Fixture and method for quick installation and removal of mobile platform electronic modules
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-007/20
출원번호
US-0423800
(2003-04-25)
발명자
/ 주소
Rotta, Phillip R.
MacDuff, Jr., John G.
Roll, Phillip E.
출원인 / 주소
The Boeing Company
대리인 / 주소
Harness Dickey &
인용정보
피인용 횟수 :
4인용 특허 :
20
초록▼
A fixture for supporting an electronics module or like component in a generally inaccessible area within a structure. In one preferred form the fixture is adapted to be mounted within a fuselage of an aircraft or other mobile platform in an area that would not permit direct removal of an electronics
A fixture for supporting an electronics module or like component in a generally inaccessible area within a structure. In one preferred form the fixture is adapted to be mounted within a fuselage of an aircraft or other mobile platform in an area that would not permit direct removal of an electronics module for maintenance or repair without first removing other aircraft subsystems, tubing or ducting. The fixture allows the electronics module to be slidably inserted and supported in an area in a manner that allows easy installation and removal of the electronics module without the need to remove other subcomponents disposed adjacent the fixture. The fixture includes provisions for coupling of an air supply thereto such that the electronics module can be cooled. The fixture is lightweight, compact and can be secured in a wide variety of orientations and locations within an aircraft or other structure to make most efficient use of the limited available space in commercial aircraft and other structures.
대표청구항▼
1. A fixture adapted to be secured to a support surface for supporting a subcomponent and for enabling quick removal of said subcomponent therefrom and sliding insertion there into of said subcomponent, comprising:a frame portion adapted to support said subcomponent in a manner that enables ready in
1. A fixture adapted to be secured to a support surface for supporting a subcomponent and for enabling quick removal of said subcomponent therefrom and sliding insertion there into of said subcomponent, comprising:a frame portion adapted to support said subcomponent in a manner that enables ready insertion of said subcomponent there into, and ready removal of said subcomponent therefrom without interfering with objects located adjacent to said frame; said frame having at least one mounting component for enabling mounting of said frame to an external support structure; and said frame being operably associated with at least one of a cooling airflow conduit and an electrical signal cable to facilitate coupling thereto when said component is being supported by said frame portion. 2. The fixture of claim 1, wherein said fixture comprises a box-like structure into which said subcomponent can be inserted.3. The fixture of claim 1, wherein said fixture comprises a latch mechanism for securing said subcomponent thereto.4. The fixture of claim 2, wherein said fixture comprises at least one channel for cooperating with structure on said subcomponent to enable said subcomponent to be guided into said fixture during inserting of said subcomponent, and guided outwardly from said fixture during removal of said subcomponent.5. The fixture of claim 1, wherein said fixture further comprises:a cooling manifold secured thereto for directing a cooling airflow into said fixture. 6. The fixture of claim 1, wherein said mounting component comprises a plurality of mounting flanges for at least assisting in fixedly securing said fixture to said external structure.7. The fixture of claim 1, wherein said fixture has a length suitable to support a plurality of said subcomponents thereon.8. A fixture for supporting a box-like electronics module and for enabling quick removal of said electronics module therefrom and sliding insertion there into of said electronics module, comprising:a box-like frame, said box-like frame being adapted to support said electronics module in a manner that enables ready insertion of said electronics module there into, and ready removal of said electronics module therefrom without interfering with objects located adjacent to said box-like frame; said frame having a coupling for receipt of a cooling airflow conduit; and said frame having a plurality of mounting components for enabling mounting of said frame to an external support structure. 9. The fixture of claim 8, wherein said frame further comprises a manifold for interfacing said cooling airflow conduit with said frame to supply a cooling airflow to said electronics module.10. The fixture of claim 8, wherein said frame comprises a cooling manifold secured thereto.11. The fixture of claim 8, further comprising a track supported adjacent said external support structure for guiding said electronics module towards and into engagement with said frame.12. The fixture of claim 8, further comprising a tether secured to said electronics module for enabling an operator to remotely direct said electronics module into engagement with said frame.13. The fixture of claim 8, further comprising a latch operably associated with said frame and with said electronics module for releasably securing said electronics module to said frame.14. The fixture of claim 8, wherein said frame further comprises a handle adapted to be grasped with at least one hand of a user.15. The fixture of claim 8, wherein said frame comprises:a gasket for engaging a portion of said electronics module; and said airflow conduit operably coupled to said gasket and in air flow communication with said electronics module for supplying a cooling airflow to said electronics module. 16. A fixture for supporting an electronics module in a difficult to access area within a body structure of a mobile platform, said fixture comprising:a frame for supporting said electronics module; said frame having at least one mounting component for at least assisting in fixedly securing said frame to said body structure of said mobile platform; said frame having an opening wherein at least one of an external cooling airflow conduit and an electronics cable can be coupled to said electronics module; and wherein said frame enables said electronics module to be removed therefrom without disturbing external components mounted adjacent to said frame within said mobile platform. 17. The fixture of claim 16, further comprising:a track mounted adjacent said body structure of said mobile platform for guiding said electronics module into said frame. 18. The fixture of claim 16, further comprising:a tether secured to said electronics module for directing said electronics module along said track into said frame. 19. The fixture of claim 16, wherein said fixture has a length sufficient to support a plurality of independent electronic modules adjacent one another within said frame.20. A method for supporting an electronics module adjacent a structural member to aid in enabling convenient and quick removal of said electronics module from an area that would otherwise be difficult to access and disassemble said electronics module from, said method comprising:securing a frame adjacent said structural member, said frame structure being adapted to receive said electronics module with a linear movement of said electronics module; and securing a cooling airflow conduit to said electronics module once said electronics module is positioned within said frame structure. 21. A method for supporting a subcomponent adjacent a structural member to aid in enabling convenient and quick removal of said subcomponent from an area that would otherwise be difficult to access and disassemble said subcomponent from, said method comprising:securing a support frame adjacent said structural member, said support frame being adapted to support thereon said subcomponent thereon; urging said subcomponent toward said support frame until said subcomponent engages said support frame and is supported at least in substantial amount by said support frame and until said subcomponent couples to a cooling airflow conduit; and coupling an electronics cable to said subcomponent. 22. The method of claim 21, further comprising:directing a cooling airflow into said airflow conduit to provide a cooling airflow to said subcomponent.
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