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Gas delivery apparatus and method for atomic layer deposition 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23F-001/00
  • H01L-021/306
  • C23C-016/00
출원번호 US-0032284 (2001-12-21)
발명자 / 주소
  • Chen, Ling
  • Ku, Vincent
  • Wu, Dien-Yeh
  • Chung, Hua
  • Ouye, Alan
  • Nakashima, Norman
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Moser, Patterson &
인용정보 피인용 횟수 : 125  인용 특허 : 248

초록

One embodiment of the gas delivery assembly comprises a covering member having an expanding channel at a central portion of the covering member and having a bottom surface extending from the expanding channel to a peripheral portion of the covering member. One or more gas conduits are coupled to the

대표청구항

1. A chamber, comprising:a substrate support having a substrate receiving surface; a chamber lid comprising; an expanding channel at a central portion of the chamber lid; and a tapered bottom surface extending from the expanding channel to a peripheral portion of the chamber lid, wherein the tapered

이 특허에 인용된 특허 (248)

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