|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||264/046.4; 264/250; 264/265; 264/275; 264/276; 264/296|
|발명자 / 주소|
|출원인 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 3 인용 특허 : 6|
A process of molding a component on a substrate utilizes a substrate having a peripheral flange that projects into a parting line between mold segments defining a mold cavity, wherein the flange has a projecting, continuous circuitous ridge that forms a seal between the substrate and an upper mold segment. The process allows a substantially flash free molded component to be formed directly on a substrate, thus eliminating the need for a separate flash removal step.
1. A process of molding a component on a substrate, comprising:providing first and second mating mold segments having surfaces that, when in a closed position, define a mold cavity, the mold segments having complementary shaped faces that mate with each other at a parting line; providing a substrate having a contoured surface that conforms with the mold cavity defining surfaces of the first mold segment, the substrate having a peripheral flange conforming with the complementary shaped faces of the mold segments, the peripheral flange including at least o...