초록 ▼

A channel 16 of a FinFET 10 has a channel core 24 and a channel envelope 32, each made from a semiconductor material defining a different lattice structure to exploit strained silicon properties. A gate is coupled to the channel envelope through a gate dielectric. Exemplary materials are Si and SixG

A channel 16 of a FinFET 10 has a channel core 24 and a channel envelope 32, each made from a semiconductor material defining a different lattice structure to exploit strained silicon properties. A gate is coupled to the channel envelope through a gate dielectric. Exemplary materials are Si and SixGe1-x, wherein 78<x<92. The channel core 24 has a top surface 26 of width wc and an upstanding surface 28, 30 of height hc, preferably oriented 90° to one another. The channel envelope 32 is in contact with the top 26 and upstanding surfaces 28, 30 so that the area of interface is increased as compared to contact only along the top surface 26, improving electrical conductivity and gate 18 control over the channel 16. The height hc can be tailored to enable a smaller scale FET 10 within a stabilized SRAM. Various methods of making the channel 16 are disclosed, including a mask and etch method, a handle wafer/carrier wafer method, and a shallow trench method. Embodiments and methods for FinFETs with one to four gates are disclosed.

대표청구항 ▼

1. A channel for electrically connecting a source and a drain of a field effect transistor (FET) comprising:a channel core coupled to a substrate and defining a top surface spaced from the substrate and opposed sidewall surfaces between the substrate and the top surface, wherein the channel core com

1. A channel for electrically connecting a source and a drain of a field effect transistor (FET) comprising:a channel core coupled to a substrate and defining a top surface spaced from the substrate and opposed sidewall surfaces between the substrate and the top surface, wherein the channel core comprises a first semiconductor material defining a first lattice structure; a channel envelope in contact with the opposed sidewall surfaces and the top surface, wherein the channel envelope comprises a second semiconductor material defining a second lattice structure that differs from the first lattice structure; a gate oxide disposed about a surface of the channel envelope that is opposite the channel core. 2. The channel of claim 1 further comprising a gate coupled through the gate oxide to at least two surfaces defined by the channel envelope.3. The channel of claim 1 wherein at least one of the sidewall surfaces defines a height hc and the top surface defines a width wc, and wherein hc?3wc.4. The channel of claim 1 wherein the channel is a component of an FET and the FET is a component of a SRAM, and at least one of the sidewall surfaces defines a height hc that is selected to increase stability of the SRAM.5. The channel of claim 1 wherein the top surface defines a width w that is selected to maximize one of stretching and of compressing the lattice structure of one of the first and the second semiconductor material.6. The channel of claim 1 wherein the second semiconductor material substantially covers the two sidewall surfaces and the top surface.7. The channel of claim 1 wherein one of the first and second semiconductor materials comprises silicon and germanium.8. In a channel for a field effect transistor, the improvement comprising:a channel core defining at least a top and at least one adjoining side surface; a channel envelope in contact with the top surface and the at least one side surface; a gate oxide disposed on at least two surfaces of the channel envelope, said surfaces of the channel envelope being opposed to the top surface and the at least one side surface; wherein the channel core comprises a first semiconductor material and the channel envelope comprises a second semiconductor material, and at least one of the first and second semiconductor materials exhibits one of a stretched and a compressed lattice structure. 9. A field effect transistor (FET) comprising:a channel core coupled to a substrate and defining a top surface spaced from the substrate and opposed sidewall surfaces between the substrate and the top surface, wherein the channel core comprises a first semiconductor material defining a first lattice structure; a channel envelope in contact with the opposed sidewall surfaces and the top surface, wherein the channel envelope comprises a second semiconductor material defining a second lattice structure that differs from the first lattice structure; a gate oxide disposed about a surface of the channel envelope that is opposite the channel core; and a gate coupled to the channel core through the gate oxide, said gate disposed at least partially within the substrate. 10. The FET of claim 9 wherein the said gate is a first gate that extends parallel to one of said opposed sidewall surfaces, the FET further comprising a second gate that extends parallel to the other of said sidewall surfaces.11. The FET of claim 9 wherein each of said first and second gates are disposed only partially within said substrate.12. The FET of claim 11 further comprising a third gate disposed parallel to the said top surface and electrically coupling the first and second gates.13. The FET of claim 12 wherein the third gate is not disposed at least partially within said substrate.14. The FET of claim 9 wherein the said gate is a first gate that extends parallel to said top surface, the FET further comprising a second gate that extends parallel to said top surface and not disposed at least partially within said substrate.15. The FET of claim 14 further comprising a third and fourth gate each disposed parallel to said opposed sidewalls and each electrically coupling said first and second gates to one another.16. A field effect transistor (FET) comprising:a channel core coupled to a substrate and defining a top surface spaced from the substrate and opposed sidewall surfaces between the substrate and the top surface, wherein the channel core comprises a first semiconductor material defining a first lattice structure; a channel envelope in contact with the opposed sidewall surfaces and the top surface, wherein the channel envelope comprises a second semiconductor material defining a second lattice structure that differs from the first lattice structure; a gate oxide disposed about a surface of the channel envelope that is opposite the channel core; and first and second gates coupled to the channel core through the gate oxide, said first and second gates disposed on opposed sides of said channel core and not directly coupled to one another electrically. 17. The FET of claim 16 wherein said gates are disposed parallel to said top surface.18. The FET of claim 17 wherein said first gate is at least partially disposed within said substrate.19. The FET of claim 16 wherein said gates are disposed parallel to said opposed sidewalls.20. The FET of claim 19 wherein a portion of each of said gates is disposed within said substrate.21. The FET of claim 16 further comprising a first control coupled to the first gate and a second control for controlling to the second gate, wherein the first and second controls are independent of one another.22. The FET of claim 21 wherein the first control comprises a first voltage source that applies a variable voltage to the first gate.23. The FET of claim 22 wherein the second control operates to select between on and off for the second gate, and the first and second controls operate in conjunction with one another.