IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0053859
(2002-01-19)
|
발명자
/ 주소 |
- Goodson, Kenneth E.
- Chen, Chuan-Hua
- Huber, David E.
- Jiang, Linan
- Kenny, Thomas W.
- Koo, Jae-Mo
- Laser, Daniel J.
- Mikkelsen, James C.
- Santiago, Juan G.
- Wang, Evelyn Ning-Yi
- Zeng, Shulin
- Zhang
|
출원인 / 주소 |
- The Board of Trustees of the Leland Stanford Junior University
|
대리인 / 주소 |
Womble Carlyle, Sandridge &
|
인용정보 |
피인용 횟수 :
107 인용 특허 :
162 |
초록
▼
Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in r
Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles. Novel microchannel structures are also described.
대표청구항
▼
1. A cooling system for a heal emitting device, the cooling system operating using a fluid having a liquid phase, the cooling system comprising:a substrate including at least a portion of a microchannel disposed therein, the substrate adapted to physically connect to the heat emitting device, thereb
1. A cooling system for a heal emitting device, the cooling system operating using a fluid having a liquid phase, the cooling system comprising:a substrate including at least a portion of a microchannel disposed therein, the substrate adapted to physically connect to the heat emitting device, thereby providing for the transfer of thermal energy from the beat emitting device to the substrate, and the further transfer of thermal energy from the substrate to the fluid disposed within the microchannel, the microchannel configured to provide flow of the fluid therethrough; a heat exchanger configured to provide flow of the fluid therethrough and the transfer of thermal energy out of the fluid; a high flow rate electroosmotic pump, the electroosmotic pump creating the flow of the fluid; and wherein the substrate, the heat exchanger, and the electroosmotic pump are configured to operate together to create a closed loop fluid flow. 2. The cooling system according to claim 1 wherein the high flow rate electroosmotic pump is disposed between the heat exchanger and the substrate such that the fluid is pumped into the microchannel of the substrate from the electroosmotic pump.3. The cooling system according to claim 1 wherein the high flow rate electroosmotic pump is disposed between the heat exchanger and the substrate such that the fluid is pumped into the heat exchanger from the electroosmotic pump.4. The cooling system according to claim 1 wherein the microchannel includes a plurality of parallel subchannels, each of the parallel subchannels sharing a common inlet portion and a common outlet portion.5. The cooling system according to claim 4 further including a temperature sensor disposed in proximity to the plurality of parallel subchannels.6. The cooling system according to claim 5 further including a temperature control circuit that receives as inputs signals from the temperature sensor.7. The cooling system according to claim 1 wherein the substrate is comprised of first and second layers, and wherein at least a portion of the microchannel is formed within both the first and second layers.8. The cooling system according to claim 1 wherein the substrate is comprised of a first layer and a second layer, the first layer being physically connected to the heat emitting device, and wherein at least a portion of the microchannel is formed within only the first layer.9. The cooling system according to claim 1 wherein heat emitting device is comprised of a plurality of integrated circuits and the substrate is disposed between the plurality of integrated circuits.10. The cooling system according to claim 9 wherein there is included at least three integrated circuits in the plurality of integrated circuits, and a second substrate is also disposed between the plurality of integrated circuits, such that each integrated circuit contains at least one surface to which one of the first and second substrates is physically connected.11. The cooling system according to claim 1 wherein the electroosmotic is comprised of a plurality of layers.12. The cooling system according to claim 1 wherein the substrate further includes a plurality of vertical electrical interconnects.13. The cooling system according to claim 12 wherein the microchannel further includes vertical and horizontal fluid channels.14. The cooling system according to claim 12 wherein the plurality of vertical interconnects provide a portion of an electrical connection that electrically connects a plurality of temperature sensors to a temperature control circuit.15. The cooling system according to claim 1 wherein the substrate includes an opening through which another interaction is capable of impinging upon a portion of the heat emitting device.16. The cooling system according to claim 15 wherein the another interaction is light.17. The cooling system according to claim 15 wherein the another interaction is an electrical interaction.18. The cooling system according to claim 17 wherein the another electrical interaction is an electrical connection to a surface of the device to which the substrate is physically connected, and which electrical connection does not pass through any portion of the substrate.19. The cooling system according to claim 15 wherein the another interaction is one of pressure, sound, chemical, mechanical force, and an electromagnetic field.20. The cooling system according to claim 15 wherein the opening is vertical column having enclosed sidewalls.21. The cooling system according to claim 15 wherein the opening is created by a surface area of the substrate that contacts a corresponding surface area of the device being smaller than the corresponding surface area of the device.22. The cooling system according to claim 1 wherein a portion of the microchannel includes:an upper chamber; a lower chamber; and a plurality of subchannels disposed between the upper chamber and the lower chamber. 