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Apparatus and methods for optically monitoring thickness 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01B-009/02
  • G01B-011/28
출원번호 US-0180679 (2002-06-26)
발명자 / 주소
  • Shirley, Lyle
출원인 / 주소
  • Massachusetts Institute of Technology
인용정보 피인용 횟수 : 12  인용 특허 : 46

초록

In one aspect, the invention relates to an apparatus for monitoring thickness variations of an object having first and second opposing surfaces. The apparatus includes a first source positioned to project a first fringe pattern at a first location on the first surface and a second source positioned

대표청구항

1. An apparatus for monitoring thickness variations of an object having first and second opposing surfaces, the apparatus comprising:a first source positioned to project a first fringe pattern at a first location on the first surface; a second source positioned to project a second fringe pattern at

이 특허에 인용된 특허 (46)

  1. Gordon Steven J. (Weston MA) Benayad-Cherif Faycal E. K. (Cambridge MA), Apparatus and method for projecting laser pattern with reduced speckle noise.
  2. Guerra John M. (Concord MA), Apparatus and methods employing phase control and analysis of evanescent illumination for imaging and metrology of subwa.
  3. Shirley Lyle, Apparatus and methods for contour measurement using movable sources.
  4. Shirley Lyle G. ; Mermelstein Michael S., Apparatus and methods for surface contour measurement.
  5. Nodwell Roy A. (West Vancouver CA) Richards Steven L. F. (Vancouver CA), Apparatus for determining the position of a surface.
  6. Hold, Anthony C., Apparatus for measuring profile thickness of strip material.
  7. Sorin Wayne V. (Mountain View CA), Apparatus for measuring the thickness of a moving film utilizing an adjustable numerical aperture lens.
  8. Marcus Michael Alan (Honeoye Falls NY) Gross Stanley (Rochester NY) Wideman David Carter (Fairport NY), Associated dual interferometric measurement apparatus for determining a physical property of an object.
  9. Lyle Shirley, Compensation for measurement uncertainty due to atmospheric effects.
  10. Shirley Lyle, Compensation for measurement uncertainty due to atmospheric effects.
  11. Bodlaj ; Viktor, Contact-free thickness measuring method and device.
  12. Muller Dieter,DEX, Device and process for measuring two opposite surfaces of a body.
  13. Lettau Ulrich,DEX ; Mueller Matthias,DEX ; Steidl Siegbert,DEX ; Wohld Dietrich,DEX, Device for regulating the thickness of rolling stock.
  14. Greivenkamp ; Jr. John E. (Rochester NY), Extended-range moire contouring.
  15. Ehrlich Daniel J. (Lexington MA), Integrated circuit micro-fabrication using dry lithographic processes.
  16. Dension Dean R. (Los Gatos CA) Hartsough Larry D. (Berkeley CA), Laser induced dissociative chemical gas phase processing of workpieces.
  17. Grobman Warren D. (Yorktown Heights NY) Ho Fahfu (Wappingers Falls NY) Hurst ; Jr. Jerry E. (Croton-on-Hudson NY) Ritsko John J. (Mt. Kisco NY) Tomkiewicz Yaffa (Scarsdale NY), Laser stimulated halogen gas etching of metal substrates.
  18. Bredberg Robert E. (Markham CAX) Torres Cristian (Downsview CAX), Laser thickness gauge.
  19. Ehrlich Daniel, Laser-induced etching of multilayer materials.
  20. Deutsch Thomas F. (Cambridge MA) Ehrlich Daniel J. (Arlington MA) Osgood Richard M. (Winchester MA), Method and apparatus for depositing a material on a surface.
  21. Shirley Lyle G. ; Hallerman Gregory Robert, Method and apparatus for detecting relative displacement using a light source.
  22. Livnat Aminadav (Arad ILX) Kafri Oded (Beer-Sheva ILX), Method and apparatus for optically measuring distance between two surfaces.
  23. Halioua Maurice (Sea Cliff NY) Srinivasan Venugopal (Singapore SGX), Method and apparatus for surface profilometry.
  24. Zumbrunn Roland (Wittinsburg CHX) Richner Linus (Klliken CHX), Method and apparatus for surveying the surface of an object by projection of fringe patterns.
  25. Rudd Eric P. ; Fishbaine David ; Haugen Paul R. ; Kranz David M., Method and apparatus for three dimensional imaging using multi-phased structured light.
  26. Peisen S. Huang ; Fu-Pen Chiang, Method and apparatus for three dimensional surface contouring using a digital video projection system.
  27. Nagatomo Shohei (Itami JPX) Takai Mikio (Takarazuka JPX) Sandaiji Hideto (Kasugai JPX) Ohara Soji (Kashihara JPX), Method of producing a core for magnetic head.
  28. Sandaiji Hideto (Kasugai JPX) Takeya Fuminori (Nagoya JPX) Terada Nobuhiro (Kasugai JPX), Method of producing head core slider for rigid magnetic disk drive, utilizing laser-induced etching.
  29. Shirley Lyle G., Methods and apparatus for remotely sensing the orientation of an object.
  30. Bloomstein Theodore M. (Cambridge MA) Ehrlich Daniel (Lexington MA) Flynn Anita M. (Arlington MA), Methods for fabricating three-dimensional micro structures.
  31. Pirlet, Robert A., Monitoring the planarity of metal sheet.
  32. Wick William R. W. (c/o Precision Measurement Systems ; Inc. ; 150 Breaden Dr. #C Middletown OH 45050) Wood Pamela G. (West Chester OH), Non-contact precision measurement system.
  33. Abe Kohzo,JPX ; Iguchi Nobuaki,JPX, Optical apparatus for measuring profiles of a wafer.
  34. Bernacki Bruce E. (Knoxville TN), Optical caliper with compensation for specimen deflection and method.
  35. Takada Yuji (Kyoto JPX) Matsuda Hiroshi (Hirakata JPX) Yamane Toshiki (Sakai JPX) Sugimoto Yoshihiko (Hirakata JPX), Optical measurement system for determination of an object\s profile or thickness.
  36. Nakamura Takahiro (Sagamihara JPX), Optical system for measuring a surface profile of an object using a converged, inclined light beam and movable convergin.
  37. Mercer Carolyn R. (Cleveland OH) Beheim Glenn (Hiram OH), Phase-stepping fiber-optic projected fringe system for surface topography measurements.
  38. Leib Kenneth G. (Wantagh NY), Printed circuit inspection system utilizing interference fringes.
  39. Donnelly Vincent M. (Berkeley Heights NJ) Karlicek ; Jr. Robert F. (Kenilworth NJ), Radiation induced deposition of metal on semiconductor surfaces.
  40. Ichikawa Shigeru (Fujimiya JPX), Sheet thickness measuring apparatus.
  41. Ledger Anthony (Newfairfield CT), Substrate thickness measurement using oblique incidence multispectral interferometry.
  42. McAleavey Michael E. (559 Gettysburg Dr. San Jose CA 95123), System and method for monitoring and controlling thickness.
  43. Rosenfield Michael G. (104 North Street ; #503 Stamford CT 06902) Seeger David E. (130 Sleepy Hollows Rd ; Congers NY 10920), System for laser removal of excess material from a semiconductor wafer.
  44. Swanson ; deceased Frank R. (late of Freeport NY by Patricia Swanson ; executor ), Thickness measurement gauge.
  45. Yazaki Susumu (Hachioji JPX) Matsumura Takeshi (Kodaira JPX), Thickness measuring apparatus for non-metallic sheet-shaped bodies.
  46. Calvin Timothy Wayne ; Schneider Edward Conrad ; Caillier Scott M., Traversing thickness measurement apparatus and related method.

