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특허 상세정보

Hermetically sealed micro-device package using cold-gas dynamic spray material deposition

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) G06F-001/16   
미국특허분류(USC) 361/679; 174/052.4; 257/680; 439/083
출원번호 US-0780172 (2004-02-16)
§371/§102 date 20040809 (20040809)
발명자 / 주소
대리인 / 주소
    Howison &
인용정보 피인용 횟수 : 42  인용 특허 : 15
초록

A cover assembly for welding to a package base to form a hermetically sealed micro-device package. The cover assembly includes a sheet of a transparent material having a window portion. A built-up metallic frame adheres to the sheet and circumscribes the window portion, the frame having been deposited as follows: First, powdered metal particles are sprayed onto a prepared area of the sheet using a gas jet at a temperature below the fusing temperature of the particles, the jet having a velocity sufficient to cause the particles to merge with one another u...

대표
청구항

1. A cover assembly that can be joined to a micro-device package base to form a hermetically sealed micro-device package, the cover assembly including:a sheet of transparent material having a window portion defined thereupon; and a built-up metallic frame adhering to the sheet and circumscribing the window portion, the frame having been deposited onto the sheet by first spraying a first quantity of powdered metal particle onto a prepared frame-attachment area of the sheet using a jet of gas, the gas being at a temperature below the fusing temperature of ...

이 특허에 인용된 특허 (15)

  1. Tatoh Nobuyoshi,JPX. Air-tightly sealed container for photosemiconductor, and photosemiconductor module. USP1999085945721.
  2. Kock Hendrikus G. (Eindhoven NLX). Coupler comprising a light source and lens. USP1982104355323.
  3. Ban, Naoto; Namba, Masaaki; Hasebe, Akio; Wada, Yuji; Kohno, Ryuji; Seito, Akira; Motoyama, Yasuhiro. Fabrication method of semiconductor integrated circuit device and its testing apparatus. USP2004026696849.
  4. Alkhimov Anatoly P. (ulitsa Vyazemskogo 2 ; kv. 72 Novosibirsk SUX) Papyrin Anatoly N. (ulitsa Vyazemskogo 2 ; kv. 72 Novosibirsk SUX) Kosarev Vladimir F. (Novosibirsk SUX) Nesterovich Nikolai I. (No. Gas-dynamic spraying method for applying a coating. USP1994045302414.
  5. Stark, David H.. Hermetically sealed micro-device package with window. USP2003096627814.
  6. Van Steenkiste Thomas H. ; Smith John R. ; Teets Richard E. ; Moleski Jerome J. ; Gorkiewicz Daniel W.. Kinetic spray coating method and apparatus. USP2000106139913.
  7. Sengupta Kabul S. ; Sklenicka Carl E. ; Thompson Deborah L. ; Arellano Raul A. ; Nagai Naoyuki,JPX ; Takehashi Nobuyuki,JPX ; Nomoto Kouichiro,JPX. Mass reflowable windowed package. USP2001026191359.
  8. Yang Thomas (Hsin-Chu TWX). Method for manufacturing a hybrid circuit charge-coupled device image sensor. USP1995065423119.
  9. O'Boyle John. Micro-electronic assembly including a flip-chip mounted micro-device and method. USP1999015856914.
  10. Glenn Thomas P.. Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device. USP1999095949655.
  11. Tower Steven A. ; Mravic Brian. Optical component package with a hermetic seal. USP2000026020628.
  12. Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.. Packaging of electro-microfluidic devices. USP2003046548895.
  13. Baret, Guy. Process for the manufacture of components on glass substrates that have to be sealed, such as flat display screens of the plasma-panel type. USP2003036537121.
  14. Yoneda Yoshiyuki (Kawasaki JPX) Tsuji Kazuto (Kawasaki JPX). Semiconductor device in a resin package housed in a frame having high thermal conductivity. USP1997045625222.
  15. Mehra Madhav (Rochester NY) Jackson Todd (Pittsford NY). Static control overlayers on opto-electronic devices. USP1992065118924.

