule interface and the insulator-to-terminal pin interface;wherein the backfill further includes a layer of silicone and the silicone layer is located between the coating and the insulator. 5. An implantable component including a feedthrough assembly, the feedthrough assembly comprising:an insulator electrically isolating a terminal pin from a ferrule, the terminal pin extending through the ferrule; an insulator-to-ferrule interface; an insulator-to-terminal pin interface; and a backfill deposited over the insulator and including a coating forming a fluid barrier over the insulator, the insulator-to-ferrule interface and the insulator-to-terminal pin interface;wherein the backfill further includes at least one more coating formed over the coating and a layer of epoxy located between the coating and the at least one more coating. 6. An implantable component including a feedthrough assembly, the feedthrough assembly comprising:an insulator electrically isolating a terminal pin from a ferrule, the terminal pin extending through the ferrule; an insulator-to-ferrule interface; an insulator-to-terminal pin interface; and a backfill deposited over the insulator and including a coating forming a fluid barrier over the insulator, the insulator-to-ferrule interface and the insulator-to-terminal pin interface;wherein the backfill further includes at least one more coating formed over the coating and a layer of silicone located between the coating and the at least one more coating. 7. An implantable component including a feedthrough assembly, the feedthrough assembly comprising:an insulator electrically isolating a terminal pin from a ferrule, the terminal pin extending through the ferrule; an insulator-to-ferrule interface; an insulator-to-terminal pin interface; and a backfill deposited over the insulator and including a coating forming a fluid barrier over the insulator, the insulator-to-ferrule interface and the insulator-to-terminal pin interface;wherein the coating contacts the insulator. 8. An implantable component including a feedthrough assembly, the feedthrough assembly comprising:an insulator formed of a ceramic material electrically isolating a terminal pin from a ferrule, the terminal pin extending through the ferrule; an insulator-to-ferrule interface; an insulator to terminal pin interface; a backfill deposited over the insulator and including a coating forming a fluid barrier over the insulator, the insulator-to-ferrule interface and the insulator-to-terminal pin interface; anda braze material at the insulator-to-ferrule interface and at the insulator-to-terminal pin interface and wherein the coating contacts the braze material at one or both of the interfaces.