초록 ▼

A substrate (300) for an RF device includes a plurality of layers (102) of dielectric material cofired in a stack. The plurality of layers (102) is formed from a material having a permittivity. Selected ones of the layers (102) have a pattern of perforations (106) formed in at least one perforated a

A substrate (300) for an RF device includes a plurality of layers (102) of dielectric material cofired in a stack. The plurality of layers (102) is formed from a material having a permittivity. Selected ones of the layers (102) have a pattern of perforations (106) formed in at least one perforated area (104). The perforated areas (104) are generally aligned with one another in the stack to lower one or more of an effective value of a permittivity and a loss tangent in a least one spatially defined region (504) of the substrate (300).

대표청구항 ▼

1. A method for fabricating a substrate for an RF device, comprising steps of:forming a pattern of perforations in a plurality of layers of an unfired ceramic tape in at least one perforated area of each layer; laminating said plurality of layers in a stack with said at least one perforated area in

1. A method for fabricating a substrate for an RF device, comprising steps of:forming a pattern of perforations in a plurality of layers of an unfired ceramic tape in at least one perforated area of each layer; laminating said plurality of layers in a stack with said at least one perforated area in each of said plurality of layers at least partially aligned with at least one perforated area of an adjacent one of said plurality of layers in said stack to lower at least one of an effective value of a permittivity and an effective value of a loss tangent in a least one spatially defined region of said substrate, as compared to a bulk value of permittivity and loss tangent for said dielectric material; firing said laminated stack. 2. The method according to claim 1 further comprising a step of aligning said perforations of each said perforated area.3. The method according to claim 1 further comprising a step of selecting said ceramic tape to be a low temperature cofired ceramic tape.4. The method according to claim 1 further comprising a step of forming an RF circuit component on said substrate.5. The method according to claim 1 further comprising a step of excluding said pattern of perforations from at least one outermost layer of said substrate.6. A method for fabricating a substrate for an RF device, comprising steps of:forming a pattern of perforations in a plurality of layers of a dielectric material in at least one perforated area of each layer; arranging said plurality of layers in a stack with said at least one perforated area in each of said plurality of layers at least partially aligned with one another in said stack to lower at least one of an effective value of a permittivity and an effective value of a loss tangent in a least one spatially defined region of said substrate, as compared to a bulk value of permittivity and loss tangent for said dielectric material; selecting said pattern for each of said plurality of layers so that said effective value of permittivity is substantially the same at each measurable point of said spatially defined region of said substrate. 7. The method according to claim 1 further comprising a step of varying said pattern among said plurality of layers.8. The method according to claim 1 further comprising a step of off setting said pattern from layer to layer.9. The method according to claim 1 further comprising a step of sealing said spatially defined region from an external environment.10. The method according to claim 1 further comprising a step of forming said pattern of perforations in a plurality of said perforated areas of each said layer to produce a plurality of said spatially defined regions, each having said effective value of permittivity lower than said permittivity.11. A method for fabricating a substrate for an RF device, comprising steps of:forming a pattern of perforations in a plurality of layers of a dielectric material in at least one perforated area of each layer; arranging said plurality of layers in a stack with said at least one perforated area in each of said plurality of layers at least partially aligned with one another in said stack to lower at least one of an effective value of a permittivity and an effective value of a loss tangent in a least one spatially defined region of said substrate, as compared to a bulk value of permittivity and loss tangent for said dielectric material; forming said pattern of perforations in a plurality of said perforated areas of each said layer to produce a plurality of said spatially defined regions, each having said effective value of permittivity lower than said permittivity; selecting said pattern of perforations in said plurality of perforated areas to produce a value for said effective permittivity in said plurality of said spatially defined regions that is different as compared to areas of said layers that are not perforated. 12. A method for fabricating a substrate for an RF device, comprising steps of:forming a pattern of perforations in a plurality of layers of a dielectric material in at least one perforated area of each layer; arranging said plurality of layers in a stack with said at least one perforated area in each of said plurality of layers at least partially aligned with one another in said stack to lower at least one of an effective value of a permittivity and an effective value of a loss tangent in a least one spatially defined region of said substrate, as compared to a bulk value of permittivity and loss tangent for said dielectric material; selecting said pattern of perforations in each of said layers to cause said effective permittivity to selectively vary in a predetermined manner across a surface of said substrate defined by said spatially defined region.