이 특허를 인용한 특허 피인용횟수: 42

  1. Mott, Lawrence; Bettger, Kenneth; Brown, Elliot. Asymmetrical flexible edge seal for vacuum insulating glass. USP2012108283023.
  2. Krüger, Hans; Stelzl, Alois. Component arrangement provided with a carrier substrate. USP2009107608789.
  3. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce. Dynamic dehydriding of refractory metal powders. USP2012088246903.
  4. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce. Dynamic dehydriding of refractory metal powders. USP2013068470396.
  5. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce. Dynamic dehydriding of refractory metal powders. USP2015028961867.
  6. Stark, David H.; Honor, Patrick Michael. Edge seal assemblies for hermetic insulating glass units and vacuum insulating glass units. USP2017019546513.
  7. Leidl, Anton; Pahl, Wolfgang; Wolff, Ulrich. Electrical module comprising a MEMS microphone. USP2012058184845.
  8. Nagatsuka, Eiichi; Asaya, Yasumasa; Shida, Kaoru. Electronic component, laser device, optical writing device and image forming apparatus. USP2010037671434.
  9. Bauer, Christian; Krueger, Hans; Stelzl, Alois. Encapsulated electrical component and production method. USP2009067544540.
  10. Bettger, Kenneth J.; Stark, David H.. Filament-strung stand-off elements for maintaining pane separation in vacuum insulating glazing units. USP2013088512830.
  11. Miller, Steven A.; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf. Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom. USP2017109783882.
  12. Bettger, Kenneth J.; Stark, David H.. Flexible edge seal for vacuum insulating glazing units. USP2012128329267.
  13. Convert, Nicolas; Buchilly, Jean-Marie; Rohrbach, Stéphane. High-density connector. USP2016129531099.
  14. Stark, David H. Insulated glazing units. USP2010117832177.
  15. Stark, David H.. Insulating glass unit having multi-height internal standoffs and visible decoration. USP2011087989040.
  16. Dary, Francois-Charles; Gaydos, Mark; Loewenthal, William; Miller, Steven A.; Rozak, Gary; Volchko, Scott Jeffrey; Zimmermann, Stefan; Stawovy, Michael Thomas. Large-area sputtering targets. USP2016089412568.
  17. Miller, Steven A.; Kumar, Prabhat. Low-energy method of manufacturing bulk metallic structures with submicron grain sizes. USP2011108043655.
  18. Leidl, Anton; Pahl, Wolfgang; Wolff, Ulrich. MEMS microphone. USP2013118582788.
  19. Pahl, Wolfgang. MEMS microphone, production method and method for installing. USP2012078229139.
  20. Leidl, Anton; Krueger, Hans; Stelzl, Alois; Pahl, Wolfgang; Seitz, Stefan. MEMS package and method for the production thereof. USP2013048432007.
  21. Pahl, Wolfgang; Leidl, Anton; Seitz, Stefan; Krueger, Hans; Stelzl, Alois. MEMS package and method for the production thereof. USP2012058169041.
  22. Francis, IV, William H.; Freebury, Gregg E.; Beidleman, Neal J.; Hulse, Michael. Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit. USP20181110119327.
  23. Francis, IV, William H.; Freebury, Gregg E.; Beidleman, Neal J.; Hulse, Michael. Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit. USP2016059328512.
  24. Zimmermann, Stefan; Papp, Uwe; Kreye, Heinrich; Schmidt, Tobias. Method for coating a substrate surface and coated product. USP2014088802191.
  25. Miller, Steven A.; Schmidt-Park, Olaf; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmermann, Stefan. Methods of forming sputtering targets. USP2012068197894.
  26. Miller, Steven A.; Shekhter, Leonid N.; Zimmerman, Stefan. Methods of joining metallic protective layers. USP2013058448840.
  27. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan. Methods of joining metallic protective layers. USP2015089095932.
  28. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan. Methods of joining metallic protective layers. USP2014078777090.
  29. Miller, Steven A.; Shekhter, Leonid N.; Zimmerman, Stefan. Methods of joining protective metal-clad structures. USP2011088002169.
  30. Volchko, Scott Jeffrey; Zimmermann, Stefan; Miller, Steven A.; Stawovy, Michael Thomas. Methods of manufacturing high-strength large-area sputtering targets. USP2014058734896.
  31. Loewenthal, William; Miller, Steven Alfred. Methods of manufacturing large-area sputtering targets. USP2015099120183.
  32. Miller, Steven A.; Dary, Francois-Charles; Gaydos, Mark; Rozak, Gary. Methods of manufacturing large-area sputtering targets by cold spray. USP2014048703233.
  33. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred. Methods of manufacturing large-area sputtering targets using interlocking joints. USP2015089108273.
  34. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred. Methods of manufacturing large-area sputtering targets using interlocking joints. USP2016039293306.
  35. Miller, Steven A.; Kumar, Prabhat; Wu, Rong-chein Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf. Methods of rejuvenating sputtering targets. USP2014118883250.
  36. Miller, Steven A.; Schmidt-Park, Olaf; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmerman, Stefan. Methods of rejuvenating sputtering targets. USP2013078491959.
  37. Miller, Seth A.; Stark, David H.; Francis, IV, William H.; Puligandla, Viswanadham; Boulos, Edward N.; Pernicka, John. Multi-pane glass unit having seal with adhesive and gas-restrictive coating layer. USP2017019540863.
  38. Miller, Seth A.; Stark, David H.; Francis, IV, William H.; Puligandla, Viswanadham; Boulos, Edward N.; Pernicka, John. Multi-pane glass unit having seal with adhesive and hermetic coating layer. USP2015028950162.
  39. Shekhter, Leonid N.; Miller, Steven A.; Haywiser, Leah F.; Wu, Rong-Chein R.. Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof. USP2014058715386.
  40. Shekhter, Leonid N.; Miller, Steven A.; Haywiser, Leah F.; Wu, Rong-Chein Richard. Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof. USP2012078226741.
  41. Miller, Steven A.; Shekhter, Leonid N.; Zimmerman, Stefan. Protective metal-clad structures. USP2012028113413.
  42. Stark, David H.. Wafer-level hermetic micro-device packages. USP2009047517712.