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Microporous polishing pads

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24D-007/22
출원번호 US-0281782 (2002-10-28)
발명자 / 주소
  • Prasad, Abaneshwar
출원인 / 주소
  • Cabot Microelectronics Corporation
인용정보 피인용 횟수 : 26  인용 특허 : 31

초록

The invention provides polishing pads for chemical-mechanical polishing comprising a porous foam and a method for their production. In one embodiment, the porous foam has an average pore size of about 50 μm or less, wherein about 75% or more of the pores have a pore size within about 20 μm or less o

대표청구항

1. A polishing pad for chemical-mechanical polishing comprising a porous foam with an average pore size of about 50 μm or less, wherein about 75% or more of the pores have a pore size within about 20 μm or less of the average pore size.2. The polishing pad of claim 1, where the average pore size is

이 특허에 인용된 특허 (31)

  1. Hartfelt Jorgen (36 Berkeley Dr. Horsholm MA DKX) Hoehn Ralf (36 Berkeley Dr. Chelmsford MA 01824), Abrasive of a microporous polymer matrix with inorganic particles thereon.
  2. Kuramochi Hideto,JPX ; Kubota Yoshitaka,JPX, Abrasive shaped article, abrasive disc and polishing method.
  3. Birang Manoocher ; Pyatigorsky Grigory, Apparatus and method for in-situ monitoring of chemical mechanical polishing operations.
  4. Birang Manoocher ; Gleason Allan ; Guthrie William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.
  5. Birang Manoocher ; Gleason Allan ; Guthrie William L., Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus.
  6. Tupil Srinath P. ; Buchner Klaus,CHX ; Lahmann Patrick M., Lamination of microcellular articles.
  7. Burnham Theodore A. ; Cha Sung W. ; Walat Robert H. ; Kim Roland Y. ; Anderson Jere R. ; Stevenson James F. ; Suh Nam P. ; Pallaver Matthew, Method and apparatus for microcellular polymer extrusion.
  8. Blizard Kent ; Tupil Srinath ; Malavich William, Method and apparatus for microcellular polypropylene extrusion, and polypropylene articles produced thereby.
  9. Crevasse Annette Margaret ; Easter William Graham ; Maze John Albert ; Miceli ; III Frank, Method for making porous CMP article.
  10. Cook Lee Melbourne ; James David B. ; Jenkins Charles William ; Reinhardt Heinz F. ; Roberts John V. H. ; Pillai Raj Raghav, Methods for using polishing pads.
  11. Blizard Kent ; Okamoto Kelvin T. ; Anderson Jere R., Microcellular articles and methods of their production.
  12. Kuramochi Hideto,JPX ; Takato Shuji,JPX ; Kubota Yoshitaka,JPX, Molded abrasive product and polishing wheel using it.
  13. Roberts John V. H. ; Pinheiro Barry Scott ; James David B., Molded polishing pad having integral window.
  14. Treur Randolph E. ; Boyd John M. ; Wolf Stephan H., Optical view port for chemical mechanical planarization endpoint detection.
  15. Suzuki Kiyoshi,JPX ; Masumura Hisashi,JPX ; Fukami Teruaki,JPX, Polishing method for semiconductor wafer and polishing pad used therein.
  16. Otawa Kazuhiko,JPX ; Fukumoto Toshiyuki,JPX ; Kawakami Yasuaki,JPX, Polishing pad.
  17. Peter W. Freeman ; Stanley E. Eppert, Jr. ; Alan H. Saikin ; Marco A. Acevedo, Polishing pad.
  18. Cherian, Isaac K.; Anjur, Sriram P.; Grumbine, Steven K., Polishing pad comprising particles with a solid core and polymeric shell.
  19. Anjur Sriram P. ; Downing William C., Polishing pad for a semiconductor substrate.
  20. Sevilla Roland K. ; Kaufman Frank B. ; Anjur Sriram P., Polishing pad for a semiconductor substrate.
  21. Yu Tat-Kwan (Austin TX) Yu Chris C. (Austin TX), Polishing pad for chemical-mechanical polishing of a semiconductor substrate.
  22. Takiyama Masahiro (Shiojiri JPX) Miyazaki Kunihiro (Shiojiri JPX) Shiozawa Kenichiro (Ashiya JPX), Polishing pad for semiconductor wafers.
  23. Roberts John V. H. (Newark DE), Polishing pads.
  24. Cook Lee M. (Steelville PA) Roberts John V. H. (Newark DE) Jenkins Charles W. (Newark DE) Pillai Raj R. (Newark DE), Polishing pads and methods for their use.
  25. Roberts John V. H. ; James David B. ; Cook Lee Melbourne, Polishing pads and methods relating thereto.
  26. Sevilla Roland K. ; Kaufman Frank B. ; Anjur Sriram P., Polishing pads for a semiconductor substrate.
  27. Sailesh Mansinh Merchant ; Sudhanshu Misra ; Pradip Kumar Roy, Polishing pads from closed-cell elastomer foam.
  28. Kumar Vipin (Seattle WA), Polyethylene terephthalate foams with integral crystalline skins.
  29. Winings Richard H. (Berks County PA), Removably holding planar articles for polishing operations.
  30. Baker, III, Arthur Richard; Walls, Jr., Russell A.; Carter, Stephen P.; Hendron, Jeffrey J., Self-leveling pads and methods relating thereto.
  31. Kumar Vipin (Seattle WA) Schirmer Henry G. (Spartanburg SC), Semi-continuous production of solid state polymeric foams.

