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Polyethylene rich/polypropylene blends and their uses 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C08F-008/00
  • C08L-023/00
  • C08L-023/04
출원번호 US-0296601 (2001-05-25)
국제출원번호 PCT//US01/17119 (2003-05-13)
§371/§102 date 20030513 (20030513)
국제공개번호 WO01//92403 (2001-12-06)
발명자 / 주소
  • Tau, Li-Min
  • Van Volkenburgh, William R.
  • Hoenig, Wendy D.
  • Chum, Pak-Wing S.
출원인 / 주소
  • Dow Global Technologies Inc.
인용정보 피인용 횟수 : 30  인용 특허 : 51

초록

The present invention includes a blend composition comprising at least one coupled propylene polymer and at least 55 weight percent of at least one ethylene polymer, based on the total weight of the coupled propylene polymer and the ethylene polymer. The invention also includes methods for making th

대표청구항

1. A blend composition comprising:(a) at least one propylene polymer having a melt strength of at least 20 cN; and (b) greater than 55% by weight based on the combined weight of component (a) and (b), of at least one ethylene polymer having a density of from 0.90-0.94 g/cm3 and having a melt index (

이 특허에 인용된 특허 (51)

  1. Park Chung P. (Pickerington OH), Alcohol control of lightly crosslinked foamed polymer production.
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  29. Burgin Emanuele,ITX ; Perdomi Gianni,ITX ; Cometto Claudio,ITX, Polyolefin compositions and blown films obtained therefrom.
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  1. Trent,John S.; Randall,Francis J.; Kovara,Terry M.; Runkel,James J., Bottles made from metallocene polypropylene for delivery of fragrances.
  2. Perick, Matthias, Coextruded polyethylene film.
  3. Nair, Sujith; Stankovich, Sasha; Wang, Yunzhang; Raghavendran, Venkatkrishna, Consolidated fibrous structure.
  4. Nair, Sujith; Stankovich, Sasha; Wang, Yunzhang; Raghavendran, Venkatkrishna, Consolidated fibrous structure.
  5. Nair, Sujith; Stankovich, Sasha; Wang, Yunzhang; Raghavendran, Venkatkrishna, Consolidated fibrous structure.
  6. Autran, Jean-Philippe Marie; Arora, Kelyn Anne, Fibers and nonwovens comprising polyethylene blends and mixtures.
  7. Autran,Jean Philippe Marie; Arora,Kelyn Anne, Fibers and nonwovens comprising polyethylene blends and mixtures.
  8. Jiang, Peijun; Sahnoune, Abdelhadi; Dekmezian, Armenag, Foamable thermoplastic reactor blends and foam article therefrom.
  9. Kraimer,Amy Lynn; Pockat,Gregory Robert, Frangible heat-sealable films for cook-in applications and packages made thereof.
  10. Koehn, Harold Egon; Brown, Matthew H., Heat sealable film with linear tear properties.
  11. Koehn, Harold Egon; Brown, Matthew H., Heat sealable film with linear tear properties.
  12. Paolilli, Tracy A.; Narkevicius, Scott; Koehn, Harold Egon; Brown, Matthew H., High barrier heat sealable film with linear tear properties.
  13. Paolilli, Tracy A.; Narkevicius, Scott; Koehn, Harold Egon; Brown, Matthew H., High barrier heat sealable film with linear tear properties.
  14. Nair, Sujith; Stankovich, Sasha; Wang, Yunzhang; Raghavendran, Venkatkrishna; Eleazer, Howell B., Method of forming a consolidated fibrous structure.
  15. Nair, Sujith; Stankovich, Sasha; Wang, Yunzhang; Raghavendran, Venkatkrishna, Method of forming a multi-layered fiber.
  16. Mier, Rodolfo; Miller, Mark, Modified resins for blown film.
  17. Nair, Sujith; Stankovich, Sasha; Wang, Yunzhang; Raghavendran, Venkatkrishna, Multi-layered fiber.
  18. Wu, Xiaosong; Walton, Kim L.; Chopin, III, Lamy J.; Hughes, Morgan M., Retortable easy opening seals for film extrusion.
  19. Hayashi, Eiji; Go, Kyo; Harada, Kozo; Baba, Shinji, Semiconductor device.
  20. Hayashi, Eiji; Go, Kyo; Harada, Kozo; Baba, Shinji, Semiconductor device and method of manufacturing.
  21. Hayashi, Eiji; Go, Kyo; Harada, Kozo; Baba, Shinji, Semiconductor device and method of manufacturing the same.
  22. Hayashi, Eiji; Go, Kyo; Harada, Kozo; Baba, Shinji, Semiconductor device and method of manufacturing the same.
  23. Hayashi, Eiji; Go, Kyo; Harada, Kozo; Baba, Shinji, Semiconductor device and method of manufacturing the same.
  24. Hayashi, Eiji; Go, Kyo; Harada, Kozo; Baba, Shinji, Semiconductor device and method of manufacturing the same.
  25. Hayashi, Eiji; Go, Kyo; Harada, Kozo; Baba, Shinji, Semiconductor device and method of manufacturing the same.
  26. Hayashi, Eiji; Go, Kyo; Harada, Kozo; Baba, Shinji, Semiconductor device and method of manufacturing the same.
  27. Hayashi, Eiji; Go, Kyo; Harada, Kozo; Baba, Shinji, Semiconductor device and method of manufacturing the same.
  28. Hayashi, Eiji; Go, Kyo; Harada, Kozo; Baba, Shinji, Semiconductor device and method of manufacturing the same.
  29. Tse, Mun F.; Jiang, Peijun, Thermoplastic polyolefin blends.
  30. Tse, Mun F.; Jiang, Peijun; Cheng, Jianya, Thermoplastic polyolefin blends and films therefrom.
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