초록 ▼

An improved method of integrally attaching a heat sink to an IC package for enhancing the thermal conductivity of the package. A heat sink matrix, which is dividable into a plurality of individual heat sinks, is attached to an IC package matrix, which is comprised of a plurality of individual IC pac

An improved method of integrally attaching a heat sink to an IC package for enhancing the thermal conductivity of the package. A heat sink matrix, which is dividable into a plurality of individual heat sinks, is attached to an IC package matrix, which is comprised of a plurality of individual IC packages abutting each other in a matrix arrangement. The IC package matrix and the heat sink matrix attached thereto are then simultaneously cut by means of a machine tool into a plurality of individually formed IC packages each with a heat sink attached; thereby, thermal conductivity of a conventional IC package is enhanced.

대표청구항 ▼

1. A method of manufacturing a plurality of IC (Integrated Circuit) packages each having an heat sink matrix integrally attached thereon, comprising the steps of:providing a communal substrate; attaching a plurality of semiconductor dies fixedly onto said communal substrate; providing the heat sink

1. A method of manufacturing a plurality of IC (Integrated Circuit) packages each having an heat sink matrix integrally attached thereon, comprising the steps of:providing a communal substrate; attaching a plurality of semiconductor dies fixedly onto said communal substrate; providing the heat sink matrix; providing a molding apparatus, comprising: a lower mold half for holding said communal substrate with said semiconductor dies fixedly attached thereon; and a upper mold half for holding said heat sink matrix; wherein, said lower mold half and said upper mold half of the molding apparatus are combined in order to be filled by a melted molding material during a molding process and said heat sink matrix is held on said upper mold half by means of vacuum suction; placing said communal substrate with said semiconductor dies fixedly attached thereon and said heat sink matrix into said molding apparatus; filling the melted molding material into said molding apparatus to collectively encapsulate said semiconductor dies fixedly attached on said communal substrate and said heat sink matrix thereby forming an IC package matrix integrated with said heat sink matrix after said molding material is permanently set; extracting said IC package matrix integrated with said heat sink matrix from the molding apparatus; and dividing said IC package matrix integrated with said heat sink matrix into said IC packages each having said heat sink integrally attached thereon. 2. The method as claimed in claim 1, wherein said IC package is a BGA (Ball Grid Array) package.3. The method as claimed in claim 1, wherein said heat sink matrix is made of a copper material.4. The method as claimed in claim 1, wherein said heat sink matrix is made of an aluminum material.5. The method as claimed in claim 1, further comprising a step of coating a Cr film on said heat sink matrix before the step of placing said heat sink matrix into said molding apparatus.6. The method as claimed in claim 1, further comprising a step of coating a chromium oxide film on said heat sink matrix before the step of placing said heat sink matrix into said molding apparatus.7. The method as claimed in claim 1, further comprising a step of coating a Ni film on said heat sink matrix before the step of placing said heat sink matrix into said molding apparatus.8. The method as claimed in claim 1, further comprising a step of forming a rough surface on said heat sink matrix before the step of placing said heat sink matrix into said molding apparatus.9. A method of manufacturing a plurality of IC (Integrated Circuit) packages each having an heat sink matrix integrally attached thereon, comprising the steps of:providing a communal substrate; attaching a plurality of semiconductor dies fixedly onto said communal substrate; providing the heat sink matrix; forming a notch grid constituted of a network of notches on said heat sink matrix; providing a molding apparatus; placing said communal substrate with said semiconductor dies fixedly attached thereon and said heat sink matrix into said molding apparatus; filling a melted molding material into said molding apparatus to collectively encapsulate said semiconductor dies fixedly attached on said communal substrate and said heat sink matrix thereby forming an IC package matrix integrated with said heat sink matrix after said molding material is permanently set; extracting said IC package matrix integrated with said heat sink matrix from the molding apparatus; and dividing said IC package matrix integrated with said heat sink matrix into said IC packages each having said heat sink integrally attached thereon. 10. The method as claimed in claim 9, wherein said dividing step is conducted by cutting along said notch grid on said heat sink matrix integrated with said IC package matrix.11. A method of manufacturing an IC (Integrated Circuit) package having a heat sink integrally attached thereon, comprising the steps of:providing a substrate; attaching a semiconductor die fixedly onto said substrate; providing the heat sink; providing a molding apparatus, comprising: a lower mold half for holding said substrate with said semiconductor die fixedly attached thereon; and an upper mold half for holding said heat sink, wherein said lower mold half and said upper mold half of the molding apparatus are combined in order to be filled by a melted molding material during a molding process and said heat sink is held on said upper mold half by means of vacuum suction; placing said substrate with said semiconductor die fixedly attached thereon and said heat sink into said molding apparatus; filling the melted molding material into said molding apparatus to collectively encapsulate said semiconductor die fixedly attached on said substrate and said heat sink thereby forming an IC package integrated with said heat sink after said molding material is permanently set; and extracting said IC package integrated with said heat sink from the molding apparatus.