23. The cooling system according to claim 1 further including a pressure sensor.24. The cooling system according to claim 23 wherein the pressure sensor is: disposed within the substrate.25. The cooling system according to claim 23 wherein the pressure sensor is disposed in a fluid path between the substrate and the heat exchanger.26. The cooling system according to claim 25 further including another pressure sensor disposed in the fluid path between the high flow rate electroosmotic pump and the substrate.27. The cooling system according to claim 26 further including a temperature sensor disposed within the substrate.28. The cooling system according to claim 27 further including a temperature control circuit that receives as inputs signals from the pressure sensor, the another pressure sensor and the temperature sensor.29. The cooling system according to claim 28 wherein the temperature control circuit uses the signal from the pressure sensor, the another pressure sensor and the temperature sensor to control the high flow rate electroosmotic pump.30. The cooling system according to claim 1 further including a temperature sensor disposed within the substrate.31. The cooling system according to claim 30 further including a temperature control circuit that receives as inputs signals from the temperature sensor.32. The cooling system according to claim 1 further including a temperature sensor disposed in the loop at a location other than within the substrate.33. The cooling system according to claim 1 wherein the microchannel includes a portion containing a partial blocking structure to increase surface area contacting the fluid.34. The cooling system according to claim 33 wherein the partial blocking structure is comprised of a roughened portion of a microchannel wall.35. The cooling system according to claim 33 wherein the partial blocking structure is disposed within the microchannel.36. A thermal transfer apparatus connected to a semiconductor heat emitting device, the thermal transfer apparatus operating using a fluid having a liquid phase comprising:a substrate adapted to physically connect to the semiconductor heat emitting device; first and second microchannel fluid inlets disposed in the substrate; first and second microchannel fluid outlets disposed in the substrate; and first and second microchannels connected between the respective first and second fluid inlets and the first and second fluid outlets, the first and second microchannels thereby providing independent fluid flow paths wherein each of the independent fluid flow paths are arranged to provide a different cooling capability to each region of the substrate in response to a requirement for cooling each region of the heat emitting device. 37. The apparatus according to claim 36, further including:a heat exchanger configured to provide flow of the fluid therethrough and the transfer of thermal energy from the heat exchanger; a high flow rate electroosmotic pump, the electroosmotic pump creating the flow of the fluid; and at least one fluid connector configured so that the substrate, the heat exchanger and the electroosmotic pump operate together using one of an open-loop and a closed loop fluid flow. 38. The apparatus according to claim 37 further including a second a high flow rate electroosmotic pump, such that the first electroosmotic pump pumps the fluid through the first microchannel and the second electroosmotic pump pumps the fluid through the second microchannel.39. The apparatus according to claim 37 further including first and second temperature sensors respectively located in proximity to the first and second microchannels, such that the first temperature sensor detects thermal energy generated by the heat emitting device in proximity to the first temperature sensor and the second temperature sensor detects thermal energy generated by the heat emitting device in proximity to the second temperature sensor.40. The apparatus according to claim 39 further including a third temperature sensor.41. The apparatus according to claim 40 wherein the third temperature sensor is disposed in a location that it detects thermal energy generated by the heat emitting device in proximity to the first and second temperature sensors.42. The apparatus according to claim 40 wherein the third temperature sensor is disposed between the first and second microchannels.43. The apparatus according to claim 40 wherein the third temperature sensor is disposed such that the first and second microchannels are disposed between the heat emitting device and the third temperature sensor.44. The apparatus according to claim 39 further including a control circuit electrically connected to the first and second temperature sensors, the control circuit inputting signals from the first and second temperature sensors and providing a control signal for controlling the high flow rate electroosmotic pump.45. The apparatus according to claim 44 further including a second high flow rate electroosmotic pump, such that the first electroosmotic pump pumps the fluid through the first microchannel and the second electroosmotic pump pumps the fluid through the second microchannel and wherein the control circuit controls the first and second electroosmotic pumps, the control circuit being capable of independently controlling the pumping of fluid through each of the first and second electroosmotic pumps.46. The apparatus according to claim 37 further including:first and second temperature sensors disposed within the substrate, such that the first temperature sensor detects thermal energy generated by the heat emitting device in proximity to the first temperature sensor and the second temperature sensor detects thermal energy generated by the heat emitting device in proximity to the second temperature sensor; and a control circuit electrically connected to the first and second temperature sensors, the control circuit inputting signals from the first and second