A disk drive box 10 accommodates a plurality of disk drives 20 within a case 11. A side face of each of the drives 20 is provided with a heat-absorbing part 40 including a heat pipe, corresponding to heat producing area HP. The heat taken away by the heat-absorbing part 40 is transmitted to a heat s
A disk drive box 10 accommodates a plurality of disk drives 20 within a case 11. A side face of each of the drives 20 is provided with a heat-absorbing part 40 including a heat pipe, corresponding to heat producing area HP. The heat taken away by the heat-absorbing part 40 is transmitted to a heat sink 50 of the rear of a backboard 30 via a heat connector 60. The heat sink 50 is cooled by cooling air flowing through an air duct 7. By cooling the drive 20 with the heat pipe, clearances between the drives 20 can be substantially eliminated, and it is made unnecessary to form an opening for air cooling in the backboard 30. Thus, size reduction is possible, and it is possible to increase the degree of freedom for a wiring pattern formed on the backboard 30.
대표청구항▼
1. A cooling structure for a disk storage device accommodating at least one disk drive, comprising:the disk storage device having a connection board to which the disk drive is electrically connected such that data input/output to/from the disk drive is performed via a signal line formed on the conne
1. A cooling structure for a disk storage device accommodating at least one disk drive, comprising:the disk storage device having a connection board to which the disk drive is electrically connected such that data input/output to/from the disk drive is performed via a signal line formed on the connection board; a heat-absorbing part provided on the disk drive; a heat-dissipating part exposed outside the disk storage device; and a heat-transferring part for connecting the heat-absorbing part and the heat-dissipating part, wherein heat generated by the disk drive is transmitted from the heat-absorbing part via the heat-transferring part to the heat-dissipating part to radiate the heat, whereby an opening for air cooling is substantially eliminated from the connection board, and wherein the heat-transferring part separably includes a heat-absorbing-side heat-transferring part coupled to the heat-absorbing part and provided at the disk drive side, and a heat-dissipating-side heat-transferring part coupled to the heat-dissipating part and provided at the connection board side, tooth portions of the heat-absorbing-side heat-transferring part and tooth portions of the heat-dissipating-side heat-transferring part fit together to provide surface contact. 2. The cooling structure for a disk storage device according to claim 1, wherein:the disk storage device accommodates a plurality of the disk drives; and substantially no clearance for air cooling exists between the disk drives and between the disk drives and a housing of the disk storage device. 3. The cooling structure for a disk storage device according to claim 1, wherein the heat-absorbing-side heat-transferring part and the heat-dissipating-side heat-transferring part are in surface contact with each other at a plurality of locations to transfer heat.4. The cooling structure for a disk storage device according to claim 1, wherein the heat-absorbing part is distributedly disposed corresponding to heat producing areas of the disk drive.5. The cooling structure for a disk storage device according to claim 1, wherein the heat-absorbing part is provided so as to cover a surface of the disk drive.6. The cooling structure for a disk storage device according to claim 1, wherein the heat-absorbing part includes a heat pipe.7. The cooling structure for a disk storage device according to claim 1, further comprising a cooling mechanism for removing heat radiated from the heat-dissipating part.8. The cooling structure for a disk storage device according to claim 7, wherein the cooling mechanism removes heat from the heat-dissipating part by air cooling.9. The cooling structure for a disk storage device according to claim 7, wherein the cooling mechanism removes heat from the heat-dissipating part by liquid cooling.10. The cooling structure for a disk storage device according to claim 1, wherein:a control board for controlling operation of the disk drive is provided in the disk storage device, the control board being connected to the connection board; a signal line for connecting the control board and the disk drive is formed on the connection board; and the signal line is formed so as to substantially linearly connect an electrical connector unit between the disk drive and the connection board, with an electrical connector unit between the control board and the connection board. 11. The cooling structure for a disk storage device according to claim 1, wherein:a plurality of compartments are formed vertically within a housing of the disk storage device; and in each of the compartments, a plurality of the disk drives are disposed substantially in close contact with each other. 12. A disk array apparatus comprising:a plurality of disk storage devices for connecting a plurality of disk drives to a connection board having a signal line for electrically connecting the disk drives with each other, and for accommodating the disk drives substantially in close contact with each other; a device housing for accommodating the disk storage devices; a cooling mechanism provided in the device housing; heat-absorbing parts respectively provided for the disk drives; at least one heat-dissipating part exposed outside of the disk storage devices; and heat-transferring parts each for connecting one of the heat-absorbing parts and the heat-dissipating part with each other, wherein heat generated by the disk drives is transmitted from the heat-absorbing parts via the heat-transferring part to the heat-dissipating parts and is radiated from the heat-dissipating part via the cooling mechanism, whereby substantially no opening for air cooling is formed in the connection board, and wherein each of the heat-transferring part, separably includes a heat-absorbing-side heat-transferring part coupled to said one the heat-absorbing parts and provided at the disk drive side, and a heat-dissipating-side heat-transferring part coupled to the heat-dissipating part and provided at the connection board side, tooth portions of the heat-absorbing-side heat-transferring part and tooth portions of the heat-dissipating-side heat-transferring part fit together to provide surface contact. 13. A cooling structure for a unit-accommodating enclosure accommodating at least one unit having a heat producing area inside, comprising:the unit connected to a connection board on which an information transmission path is formed such that information input/output to/from the unit is performed via the information transmission path; a heat-absorbing part provided on the unit; a heat-dissipating part exposed outside the unit-accommodating enclosure; and a heat-transferring part for connecting the heat-absorbing part and the heat-dissipating part; wherein heat generated by the unit is transmitted from the heat-absorbing part via the heat-transferring part to the heat-dissipating part and is radiated therefrom, whereby an opening for air cooling is substantially eliminated from the connection board, and wherein the heat-transferring part separably includes a heat-absorbing-side heat-transferring part coupled to the heat-absorbing part and provided at the disk drive side, and a heat-dissipating-side heat-transferring part coupled to the heat-dissipating part and provided at the connection board side, tooth portions of the heat-absorbing-side heat-transferring part and tooth portions of the heat-dissipating-side heat-transferring part fit together to provide surface contact.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (15)
Cipolla Thomas Mario ; Mok Lawrence Shungwei, Arrangement and method for transferring heat from a portable personal computer.
Faneuf, Barrett M.; De Lorenzo, David S., Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system.
Chu, Richard C.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Method and system for cooling electronics racks using pre-cooled air.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E.; Singh, Prabjit, Apparatus and method for facilitating servicing of a liquid-cooled electronics rack.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madusudan K.; Simons, Robert E.; Singh, Prabjit, Apparatus and method for facilitating servicing of a liquid-cooled electronics rack.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Kemink, Randall G.; Simons, Robert E., Automatically reconfigurable liquid-cooling apparatus for an electronics rack.
Arimilli, Ravi K.; Ellsworth, Jr., Michael J.; Seminaro, Edward J., Convergence of air water cooling of an electronics rack and a computer room in a single unit.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit.
Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Multi-rack assembly method with shared cooling unit.
Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Multi-rack assembly with shared cooling apparatus.
Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Multi-rack assembly with shared cooling apparatus.
Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Multi-rack assembly with shared cooling unit.
Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Open flow cold plate for immersion-cooled electronic packages.
Ellsworth, Jr., Michael J.; Krug, Jr., Francis R.; Mullady, Robert K.; Schmidt, Roger R.; Seminaro, Edward J., System and method for facilitating cooling of a liquid-cooled electronics rack.
Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Thermoelectric-enhanced air and liquid cooling of an electronic system.
Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., Thermoelectric-enhanced air and liquid cooling of an electronic system.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.