Method and apparatus for generating gas to a processing chamber
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F26B-025/00
C23C-016/00
출원번호
US-0208305
(2002-07-29)
발명자
/ 주소
Guenther, Rolf A.
출원인 / 주소
Applied Materials, Inc.
대리인 / 주소
Moser, Patterson &
인용정보
피인용 횟수 :
65인용 특허 :
100
초록▼
A method and apparatus for generating gas for a processing system is provided. In one embodiment, an apparatus for generating gas for a processing system includes an unitary, isolatable, transportable canister having a plurality of first spacing elements, a plurality of second spacing elements and a
A method and apparatus for generating gas for a processing system is provided. In one embodiment, an apparatus for generating gas for a processing system includes an unitary, isolatable, transportable canister having a plurality of first spacing elements, a plurality of second spacing elements and a solid material disposed within the canister. The spacing elements have different mean diameters. The solid material is adapted to produce a gas vapor when exposed to a temperature above a predetermined level at a predetermined pressure. In another embodiment, an apparatus for generating gas includes a gas source coupled to a processing chamber by a first gas line. A canister is coupled in-line with the first gas line and contains a solid material that produces a process gas when heated. A heater is disposed between the gas source and the canister to heat gas flowing into the canister.
대표청구항▼
1. An apparatus for generating gas for a processing system, comprising:a modular, isolatable, transportable canister adapted for use in a gas panel of a processing system; a plurality of first spacing elements disposed within the canister; a plurality of second spacing elements disposed within the c
1. An apparatus for generating gas for a processing system, comprising:a modular, isolatable, transportable canister adapted for use in a gas panel of a processing system; a plurality of first spacing elements disposed within the canister; a plurality of second spacing elements disposed within the canister and defining an interstitial space with the first spacing elements, the second spacing elements distinctly different and separately identifiable from the first spacing elements; and a solid precursor material at least partially filling the interstitial space. 2. The apparatus of claim 1, wherein the first and second spacing elements have different mean diameters.3. The apparatus of claim 1, wherein a relationship between the first spacing elements and the second spacing elements is expressed by:0.8<R2/R1<0.95 where:R1 is a mean diameter of the first spacing element; and R2 is a mean diameter of the second spacing element. 4. The apparatus of claim 1, wherein at least one of the first spacing elements or the second spacing elements is a sphere or polyhedron.5. The apparatus of claim 1, wherein the solid precursor material is selected from a group consisting of xenon difluoride, pentakis (dimethylamino) tantalum, nickel carbonyl and tungsten hexa-carbonyl.6. The apparatus of claim 1, wherein at least one of the spacing elements is fabricated or coated with a material selected from a group consisting of stainless steel, aluminum, nickel, fluoropolymer, PTFE, PFA ceramic and silicon carbide.7. The apparatus of claim 1, wherein at least one of the spacing elements is fabricated or coated with a non-organic material.8. The apparatus of claim 1, wherein the first spacing elements have a rough or patterned surface.9. An apparatus for generating gas for a processing system, comprising:a hollow body; a gas inlet formed in the hollow body; a tube disposed in the hollow body and coupled to the gas inlet a gas outlet formed in the hollow body; a plurality of first spacing elements disposed within the hollow body; a plurality of second spacing elements disposed within the hollow body and defining an interstitial space with the first spacing elements, the second spacing elements distinctly different and separately identifiable from the first spacing elements; and a solid precursor material at least partially filling the interstitial space. 10. The apparatus of claim 9, wherein a relationship between the first spacing elements and the second spacing elements is expressed by:0.8<R1/R2<0.95 where:R1 is a mean diameter of the first spacing element; and R2 is a mean diameter of the second spacing element. 11. The apparatus of claim 9, wherein at least one of the first spacing elements or the second spacing elements is a sphere or polyhedron.12. The apparatus of claim 9, wherein at least one of the spacing elements is fabricated or coated with a material selected from a group consisting of stainless steel, aluminum, nickel, fluoropolymer, PTFE, PFA ceramic and silicon carbide.13. The apparatus of claim 9, wherein at least one of the spacing elements is fabricated or coated with a non-organic material.14. The apparatus of claim 9, wherein the first spacing elements have a rough or patterned surface.15. The apparatus of claim 9, wherein the tube further comprises:a plurality of holes formed therethrough. 16. The apparatus of claim 9 further comprising a plate coupled to the tube opposite the inlet, the plate adapted to outwardly distribute gases flowing from the tube.17. The apparatus of claim 9, wherein the solid precursor material is selected from a group consisting of xenon difluoride, pentakis (dimethylamino) tantalum, nickel carbonyl and tungsten hexa-carbonyl.18. Apparatus for generating gas for a processing system, comprising:a carrier gas source; a processing chamber; a first gas line coupled between the processing chamber and the carrier gas source; a canister coupled in-line with the first gas line; a solid precursor material disposed within the canister and adapted to produce a process gas via a sublimation process; and a first heater disposed upstream of the canister and adapted to heat the carrier gas flowing into the canister to at least about a predetermined level. 