이 특허를 인용한 특허 (26)

  1. Sivasubramanian, Shivshankar; Ramanath, Srinivasan; Vedantham, Ramanujam; Upadhyay, Rachana; Reis, Signo, Abrasive articles and method of forming same.
  2. Prasad,Abaneshwar, CMP porous pad with component-filled pores.
  3. Baum,Thomas H., Chemical mechanical planarization pad.
  4. Tesini,David A., Dental bite impression wafer for identification purposes that also captures DNA-bearing materials.
  5. James, David B.; Sanford-Crane, Henry, Dual-pore structure polishing pad.
  6. Upadhyay, Rachana D.; Querel, Gilles; Gupta, Pradyumna; Hall, Richard W. J., High porosity vitrified superabrasive products and method of preparation.
  7. Kistler, Rodney C.; Carswell, Andrew, Method and apparatus for removing material from microfeature workpieces.
  8. Kistler, Rodney C.; Carswell, Andrew, Method and apparatus for removing material from microfeature workpieces.
  9. Kistler,Rodney C.; Carswell,Andrew, Method and apparatus for removing material from microfeature workpieces.
  10. Yeh, Shu-Kai; Liao, Zong-En; Chu, Chien-Chia, Method for producing polymer nanofoam.
  11. Deopura, Manish; Vaidya, Hem M.; Roy, Pradip K., Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs.
  12. Deopura, Manish; Vaidya, Hem M.; Roy, Pradip K., Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs.
  13. Tsai, Stan D.; Chang, Shou-Sung; Chen, Liang-Yuh, Multi-layer polishing pad.
  14. Duboust, Alain; Chang, Shou-Sung; Lu, Wei; Neo, Siew; Wang, Yan; Manens, Antoine P.; Moon, Yongsik, Multi-layer polishing pad for low-pressure polishing.
  15. Vigouroux, Xavier-Francois; Tourancheau, Bernard; Koch-Hofer, Cedric, Optimal communication path routing in a system employing interconnected integrated circuit technology.
  16. Renteln,Peter, Optimized grooving structure for a CMP polishing pad.
  17. Delehanty,Donald J.; Hannah,James W.; Heenan,Daniel M.; Jamin,Fen F.; Economikos,Laertis, Planarization system and method using a carbonate containing fluid.
  18. Prasad, Abaneshwar, Polishing pad with microporous regions.
  19. Huang, Ping; Scott, Diane; LaCasse, James P.; Allison, William C., Polishing pad with multi-modal distribution of pore diameters.
  20. Huang, Ping; Scott, Diane; LaCasse, James P.; Allison, William C., Polishing pad with multi-modal distribution of pore diameters.
  21. Vacassy, Robert; Fotou, George, Polishing pad with porous interface and solid core, and related apparatus and methods.
  22. Kume, Takahiro; Iwao, Tomohiro, Polishing sheet and manufacturing method of elastic plastic foam sheet.
  23. Vedantham, Ramanujam; Upadhyay, Rachana, Resin bonded abrasive.
  24. Daskiewich, Scott B., Self-conditioning polishing pad and a method of making the same.
  25. Carter, Malika D.; Hsiao, Yun-Lin; Karis, Thomas E.; Marchon, Bruno; Nayak, Ullal V.; Ramm, Christopher; Richard, Wong K., Systems and methods for polishing a magnetic disk.
  26. Vedantham, Ramanujam; Upadhyay, Rachana; Querel, Gilles, Vitrious bonded abbrasive.
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