[특허]System and method for thermal management of CT detector circuitry

General Electric Company

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특허 상세정보

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System and method for thermal management of CT detector circuitry

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	G01N-023/083
미국특허분류(USC)	378/019; 250/370.15
출원번호	US-0609755 (2003-06-30)
§371/§102 date	20001129 (20001129)
발명자 / 주소	Joshi, Ashutosh Burdick, Jr., William Edward Tonapi, Sandeep Shrikant Lacey, Joseph
출원인 / 주소	General Electric Company
대리인 / 주소	Fletcher Yoder
인용정보	피인용 횟수 : 7 인용 특허 : 11

초록
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A computed tomography (CT) system comprises an X-ray radiation source to project a plurality of X-ray beams through an object and a detector array comprising a plurality of detector assemblies. Each of the detector assembly further comprises a detector subassembly adapted to detect the X-ray beams and further adapted to convert the X-ray beams to a plurality of electrical signals and at least one integrated circuit array, for example, data acquisition chip array to acquire data corresponding to the electrical signals. The integrated circuit array, for example, data acquisition chip array further comprises a plurality of integrated circuits, such as, data acquisition chips mounted on at least one printed circuit board and a thermal management system adapted for thermal communication between the data acquisition chip array and a heat sink assembly to control thermal environment of each detector assembly. The heat sink further comprises a spreader plate extending over 2 or more data acquisition chips to reduce the temperature difference within the data acquisition chips.