19. The apparatus of claim 18 further comprising:a bypass line coupling the carrier gas source and processing chamber in parallel to the first heater and the canister. 20. The apparatus of claim 19, wherein the bypass line further comprises:a second heater adapted to heat the carrier gas flowing through the bypass line. 21. The apparatus of claim 20 further comprising:a first sensor coupled between the first heater and the canister, and adapted to provide a metric of carrier gas temperature; and a second sensor coupled between the canister and the processing chamber, and adapted to provide a metric of temperature of gases exiting the canister. 22. The apparatus of claim 21 further comprising:a filter disposed between the solids contained in the canister and the processing chamber. 23. The apparatus of claim 18, wherein the canister further comprises:a plurality of first spacing elements disposed within the canister; and a plurality of second spacing elements disposed within the canister and distinctly different and separately identifiable from the first spacing elements. 24. The apparatus of claim 23, wherein a relationship between the first spacing elements and the second spacing elements is expressed by:0.8<R2/R1<0.95 where:R1 is a mean diameter of the first spacing element; and R2 is a mean diameter of the second spacing element. 25. The apparatus of claim 23, wherein at least one of the first spacing elements or the second spacing elements is a sphere or regular polyhedron.26. The apparatus of claim 18, wherein the solid precursor material is selected from a group consisting of xenon difluoride, pentakis (dimethylamino) tantalum, nickel carbonyl and tungsten hexa-carbonyl.27. Apparatus for generating gas for a processing system, comprising:a carrier gas source; a processing chamber; a first gas line coupled between the processing chamber and the carrier gas source; a second gas line coupled in parallel to the first gas line between the processing chamber and the carrier gas source; a canister coupled in-line with the first gas line; a plurality of first spacing elements disposed within the canister; a plurality of second spacing elements disposed within the canister, the second spacing elements, larger, distinct different and separately identifiable from the first spacing elements; a solid precursor material disposed within the canister and adapted to produce a gas vapor when exposed to a temperature above a predetermined level; a first heater disposed between the canister and carrier gas source, and adapted to heat the carrier gas flowing into the canister to at least about the predetermined level; a second heater adapted to heat carrier gas flowing in the second gas line; and a means for diverting gas between the first gas line and the second gas line. 28. The apparatus of claim 21, wherein the means for diverting the carrier gas flow is one or more valves.29. The apparatus of claim 27, wherein a relationship between the first spacing elements and the second spacing elements is expressed by:0.8<R2/R1<0.95 where:R1 is a mean diameter of the first spacing element; and R2 is a mean diameter of the second spacing element. 30. The apparatus of claim 27 further comprising a filter disposed between the solids and the processing chamber.31. Apparatus for generating gas for a processing system, comprising:a container adapted for use in a gas panel of a processing system; a lid coupled to the container, the lid having a first port and a second port; a plurality of first spacing elements disposed within the canister; a plurality of second spacing elements disposed within the canister and defining an interstitial space with the first spacing elements, the first and second spacing elements having different mean diameters; the second spacing elements distinctly different and separately identifiable from the first spacing elements; and a solid precursor material at least partially filling the interstitial space and adapted to produce a gas vapor when exposed to a temperature above a predetermined level at a predetermined pressure. 32. The apparatus of claim 31, wherein a relationship between the first spacing elements and the second spacing elements is expressed by:0.8<R2/R1<0.95 where:R1 is a mean diameter of the first spacing element; and R2 is a mean diameter of the second spacing element. 33. The apparatus of claim 31, wherein at least one of the first spacing elements or the second spacing elements is a sphere or regular polyhedron.34. The apparatus of claim 31, wherein the solid precursor material is selected from a group consisting of xenon difluoride, pentakis (dimethylamino) tantalum, nickel carbonyl and tungsten hexa-carbonyl.35. The apparatus of claim 31, further comprising:a tube having first and second ends, wherein the tube is coupled at the fist end to the first port and the length of the tube is such that the second end is disposed within the first and second spacing elements. 36. The apparatus of claim 31, wherein at least one of the spacing elements is fabricated or coated with a material selected from a group consisting of stainless steel, aluminum, nickel, fluoropolymer, PTFE, PFA ceramic and silicon carbide.37. The apparatus of claim 31, wherein at least one of the spacing elements is fabricated or coated with a non-organic material.38. The apparatus of claim 31, wherein the first spacing elements have a rough or patterned surface.39. A method for generating gas for a semiconductor processing chamber, comprising:heating a carrier gas flowing in a first gas line; flowing the heated carrier gas into a canister containing a solid precursor material; and generating a process gas from the solid precursor material by sublimation. 40. The method of claim 39 further comprising:reducing the temperature of the gas flowing through the canister after a predetermined volume of process gas has been generated; and preventing process gas from exiting the canister. 