초록 ▼

An arrangement for cooling an electronic assembly includes a circuit board, an enclosure member and at least one electromechanical actuator. The circuit board has a first surface, a second surface, and at least a first heat-generating element secured to the first surface. The circuit board further c

An arrangement for cooling an electronic assembly includes a circuit board, an enclosure member and at least one electromechanical actuator. The circuit board has a first surface, a second surface, and at least a first heat-generating element secured to the first surface. The circuit board further comprises at least one aperture extending between the first surface and the second surface. The enclosure member is secured to the circuit board so as to form a fluid tight barrier of a compartment defined at least in part by the enclosure member. The compartment includes a first subcompartment defined at least in part by the first surface and the enclosure member and a second subcompartment defined at least in part by the second surface and the enclosure member. The at least one electromechanical actuator is secured within the fluid type barrier and is operable to generate a flow movement in the direction of the at least one aperture when liquid is disposed in the fluid tight barrier.

대표청구항 ▼

1. An arrangement for cooling an electronic assembly, the arrangement comprising:a circuit board having a first surface, a second surface, and at least a first heat-generating element secured to the first surface, the circuit board further comprising at least one aperture extending between the first

1. An arrangement for cooling an electronic assembly, the arrangement comprising:a circuit board having a first surface, a second surface, and at least a first heat-generating element secured to the first surface, the circuit board further comprising at least one aperture extending between the first surface and the second surface;an enclosure member secured to said circuit board so as to form a fluid tight barrier of a compartment defined at least in part by said enclosure member and said circuit board, said compartment including a first subcompartment defined at least in part by said first surface and said enclosure member and a second subcompartment defined at least in part by said second surface and said enclosure member;a liquid disposed within said compartment;at least one electromechanical actuator secured within the compartment, the electromechanical actuator operable to generate a flow movement of the liquid in the direction of the at least one aperture, the at least one mechanical actuator including a substantially rigid blade coupled to a piezoelectric actuator and extending in a first direction from the piezoelectric actuator, the piezoelectric actuator coupled proximate the at least one aperture; anda flapper valve having a first end secured within the second subcompartment proximate the at least one aperture and a second end movably coupled to the first end, the second end movable to alternately allow fluid flow throught the first aperture and inhibit fluid flow through the first aperture.2. The arrangement of claim 1 wherein the circuit board includes an external portion that extends outward of the compartment.3. The apparatus of claim 2 wherein the enclosure includes a plurality of cooling fins configured to convey heat from a fluid disposed within the compartment to an external environment.4. The apparatus of claim 1 wherein the circuit board includes a top end portion and a bottom end portion, and wherein the top end portion includes at least one aperture extending between the first surface and the second surface and the bottom end portion.5. The apparatus of claim 4 wherein the enclosure includes a plurality of cooling fins configured to convey heat from a fluid disposed within the compartment to an external environment.6. The arrangement of claim 4 wherein the circuit board includes an external portion that extends outward of the compartment.7. The apparatus of claim 6 wherein the enclosure includes a plurality of cooling fins configured to convey heat from a fluid disposed within the compartment to an external environment.8. The apparatus of claim 1 wherein the enclosure includes a plurality of cooling fins configured to convey heat from a fluid disposed within the compartment to an external environment.