초록 ▼

The invention discloses an assembly capable of writing/erasing high-density data, preferably on a phase-change recording media. A preferred embodiment of the invention features a novel thermal near-field heater that may be employed in the assembly, preferably for writing in a substantially thermal n

The invention discloses an assembly capable of writing/erasing high-density data, preferably on a phase-change recording media. A preferred embodiment of the invention features a novel thermal near-field heater that may be employed in the assembly, preferably for writing in a substantially thermal near-field mode. The invention provides advantages of writing densities greater than that of diffraction limited systems, for example, writing densities of approximately greater than 100 Gbit/inch2, and writing speeds approximately greater than 100 MHz.

대표청구항 ▼

1. An assembly for writing and/or erasing high-density data on a recording media as a series of tags comprising an information bit pattern, the assembly comprising:1) a thermal heater for generating and directing an incident thermal wave to a media; and 2) a position controller for coordinating a mu

1. An assembly for writing and/or erasing high-density data on a recording media as a series of tags comprising an information bit pattern, the assembly comprising:1) a thermal heater for generating and directing an incident thermal wave to a media; and 2) a position controller for coordinating a mutual positioning of the incident thermal wave and a media for inducing a direct thermal coupling therebetween; the assembly acting as a writer/and or eraser by operating the position controller so that writing and/or erasing can be enabled by using an information signal for modulating a localized thermal wave generated in the vicinity of a media.2. An assembly according to claim 1, wherein the thermal heater comprises:1) a heating plate that can operate as a heat source; and 2) a heat sink attached to the heating plate; the heater capable of developing a thermal near-field coupling with the media. 3. An assembly according to claim 2, wherein the heating plate comprises a tip that can operate as the heat source.4. An assembly according to claim 2, wherein the heating plate defines a dedicated edge that can operate as the heat source.5. An assembly according to claim 2, further comprising a focused laser beam thermally coupled to the heat sink.6. An assembly according to claim 2, further comprising a wave-guided laser beam thermally coupled to the heat sink.7. An assembly according to claim 2, further comprising a resistive heating unit thermally coupled to the heat sink.8. An assembly according to claim 1, wherein the thermal heater comprises an atomic force microscope probe.9. An assembly according to claim 1, wherein the position controller coordinates the mutual positioning of the incident thermal wave and a media for inducing a direct thermal coupling therebetween that subsumes at least one portion of a thermal near-field.10. An assembly according to claim 1, wherein the thermal coupling subsumes at least one of ballistic, diffusive, conductive, and convective heat transfer.