41. The method of claim 40 further comprising:heating gas flowing through a second gas line, the second gas line teed to the first gas line between the canister and the processing chamber; and sweeping residual process gas between the tee and processing chamber with the heated gas flowing through the second gas line. 42. The method of claim 40 further comprising:sensing temperatures of gases flowing into and out of the canister. 43. The method of claim 39, wherein the solid precursor material being sublimed is a material selected from the group consisting of xenon difluoride, pentakis (dimethylamino) tantalum, nickel carbonyl and tungsten hexa-carbonyl.44. The method of claim 39, wherein the step of flowing heated carrier gas into the canister further comprises:flowing gas between a plurality of first spacing elements and a plurality of second spacing elements, wherein the second spacing elements are distinctly different and separately identifiable from the first spacing elements and a relationship between the first spacing elements and the second spacing elements is expressed by: 0.8<R2/R1<0.95 where:R1 is a mean diameter of the first spacing element; and R2 is a mean diameter of the second spacing element. 45. A method for generating gas for a semiconductor processing chamber, comprising:heating gas flowing through a first gas line; flowing the heated gas through a canister to sublime a process gas from a solid precursor material contained in the canister; reducing the temperature of the gas flowing through the canister to limit process gas generation; closing a valve disposed between the canister and processing chamber to prevent process gas from exiting the canister; heating gas flowing through a second gas line, the second gas line teed to the first gas line between the valve and the processing chamber; and purging residual process gas between the tee and processing chamber with the heated gas from the second gas line. 46. A method for generating gas for a processing chamber, comprising:flowing a carrier gas through an interstitial space defined between a plurality of first spacing elements and a plurality of second spacing elements disposed in a canister, the second spacing elements distinctly different and separately identifiable from the first spacing elements; and generating a process gas from a solid precursor material disposed in the interstitial space by sublimation. 47. The method of claim 46 further comprising:heating the carrier gas prior to entering the canister. 48. The method of claim 47 further comprising:reducing the temperature of the gas flowing through the canister after a predetermined volume of process gas has been generated. 49. The method of claim 48 further comprising:preventing process gas from exiting the canister. 50. The method of claim 48 further comprising:condensing the process gas on the first spacing elements and the second spacing elements. 51. The method of claim 48 further comprising:heating gas flowing through a second gas line, the second gas line teed to the first gas line between the canister and the processing chamber; and sweeping residual process gas between the tee and processing chamber with the heated gas flowing through the second gas line. 52. The method of claim 47 further comprising:sensing temperatures of gases flowing into and out of the canister; and adjusting the temperature of the gases in response to the sensed temperature. 53. The method of claim 46, wherein the solid precursor material being sublimed is a material selected from the group consisting of xenon difluoride, pentakis (dimethylamino) tantalum, nickel carbonyl and tungsten hexa-carbonyl.54. The method of claim 46, wherein a relationship between the first spacing elements and the second spacing elements is expressed by:0.8<R2/R1<0.95 where:R1 is a mean diameter of the first spacing element; and R2 is a mean diameter of the second spacing element. 55. A method for charging a gas generation canister, the method comprising:dispensing a solid precursor material between a plurality of first spacing elements and a plurality of second spacing elements disposed in a canister, the second spacing elements distinctly different and separately identifiable from the first spacing elements; and sealing the canister to prevent leakage of gas therefrom. 56. The method of claim 55, wherein the step of dispensing the solid precursor material further comprises:opening a valve coupled to canister as a unit and passing the solid precursor material therethrough. 57. The method of claim 56, wherein the step of sealing the canister comprises:closing the valve. 58. The method of claim 55, wherein the step of dispensing the solid precursor material further comprises:agitating the canister. 59. The method of claim 55, wherein the step of dispensing the solid precursor material recharges the canister with precursor material.60. The method of claim 55, wherein a relationship between the first spacing elements and the second spacing elements is expressed by:0.8<R2/R1<0.95 where:R1 is a mean diameter of the first spacing element; and R2 is a mean diameter of the second spacing element. 61. The method of claim 55, wherein the solid precursor material being sublimed is a material selected from the group consisting of xenon difluoride, pentakis (dimethylamino) tantalum (PDMAT), nickel carbonyl and tungsten hexa-carbonyl.62. A method for charging a gas generation canister, the method comprising:intermixing a solid precursor material with a plurality of first spacing elements and a plurality of second spacing elements, the second spacing elements distinctly different and separately identifiable from the first spacing elements; disposing the intermixed spacing elements and precursor material into a canister; and sealing the canister to prevent leakage of gas therefrom. 63. The method of claim 62, wherein the solid precursor material being sublimed is a material selected from the group consisting of xenon difluoride, pentakis (dimethylamino) tantalum, nickel carbonyl and tungsten hexa-carbonyl.
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