IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0265232
(2002-10-07)
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우선권정보 |
JP-0262674 (1999-09-16); JP-0266965 (1998-09-21) |
§371/§102 date |
20040610
(20040610)
|
발명자
/ 주소 |
- Ito, Nobuhiro
- Sakai, Kunihiro
- Fushimi, Masahiro
|
출원인 / 주소 |
|
대리인 / 주소 |
Fitzpatrick, Cella, Harper &
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인용정보 |
피인용 횟수 :
5 인용 특허 :
23 |
초록
▼
A method of manufacturing a spacer having a low-resistance film without using any exhaust device, and being interposed between a first substrate having an image forming member and a second substrate having an electron-emitting device. The method including the steps of preparing a spacer substrate wi
A method of manufacturing a spacer having a low-resistance film without using any exhaust device, and being interposed between a first substrate having an image forming member and a second substrate having an electron-emitting device. The method including the steps of preparing a spacer substrate with an edge including a tapered, chamfered or arcuated portion, preparing a liquid comprising a dispersed conductive material or dissolved conductive material, dipping the edge into the liquid, and drying and/or baking the spacer substrate after the dipping step.
대표청구항
▼
1. A method of manufacturing a spacer provided between a face plate having an electrode and a rear plate having electron-emitting devices, comprising the steps of:(A) preparing a spacer substrate with an edge including a tapered, chamfered or arcuated portion; (B) preparing a liquid comprising a dis
1. A method of manufacturing a spacer provided between a face plate having an electrode and a rear plate having electron-emitting devices, comprising the steps of:(A) preparing a spacer substrate with an edge including a tapered, chamfered or arcuated portion; (B) preparing a liquid comprising a dispersed conductive material or dissolved conductive material; (C) dipping the edge into the liquid; and (D) drying and/or baking the spacer substrate after said dipping step. 2. The method according to claim 1, wherein the viscosity of the liquid is not less than 10 cps.3. A method of manufacturing a spacer provided between a face plate having an electrode and a rear plate having electron-emitting devices, comprising the steps of:(A) preparing a spacer substrate with an end portion including a tapered, chamfered or arcuated portion; (B) preparing a liquid comprising a metallic compound or metal; (C) dipping the edge into the liquid; and (D) drying and/or baking the end portion after said dipping step. 4. The method according to claim 3, wherein the viscosity of the liquid is not less than 10 cps.5. A method of manufacturing a flat panel display comprising a face plate having an electrode and a fluorescent film, a rear plate having a plurality of electron-emitting devices and a plurality of wirings, and a spacer disposed between the electrode and at least one of the wirings, comprising the steps of:(A) preparing a face plate having an electrode and a phosphor; (B) preparing a rear plate having a plurality of electron-emitting devices and a plurality of wirings; (C) preparing a spacer substrate with an edge including a tapered, chamfered or arcuated portion; (D) preparing a liquid comprising a dispersed conductive material or dissolved conductive material; (E) dipping the edge into the liquid; and (F) drying and/or baking the spacer substrate after said dipping step. 6. The method according to claim 5, wherein the viscosity of the liquid is not less than 10 cps.7. The method according to claim 5, wherein the fluorescent film includes three primary color fluorescent substances.8. A method of manufacturing a flat panel display comprising a face plate having an electrode and a fluorescent film, a rear plate having a plurality of electron-emitting devices and a plurality of wirings, and a spacer disposed between the electrode and at least one of the wirings, comprising the steps of:(A) preparing a face plate having an electrode and a phosphor; (B) preparing a rear plate having a plurality of electron-emitting devices and a plurality of wirings; (C) preparing a spacer substrate with an end portion including a tapered, chamfered or arcuated portion; (D) preparing a liquid comprising a metallic compound or metal; (E) dipping the end portion into the liquid; and (F) drying and/or baking the end portion after said dipping step. 9. The method according to claim 8, wherein the viscosity of the liquid is not less than 10 cps.10. The method according to claim 8, wherein the fluorescent film includes three primary color fluorescent substances.11. A method of manufacturing a flat panel display comprising a face plate structure having an anode, a rear plate structure having a cathode, and a spacer disposed between the face plate structure and the rear plate structure, comprising the steps of:(A) preparing a face plate structure having an anode; (B) preparing a rear plate structure having a cathode, wherein the cathode has an electron emitting structure; (C) arranging a spacer between said face plate structure and the rear plate structure; and (D) producing a hermetically sealed container