temperature sensors and providing a control signal for controlling the high flow rate electroosmotic pump. 47. The apparatus according to claim 46 wherein the control circuit operates to sense a predetermined condition.48. The apparatus according to claim 47 wherein upon sensing the condition, the control circuit causes more fluid to be pumped through the high flow rate electroosmotic pump per unit time for a period of time.49. The apparatus according to claim 47 wherein upon sensing the condition, the control circuit causes a reversal of the fluid flow for a period of time.50. The apparatus according to claim 47 wherein the control circuit detects a change in temperature over a period of time and correspondingly adjusts the fluid flow within the high flow rate electroosmotic pump to compensate for the change in temperature.51. The apparatus according to claim 36 further including first and second temperature sensors respectively located in proximity to the first and second microchannels, such that the first temperature sensor detects thermal energy generated by the heat emitting device in proximity to the first temperature sensor and the second temperature sensor detects thermal energy generated by the heat emitting device in proximity to the second temperature sensor.52. The apparatus according to claim 51 further including a third temperature sensor.53. The apparatus according to claim 52 wherein the third temperature sensor is disposed in a location that it detects thermal energy generated by the heat emitting device in proximity to the first and second temperature sensors.54. The apparatus according to claim 52 wherein the third temperature sensor is disposed between the first and second microchannels.55. The apparatus according to claim 52 wherein the third temperature sensor is disposed such that the first and second microchannels are disposed between the heat emitting device and the third temperature sensor.56. The apparatus according to claim 51 further including a control circuit electrically connected to the first and second temperature sensors, the control circuit inputting signals from the first and second temperature sensors and located within substrate.57. The apparatus according to claim 36, wherein the first and second microchannels each contain first and second microchannel portions that are disposed parallel and adjacent to one another such that fluid flow in the first microchannel occurs in a direction opposite the fluid flow in the second microchannel.58. The apparatus according to claim 36 wherein the first microchannel is at least partially disposed over a high thermal energy location of the heat emitting device and the second microchannel is disposed over another portion of the heat emitting device different from the high thermal energy location.59. The cooling system according to claim 36 wherein the substrate further includes a plurality of vertical electrical interconnects.60. The cooling system according to claim 59 wherein the plurality of vertical interconnects provide a portion of an electrical connection that electrically connects a plurality of temperature sensors to a temperature control circuit.61. The cooling system according to claim 36 wherein the substrate includes an opening through which another interaction is capable of impinging upon a portion of the heat emitting device.62. The cooling system according to claim 61 wherein the another interaction is light.63. The cooling system according to claim 61 wherein the another interaction is an electrical interaction.64. The cooling system according to claim 63 wherein the another electrical interaction is an electrical connection to a surface of the device to which the substrate is physically connected, and which electrical connection does not pass through any portion of the substrate.65. The cooling system according to claim to claim 61 wherein the another interaction is one of pressure, sound, chemical, mechanical force, and an electromagnetic field.66. The cooling system according to claim 61 wherein the opening is a vertical column having enclosed sidewalls.67. The cooling system according to claim 36 wherein a portion of at least one of the first and second microchannels includes:an upper chamber; a lower chamber; and a plurality of subchannels disposed between the upper chamber and the lower chamber. 68. A thermal transfer apparatus that operates using a fluid having a liquid phase comprising:a semiconductor heat emitting device, the semiconductor heat emitting device including a thermal control circuit; a substrate adapted to physically connect to the semiconductor heat emitting device; first and second microchannel fluid inlets disposed in either the substrate or the semiconductor heat emitting device; first and second microchannel fluid outlets disposed in either the substrate or the semiconductor heat emitting device; first and second microchannels disposed in either the substrate or the semiconductor heat emitting device connected between the respective first and second microchannel fluid inlets and the first and second fluid microchannel outlets, the first and second microchannels thereby providing independent fluid flow paths; and first and second temperature sensors disposed within the substrate and electrically connected to the thermal control circuit so that the signals from the first and second temperature sensors are input to the control circuit. 69. A method of placing a microchannel in a substrate so that the microchannel can transfer fluid having a liquid phase therethrough and dissipate thermal energy in a particular integrated circuit chip comprising the steps of:selecting the particular integrated circuit chip; using a computer, predicting locations and cross sectional shapes of the microchannel in the substrate that will sufficiently dissipate thermal energy with the fluid flowing therethrough, the step of predicting locations and cross sectional shapes of the microchannel including the step of iteratively computing fluid and solid temperature and pressure distributions for iteratively determined potential locations and potential cross sectional shapes of the microchannel in the substrate; and creating the microchannel at the predicted microchannel locations with the predicted cross sectional shapes in the substrate. 