이 특허를 인용한 특허 (12)

  1. Shirley, Lyle G., Dimensional probe and methods of use.
  2. Shirley, Lyle G.; Marrion, Jeffrey C., Method and apparatus for imaging.
  3. Shirley, Lyle, Method and apparatus for remote sensing of objects utilizing radiation speckle and projected reference.
  4. Fisher, Lance K.; Haugen, Paul R., Method for three-dimensional imaging using multi-phase structured light.
  5. Swanson,Gary J.; Shirley,Lyle; Hubbard,William John; Abbe,Robert Cleveland, Methods and apparatus for reducing error in interferometric imaging measurements.
  6. Fisher, Lance K.; Haugen, Paul R., Multi-source sensor for three-dimensional imaging using phased structured light.
  7. Meeks, Steven W., Multi-wavelength system and method for detecting epitaxial layer defects.
  8. Palmateer, John W., Ring laser measurement apparatus and method.
  9. Buehler, Pat; Kahle, David, System and method for measuring photovoltaic module thickness.
  10. Cohen, Yoel; Finarov, Moshe; Vinokur, Klara, Thin films measurement method and system.
  11. Cohen, Yoel; Finarov, Moshe; Vinokur, Klara, Thin films measurement method and system.
  12. Honma, Yuki; Mitsumoto, Daisuke; Takemura, Sunao, Three-dimensional shape measuring apparatus, three-dimensional shape measuring method, and three-dimensional shape measuring program.
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