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Needle assembly of probe card 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01R-001/073
출원번호 US-0742122 (2003-12-19)
우선권정보 KR-0022937 (2003-04-11)
발명자 / 주소
  • Jun, Tae-Un
출원인 / 주소
  • Yulim Hitech, Inc.
대리인 / 주소
    Dilworth &
인용정보 피인용 횟수 : 62  인용 특허 : 7

초록

A needle assembly of probe card includes a plate and needles formed therein for enhancing an assembly characteristic and productivity and increasing an exact and reliable characteristic test. The plate is provided with holes that are formed with an insulating film on an inner side surface thereof. O

대표청구항

1. A needle assembly of a probe card, comprising:a plate made of silicon material, said plate being formed therein with holes having a predetermined width and length and spaced from one another at predetermined intervals, an inner side of said holes each being formed with an insulating film having a

이 특허에 인용된 특허 (7)

  1. Ban, Naoto; Namba, Masaaki; Hasebe, Akio; Wada, Yuji; Kohno, Ryuji; Seito, Akira; Motoyama, Yasuhiro, Fabrication method of semiconductor integrated circuit device and its testing apparatus.
  2. Swapp Mavin (Mesa AZ), Micromachined semiconductor probe card.
  3. Soejima Koji,JPX ; Senba Naoji,JPX, Probe card with plural probe tips on a unitary flexible tongue.
  4. Cho, Dong-il; Park, Sangjun, Probe structure for testing semiconductor devices and method for fabricating the same.
  5. Nakano Shoukichi (Kawasaki JPX), Prober for semiconductor integrated circuit element wafer.
  6. Tada Tetsuo (Hyogo JPX) Takagi Ryoichi (Hyogo JPX) Kohara Masanobu (Hyogo JPX), Probing plate for wafer testing.
  7. Kanamaru, Masatoshi; Endo, Yoshishige; Hosogane, Atsushi; Nagata, Tatsuya; Kohno, Ryuji; Aoki, Hideyuki; Ariga, Akihiko, Semiconductor testing equipment with probe formed on a cantilever of a substrate.

이 특허를 인용한 특허 (62)

  1. Strid, Eric; Gleason, K. Reed, Active wafer probe.
  2. Strid,Eric; Gleason,K. Reed, Active wafer probe.
  3. Kim, Tae Ma; Nagai, Bunsaki, Alignment features in a probing device.
  4. Kim, Tae Ma; Nagai, Bunsaki, Alignment features in a probing device.
  5. Strid, Eric; Campbell, Richard, Calibration structures for differential signal probing.
  6. Hall, James, Device for testing surface mounted connectors.
  7. Campbell, Richard; Strid, Eric W.; Andrews, Mike, Differential signal probe with integral balun.
  8. Strid, Eric; Campbell, Richard, Differential signal probing system.
  9. Campbell, Richard L.; Andrews, Michael, Differential waveguide probe.
  10. Burcham, Terry; McCann, Peter; Jones, Rod, Double sided probing structures.
  11. Burcham,Terry; McCann,Peter; Jones,Rod, Double sided probing structures.
  12. Andrews, Peter; Hess, David; New, Robert, Interface for testing semiconductors.
  13. Gleason, K. Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
  14. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
  15. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing structure with laterally scrubbing contacts.
  16. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing system.
  17. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth; Lesher,Timothy; Koxxy,Martin, Membrane probing system.
  18. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth; Lesher,Timothy; Koxxy,Martin, Membrane probing system.
  19. Smith,Kenneth; Gleason,Reed, Membrane probing system.
  20. Smith,Kenneth; Gleason,Reed, Membrane probing system.
  21. Tervo,Paul A.; Smith,Kenneth R.; Cowan,Clarence E.; Dauphinais,Mike P.; Koxxy,Martin J., Membrane probing system.
  22. Tervo,Paul A.; Smith,Kenneth R.; Cowan,Clarence E.; Dauphinais,Mike P.; Koxxy,Martin J., Membrane probing system.
  23. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing system with local contact scrub.
  24. Gleason,K. Reed; Smith,Kenneth R.; Bayne,Mike, Membrane probing system with local contact scrub.
  25. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth, Method for constructing a membrane probe using a depression.
  26. Hayden, Leonard; Martin, John; Andrews, Mike, Method of assembling a wafer probe.
  27. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth, Method of constructing a membrane probe.
  28. Nulty, James E.; Hunter, James A.; Herrera, Alexander J., Method of fabricating a probe card.
  29. Smith, Kenneth R., Method of replacing an existing contact of a wafer probing assembly.
  30. Strid,Eric; Campbell,Richard, On-wafer test structures for differential signals.
  31. Nulty,James E.; Hunter,James A.; Herrera,Alexander J., Probe card and method for constructing same.
  32. Kim,Bong Hwan; Chun,Kukjin; Chung,Doo Yun; Jeong,Chi Hwan, Probe card having deeply recessed trench and method for manufacturing the same.
  33. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  34. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  35. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  36. Campbell,Richard L.; Andrews,Michael; Bui,Lynh, Probe for high frequency signals.
  37. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Probe for testing a device under test.
  38. Petersen, Dirch; Hansen, Torben Mikael; Petersen, Peter R. E., Probe for testing electrical properties of a test sample.
  39. Shiraishi, Akinori; Fujihara, Kosuke, Probe guide plate and method for manufacturing the same.
  40. Smith, Kenneth; Jolley, Michael; Van Syckel, Victoria, Probe head having a membrane suspended probe.
  41. Smith,Kenneth; Jolley,Michael; Van Syckel,Victoria, Probe head having a membrane suspended probe.
  42. Schwindt,Randy, Probe holder for testing of a test device.
  43. Smith, Kenneth R.; Hayward, Roger, Probing apparatus with impedance optimized interface.
  44. Smith, Kenneth R., Replaceable coupon for a probing apparatus.
  45. Talledo, Jefferson; Dimayuga, Godfrey, Semiconductor package with cantilever pads.
  46. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for high-frequency testing of a device under test.
  47. Gleason, K. Reed; Lesher, Tim; Strid, Eric W.; Andrews, Mike; Martin, John; Dunklee, John; Hayden, Leonard; Safwat, Amr M. E., Shielded probe for testing a device under test.
  48. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
  49. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
  50. Gleason,K. Reed; Lesher,Tim; Andrews,Mike; Martin,John, Shielded probe for testing a device under test.
  51. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for testing a device under test.
  52. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for testing a device under test.
  53. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe with low contact resistance for testing a device under test.
  54. Talledo, Jefferson; Dimayuga, Godfrey, Stacked semiconductor packages with cantilever pads.
  55. Andrews, Peter; Hess, David, System for testing semiconductors.
  56. Campbell, Richard, Test structure and probe for differential signals.
  57. Campbell,Richard, Test structure and probe for differential signals.
  58. Hayden, Leonard; Martin, John; Andrews, Mike, Wafer probe.
  59. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  60. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  61. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  62. Campbell, Richard, Wideband active-passive differential signal probe.
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