70. The method according to claim 69 wherein the step of iteratively computing fluid and solid temperature distributions uses empirical convection and fluid drag coefficients.71. The method according to claim 69 wherein the step of iteratively computing fluid and solid temperature distributions uses non-empirical solutions to energy and momentum equations in the microchannel.72. The method according to claim 69 wherein the step of iteratively computing fluid and solid temperature distributions uses empirical correlations for temperature and pressure that are dependent upon liquid and vapor properties of the fluid in the microchannel.73. The method according to claim 69 wherein the step of predicting considers:conduction in walls at potential locations and for potential cross sectional shapes of the microchannel; and convection in the fluid; when computing the temperature and pressure distribution. 74. An apparatus for use with a cooling system operating using a fluid having a liquid phase, the apparatus comprising:a heat emitting device, the heat emitting device including a heat emitting element, a high flow rate electroosmotic pump, the electroosmotic pump creating the flow of the fluid; and a substrate physically connected to the heat emitting device, with the heat emitting device and the substrate each containing at least a portion of a microchannel, thereby providing for the transfer of thermal energy from the heat emitting device to the substrate, and the further transfer of thermal energy to the fluid disposed within the microchannel, the microchannel configured to provide flow of the fluid therethrough. 75. The apparatus according to claim 74, further including:a heat exchanger configured to provide flow of the fluid therethrough and the transfer of thermal energy out of the fluid; and wherein the substrate, the heat exchanger, and the electroosmotic pump are configured to operate together to create one of a closed loop fluid flow and an open loop fluid flow. 76. The cooling system according to claim 74 wherein the substrate further includes a plurality of vertical electrical interconnects.77. The cooling system according to claim 76 wherein the plurality of vertical interconnects provide a portion of an electrical connection that electrically connects a plurality of temperature sensors to a temperature control circuit.78. The apparatus according to claim 77 wherein the temperature control circuit is part of the heat emitting device.79. The cooling system according to claim 74 wherein the substrate includes an opening through which another interaction is capable of impinging upon a portion of the heat emitting device.80. The cooling system according to claim 79 wherein the another interaction is light.81. The cooling system according to claim 79 wherein the another interaction is an electrical interaction.82. The cooling system according to claim 81 wherein the another electrical interaction is an electrical connection to a surface of the device to which the substrate is physically connected, and which electrical connection does not pass though any portion of the substrate.83. The cooling system according to claim 79 wherein the another interaction is one of pressure, sound, chemical, mechanical force, and an electromagnetic field.84. The system according to claim 79 wherein the opening is a vertical column having enclosed sidewalls.85. The cooling system according to claim 74 wherein a portion of the microchannel includes:an upper chamber; a lower chamber; and a plurality of subchannels disposed between the upper chamber and the lower chamber. 86. A cooling system for a heat emitting device, the cooling system operating using a fluid having a liquid phase, the cooling system comprising:a substrate including at least a portion of a microchannel disposed therein, the substrate adapted to physically connect to the heat emitting device, thereby providing for the transfer of thermal energy from the heat emitting device to the substrate, and the further transfer of thermal energy from the substrate to the fluid disposed within the microchannel, the microchannel configured to provide flow of the fluid therethrough; a heat exchanger configured to provide flow of the fluid therethrough and the transfer of thermal energy from the heat exchanger; a high flow rate electroosmotic pump, the electroosmotic pump creating the flow of the fluid; and wherein the substrate, the heat exchanger, and the electroosmotic pump are configured to operate together using an open loop fluid flow. 87. A method for providing for heat transfer away from a heat emitting device comprising:wing en a high flow rate electroosmotic pump to create a flow of a fluid having a liquid phase; directing the fluid flow to puss through a microchannel in a substrate with the substrate physically connected to the heat emitting device to thereby create a heated fluid; and further directing the heated fluid to pass through a heat exchanger to thereby create a cooled fluid; and causing the steps of using, directing and further directing to operate to create a closed loop fluid flow. 88. The method according to claim 87 wherein the step of directing directs the flow of fluid from the high flow rate electroosmotic pump into the microchannel of the substrate.89. The method according to claim 87 wherein the step of directing directs the flow of fluid from the high flow rate electroosmotic pump into the heat exchanger.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.