using the face plate structure, the rear plate structure and a seal structure, said arranging step (C) comprising the steps of: (1) preparing a spacer substrate being polyhedron in shape, wherein the spacer substrate has at least one abutting surface for adjoining to a voltage defining structure and a non-abutting surface for not adjoining to the voltage defining structure, and an edge having a tapered or arcuated cross section between the abutting surface and the non-abutting surface; (2) applying a conductive material-dispersed or conductive material-dissolved liquid to the abutting surface by a dipping method, wherein the conductive material-dispersed or conductive material-dissolved liquid is simultaneously applied to a plurality of surfaces of the polyhedron; (3) drying and baking the conductive material-dispersed or conductive material-dissolved liquid so as to form a conductive layer, wherein the conductive layer is successively formed between the abutting surface and the non-abutting surface; and (4) mounting the spacer to either the face plate structure or rear plate structure after said drying and baking step. 12. The method according to claim 11, wherein the voltage defining structure includes a cathode or an anode.13. The method according to claim 11, wherein in said applying step, the conductive material-dispersed or conductive material-dissolved liquid is simultaneously applied to at least three surfaces of the polyhedron.14. The method according to claim 11, wherein in said applying step, the conductive material-dispersed or conductive material-dissolved liquid is simultaneously applied to at least five surfaces of the polyhedron.15. The method according to claim 11, wherein the spacer is situated in a potential more than 25 kV/cm in an operation state of the flat panel display.16. The method according to claim 11, wherein the viscosity of the conductive material-dispersed or conductive material-dissolved liquid is not less than 10 cps.17. The method according to claim 11, wherein the viscosity of the conductive material-dispersed or conductive material-dissolved liquid is not less than 100 cps.18. The method according to claim 11, wherein the viscosity of the conductive material-dispersed or conductive material-dissolved liquid is not less than 1000 cps.19. A method of manufacturing a flat panel display comprising a face plate structure having an anode, a rear plate structure having a cathode, and a spacer disposed between the face plate structure and the rear plate structure, comprising the steps of:(A) preparing a face plate structure having an anode; (B) preparing a rear plate structure having a cathode, wherein the cathode has an electron emitting structure; (C) arranging a spacer between the face plate structure and the rear plate structure; and (D) producing a hermetically sealed container using the face plate structure, the rear plate structure and a seal structure, said arranging step (C) comprising the steps of: (1) preparing a spacer substrate being polyhedron in shape, wherein the spacer substrate has at last one abutting surface for adjoining to a voltage defining structure and a non-abutting surface for not adjoining to the voltage defining structure, and an end portion having a tapered or arcuated cross section between the abutting surface and the non-abutting surface; (2) applying a conductive material-dispersed or conductive material-dissolved liquid to the abutting surface by a dipping method, wherein the conductive material-dispersed or conductive material-dissolved liquid is simultaneously applied to a plurality of surfaces of the polyhedron; (3) drying and baking the conductive material-dispersed or conductive material-dissolved liquid so as to form a conductive layer, wherein the conductive layer is electrically connecting between the abutting surface and the non-abutting surface; and (4) mounting the spacer to either the face plate structure or rear plate structure after said drying and baking step. 20. The method according to claim 19, wherein the voltage defining structure includes a cathode or an anode.21. The method according to claim 19, wherein in said applying step, the conductive material-dispersed or conductive material-dissolved liquid is simultaneously applied to at least three surfaces of the polyhedron.22. The method according to claim 19, wherein in said applying step, the conductive material-dispersed or conductive material-dissolved liquid is simultaneously applied to at least five surfaces of the polyhedron.23. The method according to claim 19, wherein the spacer is situated in a potential more than 25 kV/cm in an operation state of the first panel display.24. The method according to claim 19, wherein the viscosity of the conductive material-dispersed or conductive material-dissolved liquid is not less than 10 cops.25. The method according to claim 19, wherein the viscosity of the conductive material-dispersed or conductive material-dissolved liquid is not less than 100 cps.26. The method according to claim 19, wherein the viscosity of the conductive material-dispersed or conductive material-dissolved liquid is not less than 1000 cps.
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