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A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base to define a chamber. The flexible membrane has a core of a first material and an outer layer of a second material having a lower adhesion to the substrate than the first

A carrier head for chemical mechanical polishing of a substrate includes a base and a flexible membrane extending beneath the base to define a chamber. The flexible membrane has a core of a first material and an outer layer of a second material having a lower adhesion to the substrate than the first material. An exposed surface of the outer layer provides a mounting surface for the substrate.

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1. A carrier head for chemical mechanical polishing of a substrate, comprising:a base; anda flexible membrane extending beneath the base to define a chamber and provide a mounting surface against which a substrate may be positioned, wherein the mounting surface holds the substrate and the mounting s

1. A carrier head for chemical mechanical polishing of a substrate, comprising:a base; anda flexible membrane extending beneath the base to define a chamber and provide a mounting surface against which a substrate may be positioned, wherein the mounting surface holds the substrate and the mounting surface includes a low adhesive material to which the substrate does not readily adhere.2. The carrier head of claim 1, wherein:the mounting surface has a surface stickiness that is sufficiently low to allow for unrestrained detachment of the substrate from the flexible membrane in response to pressure changes in the chamber.3. A carrier head for chemical mechanical polishing of a substrate, comprising:a base, anda flexible membrane extending beneath the base to define a chamber, the flexible membrane including a core of a first material and an outer layer of a second material having a lower adhesion to the substrate than the first material, an exposed surface of the outer layer providing a mounting surface that holds the substrate.4. The carrier head of claim 3, wherein the first material is an elastomer and the second material is a polymer.5. The carrier head of claim 3, wherein a thickness of the outer layer is between about 0.4 and 0.7 microns.6. The carrier head of claim 3 wherein a coefficient of friction of the mounting surface against the substrate is less than about 0.5.7. The carrier head of claim 3, wherein:the mounting surface has a surface stickiness that is sufficiently low to allow for unrestrained detachment of the substrate from the flexible membrane in response to pressure changes in the chamber.8. The carrier head of claim 3, wherein the second material is deposited on the first material.9. The carrier head of claim 8, wherein the second material is deposited on the first material by gas phase polymerization coating.10. The carrier head of claim 3, wherein the second material is deposited on selected portions of the first material to form a first area including the low adhesive material and a second area free of the low adhesive material.11. A carrier head for chemical mechanical polishing of a substrate, comprising:a base; anda flexible membrane extending beneath the base to define a chamber, the flexible membrane including an inner portion formed of a first material and an outer portion formed of a second material, the outer portion providing a mounting surface against which a substrate is positioned such that the outer portion holds the substrate, the second material having a lower adhesion to the substrate than the first material.12. The carrier head of claim 11, wherein:the mounting surface has a surface stickiness that is sufficiently low to allow for unrestrained detachment of the substrate from the flexible membrane in response to pressure changes in the chamber.13. A flexible membrane for a carrier head, comprising:a core of a first material; andan outer layer of a second material formed over the core, an exposed surface of the outer layer providing a mounting surface for a substrate, wherein the mounting surface holds the substrate and the second material has a lower adhesion to the substrate than the first material.14. The flexible membrane of claim 13, wherein the first material is an elastomer and the second material is a polymer.15. The flexible membrane of claim 13, wherein a thickness of the outer layer is between about 0.4 and 0.7 microns.16. The flexible membrane of claim 13, wherein a coefficient of friction of the mounting surface against the substrate is less than about 0.5.17. The flexible membrane of claim 13, wherein the second material is deposited on the first material.18. The flexible membrane of claim 17, wherein the second material is deposited on the first material by gas phase polymerization coating.19. The flexible membrane of claim 13, wherein the second material is deposited on selected portions of the first material to form a first area having the low adhesive material and a second area free of the low adhesive material.