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Hermetically sealed micro-device package using cold-gas dynamic spray material deposition

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-001/16
출원번호 US-0780172 (2004-02-16)
§371/§102 date 20040809 (20040809)
발명자 / 주소
  • Stark, David H.
대리인 / 주소
    Howison &
인용정보 피인용 횟수 : 42  인용 특허 : 15

초록

A cover assembly for welding to a package base to form a hermetically sealed micro-device package. The cover assembly includes a sheet of a transparent material having a window portion. A built-up metallic frame adheres to the sheet and circumscribes the window portion, the frame having been deposit

대표청구항

1. A cover assembly that can be joined to a micro-device package base to form a hermetically sealed micro-device package, the cover assembly including:a sheet of transparent material having a window portion defined thereupon; and a built-up metallic frame adhering to the sheet and circumscribing the

이 특허에 인용된 특허 (15)

  1. Tatoh Nobuyoshi,JPX, Air-tightly sealed container for photosemiconductor, and photosemiconductor module.
  2. Kock Hendrikus G. (Eindhoven NLX), Coupler comprising a light source and lens.
  3. Ban, Naoto; Namba, Masaaki; Hasebe, Akio; Wada, Yuji; Kohno, Ryuji; Seito, Akira; Motoyama, Yasuhiro, Fabrication method of semiconductor integrated circuit device and its testing apparatus.
  4. Alkhimov Anatoly P. (ulitsa Vyazemskogo 2 ; kv. 72 Novosibirsk SUX) Papyrin Anatoly N. (ulitsa Vyazemskogo 2 ; kv. 72 Novosibirsk SUX) Kosarev Vladimir F. (Novosibirsk SUX) Nesterovich Nikolai I. (No, Gas-dynamic spraying method for applying a coating.
  5. Stark, David H., Hermetically sealed micro-device package with window.
  6. Van Steenkiste Thomas H. ; Smith John R. ; Teets Richard E. ; Moleski Jerome J. ; Gorkiewicz Daniel W., Kinetic spray coating method and apparatus.
  7. Sengupta Kabul S. ; Sklenicka Carl E. ; Thompson Deborah L. ; Arellano Raul A. ; Nagai Naoyuki,JPX ; Takehashi Nobuyuki,JPX ; Nomoto Kouichiro,JPX, Mass reflowable windowed package.
  8. Yang Thomas (Hsin-Chu TWX), Method for manufacturing a hybrid circuit charge-coupled device image sensor.
  9. O'Boyle John, Micro-electronic assembly including a flip-chip mounted micro-device and method.
  10. Glenn Thomas P., Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device.
  11. Tower Steven A. ; Mravic Brian, Optical component package with a hermetic seal.
  12. Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D., Packaging of electro-microfluidic devices.
  13. Baret, Guy, Process for the manufacture of components on glass substrates that have to be sealed, such as flat display screens of the plasma-panel type.
  14. Yoneda Yoshiyuki (Kawasaki JPX) Tsuji Kazuto (Kawasaki JPX), Semiconductor device in a resin package housed in a frame having high thermal conductivity.
  15. Mehra Madhav (Rochester NY) Jackson Todd (Pittsford NY), Static control overlayers on opto-electronic devices.

이 특허를 인용한 특허 (42)

