|국가/구분||United States(US) Patent 등록|
|미국특허분류(USC)||361/679; 174/052.4; 257/680; 439/083|
|§371/§102 date||20040809 (20040809)|
|발명자 / 주소|
|대리인 / 주소||
|인용정보||피인용 횟수 : 42 인용 특허 : 15|
A cover assembly for welding to a package base to form a hermetically sealed micro-device package. The cover assembly includes a sheet of a transparent material having a window portion. A built-up metallic frame adheres to the sheet and circumscribes the window portion, the frame having been deposited as follows: First, powdered metal particles are sprayed onto a prepared area of the sheet using a gas jet at a temperature below the fusing temperature of the particles, the jet having a velocity sufficient to cause the particles to merge with one another u...
1. A cover assembly that can be joined to a micro-device package base to form a hermetically sealed micro-device package, the cover assembly including:a sheet of transparent material having a window portion defined thereupon; and a built-up metallic frame adhering to the sheet and circumscribing the window portion, the frame having been deposited onto the sheet by first spraying a first quantity of powdered metal particle onto a prepared frame-attachment area of the sheet using a jet of gas, the gas being at a temperature below the fusing temperature of ...