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특허 상세정보

Chipset cooling device of video graphic adapter card

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05K-007/20   
미국특허분류(USC) 361/715; 361/704; 361/687; 165/104.21; 165/046; 174/015.2
출원번호 US-0407373 (2003-04-04)
우선권정보 KR-0015238 (2003-03-11); KR-0028363 (2002-05-22); KR-0018800 (2002-04-06)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    St. Onge Steward Johnston &
인용정보 피인용 횟수 : 31  인용 특허 : 23
초록

A chipset cooling device of a video graphics adapter (VGA) card that includes two heatsinks mounted on respective opposite surfaces of a VGA card to collectively cool a chipset of the VGA card is provided. In the chipset cooling device of a VGA card, two heatsinks are mounted on opposite surfaces of a printed circuit board (PCB) of the VGA card, respectively, and connected together by a heatpipe. Due to the use of two heatsinks to collectively cool a chipset, cooling efficiency is higher as opposed to using a single heatsink. In particular, a binding por...

대표
청구항

1. A chipset cooling device of a video graphics adapter card, which cools a chipset mounted on a printed circuit board of the video graphics adapter card, the chipset cooling device comprising:a first heatsink mounted on the same side as the chipset to dissipate heat generated by the chipset; a second heatsink mounted on a side opposite to the first heatsink, with the PCB between the first and second heatsink; and at least one heatpipe, which connects the first heatsink and the second heatsink so as to transfer heat from the first heatsink to the second ...

이 특허에 인용된 특허 (23)

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이 특허를 인용한 특허 피인용횟수: 31

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  2. Arvelo, Amilcar R.; Ellsworth, Michael J.; McKeever, Eric J.; Nguyen, Thong N.; Seminaro, Edward J.. Compute intensive module packaging. USP2016119490188.
  3. Arvelo, Amilcar R.; Ellsworth, Michael J.; McKeever, Eric J.; Nguyen, Thong N.; Seminaro, Edward J.. Compute intensive module packaging. USP2017119818667.
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  7. Chen,Tsu Cheng; Huang,Kai Hung; Hsieh,Yi Hwa. Electronic device with dual heat dissipating structures. USP2008047365972.
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  14. Peng, Xue Wen; Chen, Bing. Heat dissipation device. USP2009047515423.
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