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1. A computed tomography system comprising:a gantry configured to rotate around a longitudinal axis; an X-ray radiation source secured to the gantry and configured to project a plurality of X-ray beams through an object; a detector array secured to the gantry and comprising a plurality of detector assemblies configured to produce a plurality of electrical signals corresponding to the X-ray beams; each detector assembly further comprising a detector subassembly and at least one circuit board assembly mechanically secured to the detector subassembly via a flexible connection, each circuit board assembly comprising a plurality of integrated circuits attached to at least one printed circuit board and a thermal management system in thermal communication with the integrated circuits to reduce variation in temperature in each of the detector assembly, each thermal management system including a heat sink assembly comprising a substantially rigid thermally conductive spreader plate disposed over two or more integrated circuits to uniformly distribute the thermal energy generated by the integrated circuits during operation; and a processor configured to process the electrical signals to generate a plurality of projection measurements, wherein the processor is configured to perform calculations on the projection measurements to construct an image of the object there from. 2. The computed tomography system according to claim 1, wherein the detector subassembly is in thermal communication with the circuit board assembly.3. The computed tomography system according to claim 2, wherein the circuit board assembly is physically adjacent to the detector subassembly.4. The computed tomography system according to claim 1, wherein the thermal management system is configured to transfer heat from the integrated circuits to the heat sink assembly.5. The computed tomography system according to claim 1, wherein the heat sink assembly further comprises at least one heat dissipation system to perform free convective thermal exchange with the thermal energy transformed from the spreader plate.6. The computed tomography system according to claim 5, wherein the heat dissipation system comprises a plurality of fins adapted to perform convective heat dissipation of the thermal energy transported therein from the integrated circuits.7. The computed tomography system according to claim 6, wherein the fins are made of material chosen from the group consisting of beryllium-copper, copper and aluminum.8. The computed tomography system according to claim 6, wherein the fins are attached to the spreader plate through adhesives of high conductivity and high bonding strength.9. The computed tomography system according to claim 6, wherein the fins are made of sheets of thickness of about 0.1 mm to about 0.5 mm.10. The computed tomography system according to claim 6, wherein each of the fins has a cross-sectional geometry selected from the group consisting of square-shaped geometry, rectangular shaped geometry, circular shaped geometry, elliptical-shaped geometry and irregular-shaped geometry.11. The computed tomography system according to claim 6, wherein one end of each of the fins is connected to a block.12. The computed tomography system according to claim 11, wherein the block is made of plastics.13. The computed tomography system according to claim 1, wherein the heat sink assembly further comprises at least one conductive heat pipe; the heat pipe being in thermal communication with the spreader plate.14. The computed tomography system according to claim 13, wherein each heat pipe carries a heat exchange fluid.15. The computed tomography system according to claim 1, wherein the spreader plate has one or more hollow interior sections.16. The computed tomography system according to claim 15, wherein the hollow interior section is filled with a wire mesh and a heat exchange fluid.17. The computed tomography system according to claim 16, wherein the heat exchange fluid is water.18. The computed tomography system according to claim 16 wherein the spreader plate comprises a top section and a bottom section.19. The computed tomography system according to claim 18, wherein the top section and the bottom section are connected to conducting elements; wherein the conducting elements are in thermal communication with the top section and the bottom section.20. The computed tomography system according to claim 15, wherein the hollow interior section is filled with a phase change material.21. The computed tomography system according to claim 20, wherein the phase change material is chosen from the group consisting of n-alkanes, paraffin waxes, hydrated salts and alloys.22. The computed tomography system according to claim 1, wherein the spreader plate is configured to have a leading edge and a trailing edge.23. The computed tomography system according to claim 22, wherein the spreader plate is tapered from the leading edge to the trailing edge.24. A detector array of a computed tomography system comprising:a plurality of detector assemblies configured to produce a plurality of electrical signals corresponding to the X-ray beams; each detector assembly further comprising a detector subassembly and at least one circuit board assembly mechanically secured to detector subassembly via a flexible connection, each circuit board assembly comprising a plurality of data acquisition chips attached to at least one printed circuit board and a thermal management system in thermal communication with data acquisition chips to reduce the variation in temperature in the detector assembly, each thermal management system including a heat sink assembly comprising a substantially rigid thermally conductive spreader plate disposed over two or more integrated circuits to uniformly distribute the thermal energy generated by the integrated circuits during operation. 25. The detector array according to claim 24, wherein the detector subassembly is in thermal communication with the circuit board assembly.26. The detector array according to claim 25, wherein the circuit board assembly is physically adjacent to the detector subassembly.27. The detector array according to claim 24, wherein the thermal management system is configured to transfer heat from the data acquisition chips to the heat sink assembly.28. The detector array according to claim 24, wherein the heat sink assembly further comprises at least one heat dissipation system to perform free convective thermal exchange with the thermal energy transformed from the spreader plate.29. The detector array according to claim 28, wherein the heat dissipation system comprises a plurality of fins adapted to perform convective heat dissipation of the thermal energy transported therein from the data acquisition chips.30. The detector array according to claim 24, wherein the spreader plate has one or more hollow interior sections.31. The detector array according to claim 30, wherein the hollow interior section is filled with a wire mesh and a heat exchange fluid.32. The detector array according to claim 31, wherein the heat exchange fluid is water.33. The detector array according to claim 30, wherein the hollow interior section is filled with a phase change material.34. The detector array according to claim 33, wherein the phase change material is chosen from the group consisting of n-alkanes, paraffin waxes, hydrated salts and alloys.35. The detector array according to claim 24, wherein the spreader plate is configured to have to have a leading edge and a trailing edge.36. The detector array according to claim 35, wherein the spreader plate is tapered from the leading edge to the trailing edge.37. A method for controlling thermal environment of a detector array of a computed tomography system comprising:detecting a plurality of signals emitted from an X-ray radiation source by a detector subassembly; converting at least a portion of the X-ray beams to a plurality of electrical signals by the detector subassembly; acquiring data corresponding to the electrical signals by a plurality of data acquisition chips disposed on a circuit board assembly mechanically secured to the detector subassembly via a flexible connection; generating thermal energy from the data acquisition chips; distributing the thermal energy uniformly from the data acquisition chips to a heat sink assembly comprising at least one substantially rigid thermally conductive spreader plate over two or more data acquisition chips, the spreader plate being configured to be in thermal communication with the data acquisition chips; reducing the temperature variation in the data acquisition chips; and dissipating the thermal energy transported to the heat sink assembly from the data acquisition chips by a heat dissipation system. 38. The method according to claim 37, wherein the heat dissipation system is configured to perform free convective thermal exchange with the thermal energy transformed from the spreader plate.39. A means for controlling thermal environment of a detector array of a computed tomography system comprising:means for detecting a plurality of X-ray beams emitted from an X-ray radiation source; means for converting the X-ray beams to a plurality of electrical signals; means for acquiring data corresponding to the electrical signals; means for generating thermal energy from a plurality of data acquisition chips mechanically secured to the means for acquiring data via a flexible connection; and means for uniformly distributing the thermal energy from the data acquisition chips to a heat sink assembly comprising a substantially rigid spreader plate. 40. A detector array of a computed tomography system comprising:a plurality of detector assemblies configured to produce a plurality of electrical signals corresponding to the X-ray beams; each detector assembly further comprising a detector subassembly and at least one circuit board assembly mechanically secured to the detector management system in thermal communication, with data acquisition chips to reduce the variation in temperature in the detector assembly, each thermal management system including a heat sink assembly comprising a substantially rigid thermally conductive spreader plate disposed over two or more integrated circuits to uniformly distribute the thermal energy generated by the integrated circuits during operation and at least one conductive heat pipe carrying a heat exchange fluid; the heat pipe being in thermal communication with the spreader plate.

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