초록 ▼

A CPU cooling apparatus comprises a fin, a heat sink, and a heat pipe thermally coupling the fin and the heat sink. When installed in a personal computer, the fin thermally couples with a CPU to receive heat generated by the CPU. The heat pipe conducts the heat to a heat sink, which is cooled by an

A CPU cooling apparatus comprises a fin, a heat sink, and a heat pipe thermally coupling the fin and the heat sink. When installed in a personal computer, the fin thermally couples with a CPU to receive heat generated by the CPU. The heat pipe conducts the heat to a heat sink, which is cooled by an exhaust fan that directs a flow of air outside the computer.

대표청구항 ▼

1. An apparatus for cooling a CPU, comprising:a fin adapted to fit over a CPU and conduct heat therefrom, the fin having a hollow bottom and including a sheet of metal covering the hollow bottom; a heat sink for transferring heat to surrounding air; a heat pipe passing through the hollow bottom of t

1. An apparatus for cooling a CPU, comprising:a fin adapted to fit over a CPU and conduct heat therefrom, the fin having a hollow bottom and including a sheet of metal covering the hollow bottom; a heat sink for transferring heat to surrounding air; a heat pipe passing through the hollow bottom of the fin and attached to the fin, the heat pipe thermally coupling the fin to the heat sink to facilitate the transfer of heat from the fin to the heat sink; and a fan assembly including a fan configured to direct air through the heat sink and outside of a computer housing. 2. The apparatus of claim 1, wherein the fan assembly includes a casing that covers the fan and the heat sink.3. The apparatus of claim 2, wherein the casing of the fan assembly is attachable to a computer housing.4. The apparatus of claim 1, further comprising:a fastener for securing the fin to a CPU by directly pressing the fin against the CPU. 5. The apparatus of claim 1, wherein the heat pipe includes a metal weave interior for conducting heat.6. The apparatus of claim 1, wherein the heat pipe is curved so that the fin and the heat sink are substantially perpendicular with respect to each other.7. The apparatus of claim 1, wherein the fan is configured to direct air outward from the computer housing.8. A computer assembly comprising:a computer housing for covering a computer's internal components, including a CPU; a CPU socket for receiving a CPU and coupling the CPU to a motherboard inside the computer housing; a fin adapted to fit over a CPU in the CPU socket, the fin for conducting heat generated by a CPU, the fin having a hollow bottom and a metal covering over the hollow bottom, the metal covering for contacting with a CPU in the CPU socket and conducting heat energy generated by the CPU; a heat pipe passing through the hollow bottom of the fin and attached to the fin, the heat pipe thermally coupled to the fin to carry heat away from the CPU; a heat sink coupled to the heat pipe for conducting heat therefrom and transferring the heat to surrounding air; and a fan assembly mounted to the computer housing, the fan assembly substantially covering the heat sink and configured to direct a flow of air through the heat sink and out of the computer housing. 9. The computer assembly of claim 8, further comprising a fastener to secure the fin to the CPU socket, wherein there is no fan directly over the fin.10. The computer assembly of claim 8, wherein the heat pipe is curved so that the fin and the heat sink are substantially perpendicular with respect to each other.