  1. Mott, Lawrence; Bettger, Kenneth; Brown, Elliot, Asymmetrical flexible edge seal for vacuum insulating glass.
  2. Krüger, Hans; Stelzl, Alois, Component arrangement provided with a carrier substrate.
  3. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  4. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  5. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  6. Stark, David H.; Honor, Patrick Michael, Edge seal assemblies for hermetic insulating glass units and vacuum insulating glass units.
  7. Leidl, Anton; Pahl, Wolfgang; Wolff, Ulrich, Electrical module comprising a MEMS microphone.
  8. Nagatsuka, Eiichi; Asaya, Yasumasa; Shida, Kaoru, Electronic component, laser device, optical writing device and image forming apparatus.
  9. Bauer, Christian; Krueger, Hans; Stelzl, Alois, Encapsulated electrical component and production method.
  10. Bettger, Kenneth J.; Stark, David H., Filament-strung stand-off elements for maintaining pane separation in vacuum insulating glazing units.
  11. Miller, Steven A.; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom.
  12. Bettger, Kenneth J.; Stark, David H., Flexible edge seal for vacuum insulating glazing units.
  13. Convert, Nicolas; Buchilly, Jean-Marie; Rohrbach, Stéphane, High-density connector.
  14. Stark, David H, Insulated glazing units.
  15. Stark, David H., Insulating glass unit having multi-height internal standoffs and visible decoration.
  16. Dary, Francois-Charles; Gaydos, Mark; Loewenthal, William; Miller, Steven A.; Rozak, Gary; Volchko, Scott Jeffrey; Zimmermann, Stefan; Stawovy, Michael Thomas, Large-area sputtering targets.
  17. Miller, Steven A.; Kumar, Prabhat, Low-energy method of manufacturing bulk metallic structures with submicron grain sizes.
  18. Leidl, Anton; Pahl, Wolfgang; Wolff, Ulrich, MEMS microphone.
  19. Pahl, Wolfgang, MEMS microphone, production method and method for installing.
  20. Leidl, Anton; Krueger, Hans; Stelzl, Alois; Pahl, Wolfgang; Seitz, Stefan, MEMS package and method for the production thereof.
  21. Pahl, Wolfgang; Leidl, Anton; Seitz, Stefan; Krueger, Hans; Stelzl, Alois, MEMS package and method for the production thereof.
  22. Francis, IV, William H.; Freebury, Gregg E.; Beidleman, Neal J.; Hulse, Michael, Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit.
  23. Francis, IV, William H.; Freebury, Gregg E.; Beidleman, Neal J.; Hulse, Michael, Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit.
  24. Zimmermann, Stefan; Papp, Uwe; Kreye, Heinrich; Schmidt, Tobias, Method for coating a substrate surface and coated product.
  25. Miller, Steven A.; Schmidt-Park, Olaf; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmermann, Stefan, Methods of forming sputtering targets.
  26. Miller, Steven A.; Shekhter, Leonid N.; Zimmerman, Stefan, Methods of joining metallic protective layers.
  27. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
  28. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
  29. Miller, Steven A.; Shekhter, Leonid N.; Zimmerman, Stefan, Methods of joining protective metal-clad structures.
  30. Volchko, Scott Jeffrey; Zimmermann, Stefan; Miller, Steven A.; Stawovy, Michael Thomas, Methods of manufacturing high-strength large-area sputtering targets.
  31. Loewenthal, William; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets.
  32. Miller, Steven A.; Dary, Francois-Charles; Gaydos, Mark; Rozak, Gary, Methods of manufacturing large-area sputtering targets by cold spray.
  33. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
  34. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
  35. Miller, Steven A.; Kumar, Prabhat; Wu, Rong-chein Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Methods of rejuvenating sputtering targets.
  36. Miller, Steven A.; Schmidt-Park, Olaf; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmerman, Stefan, Methods of rejuvenating sputtering targets.
  37. Miller, Seth A.; Stark, David H.; Francis, IV, William H.; Puligandla, Viswanadham; Boulos, Edward N.; Pernicka, John, Multi-pane glass unit having seal with adhesive and gas-restrictive coating layer.
  38. Miller, Seth A.; Stark, David H.; Francis, IV, William H.; Puligandla, Viswanadham; Boulos, Edward N.; Pernicka, John, Multi-pane glass unit having seal with adhesive and hermetic coating layer.
  39. Shekhter, Leonid N.; Miller, Steven A.; Haywiser, Leah F.; Wu, Rong-Chein R., Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof.
  40. Shekhter, Leonid N.; Miller, Steven A.; Haywiser, Leah F.; Wu, Rong-Chein Richard, Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof.
  41. Miller, Steven A.; Shekhter, Leonid N.; Zimmerman, Stefan, Protective metal-clad structures.
  42. Stark, David H., Wafer-level hermetic micro-device packages.
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